公开(公告)号：US20100050426A1

公开(公告)日：2010-03-04

申请号：US12613129

申请日：2009-11-05

申请人： Kouji SHIMIZU ,  Seiichi TERUI

发明人： Kouji SHIMIZU ,  Seiichi TERUI

IPC分类号： B23P19/00

CPC分类号： H05K13/0069 ,  H05K13/0061 ,  H05K13/021 ,  H05K13/08 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53191

摘要： Disclosed is a component mounting apparatus including two board transfer devices for respectively transferring circuit boards in respective directions parallel to each other and a component placing device provided with at least one component placing head for mounting the components on the boards positioned at predetermined mounting positions on the board transfer devices. Where two component placing heads are provided, they pick up components from two component supply devices and mount the picked-up components respectively on the boards loaded by the two board transfer devices. In this way, the component placing device mounts components simultaneously or alternately on two boards loaded respectively by the two board transfer devices. While one of the two board transfer devices is transferring a board thereon or while the one board transfer device is being adjusted to alter its transfer way width, one of the component placing heads for performing component mountings at the one board transfer device helps the other component placing head in performing component mountings at the other board transfer device. In a modified form, either one of the two transfer devices is used as bypass conveyor or return conveyor.

摘要翻译： 公开了一种部件安装装置，包括用于分别在相互平行的方向上传送电路板的电路板传送装置和设置有至少一个部件放置头的部件放置装置，用于将部件安装在位于 电路板传输设备。 在提供两个组件放置头的地方，它们从两个组件供应装置拾取组件，并将拾取组件分别安装在由两个板传送装置加载的板上。 以这种方式，组件放置装置将组件同时或交替地安装在分别由两个板传送装置加载的两个板上。 虽然两个电路板传送装置中的一个在其上传输电路板，或者当一个电路板传送装置被调整以改变其传送方式宽度时，用于在一个电路板传送装置执行部件安装的部件放置头之一有助于另一部件 将头部放置在另一个板传送装置上执行部件安装。 在改进形式中，两个传送装置中的任一个被用作旁路输送机或返回输送机。

公开(公告)号：US20100037456A1

公开(公告)日：2010-02-18

申请号：US12603884

申请日：2009-10-22

申请人： Hiroshi Hamashima

发明人： Hiroshi Hamashima

IPC分类号： B23P19/00

CPC分类号： H05K13/0409 ,  Y10T29/53174 ,  Y10T29/53191

摘要： A vacuum suction nozzle operable to reduce or eliminate electronic component blow off and electrostatic damage is disclosed. The vacuum suction nozzle comprises a ceramic body with a first surface at a side opposite to a second surface of the ceramic body. The ceramic body causes static electricity generated on the vacuum suction nozzle to be dissipated to an electronic component mounting device. Dissipation of the static electricity reduces or eliminates electrostatic damage to the electronic component and electrostatic repulsion induced blow off during suction by the vacuum suction nozzle.

摘要翻译： 公开了可操作以减少或消除电子部件吹脱和静电损坏的真空吸嘴。 真空吸嘴包括陶瓷体，陶瓷体在与陶瓷体的第二表面相对的一侧具有第一表面。 陶瓷体使真空吸嘴上产生的静电消散到电子部件安装装置。 静电消耗减少或消除了电子部件的静电损伤，并且通过真空吸嘴吸入时产生的静电斥力引起的吹出。

公开(公告)号：US07653454B2

公开(公告)日：2010-01-26

申请号：US11285102

申请日：2005-11-23

申请人： Hiroshi Satoh ,  Hiroshi Uchiyama ,  Hirofumi Obara

发明人： Hiroshi Satoh ,  Hiroshi Uchiyama ,  Hirofumi Obara

IPC分类号： G06F19/00

CPC分类号： H05K13/0417 ,  H05K13/08 ,  Y10T29/5193 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： A cassette control device by which high-speed processing can be expected even by using an arithmetical unit with current processing capability, even when the number of cassettes increases simultaneously with an increase in the number of nozzles which can suck electronic parts. There is provided storage unit (18) having storage regions in which programs for respective operation patterns of the cassettes (3-1 to 3-M) are set for each of the nozzles. An arithmetic unit (19) extracts a specific program required for driving in a specific operation pattern based on a command (17) inputted according to the content of packaging, from a specific region which is provided in the storage unit (18) to correspond to a specific nozzle to be used, and the arithmetic unit (19) operates the specific cassette using the specific program.

摘要翻译： 即使通过使用具有当前处理能力的算术单元也能够预期高速处理的盒式控制装置，即使随着可吸收电子部件的喷嘴数量的增加，盒的数量也同时增加。 具有存储单元（18）的存储单元（18）具有存储区域，在该存储区域中，针对每个喷嘴设置用于各个操作模式的程序（3-1至3-M）。 算术单元（19）从设置在存储单元（18）中的特定区域中，基于根据包装内容输入的命令（17）提取特定操作模式所需的特定程序，对应于 要使用的特定喷嘴，并且运算单元（19）使用特定程序操作特定盒。

公开(公告)号：US07603766B2

公开(公告)日：2009-10-20

申请号：US11360666

申请日：2006-02-24

申请人： Tosuke Kawada

发明人： Tosuke Kawada

IPC分类号： B23P19/00

CPC分类号： H05K13/0452 ,  H05K13/0404 ,  H05K13/0409 ,  H05K13/041 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An electronic-component holding apparatus and an electronic-component mounting system each of which assures that a nozzle head holding a plurality of suction nozzles is easily attached to, and detached from, a head holding member, are provided. A suction surface of a head holding member is held in close contact with a to-be-sucked surface of a revolver head so as to define a head-related negative-pressure chamber that holds the revolver head by utilizing suction. The revolver head is revolved, and moved upward and downward, with the head holding member.

摘要翻译： 一种电子部件保持装置和电子部件安装系统，其中，每个都确保容纳多个吸嘴的喷嘴头容易地安装到头部保持部件上并从头部保持部件拆下。 头部保持构件的吸附表面与旋转头的被吸收表面保持紧密接触，以便限定通过利用吸力来保持旋转头的头部相关的负压室。 旋转头旋转，并且头部保持构件向上和向下移动。

公开(公告)号：US07581310B2

公开(公告)日：2009-09-01

申请号：US11054625

申请日：2005-02-10

申请人： Yoshiharu Fukushima ,  Takahiro Nagata ,  Katsuyuki Seto

发明人： Yoshiharu Fukushima ,  Takahiro Nagata ,  Katsuyuki Seto

IPC分类号： B23P19/00

CPC分类号： H05K13/0452 ,  H05K13/0409 ,  Y10T29/49131 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191 ,  Y10T29/53261

摘要： The invention provides an electronic component mounting apparatus which can obtain a relative vertically moving stroke of a suction nozzle and is applicable to electronic components ranging from thin to thick ones. The electronic component mounting apparatus of the invention has a suction nozzle for picking an electronic component up from a plurality of component feeding units supplying the electronic component to a component pickup position and mounting the electronic component on a printed board, where a mounting head movable along a beam can move vertically by a head vertical movement device and the suction nozzle provided on the mounting head can move vertically by a nozzle vertical movement device 50.

摘要翻译： 本发明提供一种能够获得吸嘴的相对垂直移动行程的电子部件安装装置，并且可应用于从薄到厚的电子部件。 本发明的电子部件安装装置具有从多个向电子部件供给部件供给部件向组件拾取位置取出电子部件的吸嘴，将电子部件安装在印刷电路板上， 梁可以通过头垂直移动装置垂直移动，并且设置在安装头上的吸嘴可以通过喷嘴垂直移动装置50垂直移动。

公开(公告)号：US20090193650A1

公开(公告)日：2009-08-06

申请号：US12307020

申请日：2007-07-04

申请人： Yasuto Onitsuka

发明人： Yasuto Onitsuka

IPC分类号： H05K13/02 ,  H05K13/04

CPC分类号： H05K13/02 ,  H05K3/323 ,  H05K3/361 ,  Y10T29/49124 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/5313 ,  Y10T29/53174 ,  Y10T29/53191

摘要： There is provided an ACF attachment device that attaches ACFs to an electronic component for saving installation space, improving mounting tact time, and reducing costs in a liquid crystal driver mounting stage. A preliminary press bonding device (102) includes a component supply unit (401), an ACF attachment device (101), and a preliminary press bonding unit (305). The ACF attachment device (101) includes an ACF attachment unit (301) that simultaneously attaches the ACFs to two sides on a panel side and a PCB side of the electronic component, an ACF tape supply unit (302) that supplies an ACF tape, a nozzle (303) that suctions and holds the electronic component, and a separator collection unit (304) that collects separators bonded to the ACFs.

摘要翻译： 提供了ACF附接装置，其将ACF附接到电子部件，以节省安装空间，改善安装节拍时间，并降低液晶驱动器安装阶段的成本。 初步压接装置（102）包括部件供给单元（401），ACF附接装置（101）和预压接单元（305）。 ACF连接装置（101）包括：ACF连接单元（301），其将ACF同时连接到电子部件的面板侧和PCB侧的两侧，供给ACF带的ACF带供给单元（302） 抽吸和保持电子部件的喷嘴（303）和收集与ACF结合的分离器的分离器收集单元（304）。

公开(公告)号：US07549214B2

公开(公告)日：2009-06-23

申请号：US11514250

申请日：2006-09-01

申请人： TaiBoon Lee ,  ZiAn Wang ,  YongPing Gao ,  ZhenHua Liu

发明人： TaiBoon Lee ,  ZiAn Wang ,  YongPing Gao ,  ZhenHua Liu

IPC分类号： G11B5/127 ,  H04R31/00

CPC分类号： G11B5/102 ,  G11B5/3173 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903 ,  Y10T29/49041 ,  Y10T29/49798 ,  Y10T29/53191

摘要： Certain example embodiments relate to a method for bonding slider row bars for a photolithography process. A holding device having a sticky surface is formed. A plurality of slider row bars is provided, with each having a first surface for forming an air bearing surface and a second surface opposite the first surface. The slider row bars are secured to the holding device with their first surfaces facing the sticky surface so that the first surfaces of the slider row bars are aligned each other. The slider row bars are bonded together by an encapsulating glue. A carrier is provided, and the carrier is bonded to the second surfaces of the slider row bars. The holding device is removed. The example embodiments also can be used to manufacture sliders.

摘要翻译： 某些示例性实施例涉及用于粘合用于光刻工艺的滑块排条的方法。 形成具有粘性表面的保持装置。 提供了多个滑块排条，每个具有用于形成空气轴承表面的第一表面和与第一表面相对的第二表面。 滑块排条被固定到保持装置上，其第一表面面向粘性表面，使得滑块排条的第一表面彼此对准。 滑块排条通过胶囊胶粘在一起。 提供载体，并且载体结合到滑块排条的第二表面。 取下保持装置。 示例性实施例也可用于制造滑块。

公开(公告)号：US20090153169A1

公开(公告)日：2009-06-18

申请号：US12130781

申请日：2008-05-30

申请人： Emad SOUBH ,  Doug McCARTIN ,  Jeremy WOOLDRIDGE ,  Steve KOOPMAN

发明人： Emad SOUBH ,  Doug McCARTIN ,  Jeremy WOOLDRIDGE ,  Steve KOOPMAN

IPC分类号： G01R31/02

CPC分类号： G01R1/06733 ,  G01R1/06738 ,  Y10S439/94 ,  Y10T29/53191

摘要： A probe is provided for testing the electrical characteristics of a device. The probe includes a housing, a plurality of cables, a circuit board located within the housing, and a field-replaceable probe tip. The probe tip includes an array of contacts. Each of the plurality of cables is connected to a corresponding contact. The probe includes a retractable shroud that retracts as the probe is connected to the device. The contacts have bifurcated tips.

摘要翻译： 提供了一个用于测试设备的电气特性的探头。 探针包括壳体，多根电缆，位于壳体内的电路板以及现场可更换的探头。 探针尖端包括一组触点。 多个电缆中的每一个连接到相应的触点。 探头包括一个可伸缩护罩，当探头连接到设备时，护罩将缩回。 联系人有分叉的提示。

公开(公告)号：US07546941B2

公开(公告)日：2009-06-16

申请号：US11746686

申请日：2007-05-10

申请人： Hai Ju No ,  Hee Sung Kim ,  Jung Bum Woo ,  Sang Nam Go ,  Tae Hyung Kim

发明人： Hai Ju No ,  Hee Sung Kim ,  Jung Bum Woo ,  Sang Nam Go ,  Tae Hyung Kim

IPC分类号： B23K20/08

CPC分类号： H01R43/0256 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73215 ,  H01L2924/15311 ,  H01L2924/181 ,  H01R43/0235 ,  H05K3/3478 ,  H05K2203/0195 ,  H05K2203/041 ,  H05K2203/082 ,  Y10T29/49222 ,  Y10T29/53191 ,  Y10T29/53204 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A ball attaching apparatus for respectively attaching solder balls onto a plurality of ball lands of a material which has mold caps formed between the ball lands. The apparatus includes an indexer on which the material is seated and fixed; a holder located above the indexer such that it can be raised and lowered; an attachment plate installed on a lower surface of the holder, having projections at positions corresponding to the mold caps of the material, and defined with grooves at positions corresponding to the ball lands of the material, in which the solder balls are placed; and eject pins arranged in the respective grooves of the attachment plate for conveying and dropping the solder balls through introduction and removal of vacuum.

摘要翻译： 一种球附着装置，用于将焊球分别安装在具有形成在球台之间的模具帽的材料的多个球台上。 该装置包括一个分度器，材料就座并固定在该分度器上; 位于分度器上方的支架，使其能够升高和降低; 安装在所述保持器的下表面上的安装板，在与所述材料的所述模具盖相对应的位置处具有突出部，并且在与所述材料的所述球焊台相对应的位置处限定有凹槽，所述焊接球放置在所述焊盘中; 以及布置在附接板的相应凹槽中的销，用于通过引入和去除真空来输送和滴落焊球。

公开(公告)号：US20090133247A1

公开(公告)日：2009-05-28

申请号：US12362445

申请日：2009-01-29

申请人： John G. Meyers

发明人： John G. Meyers

IPC分类号： H05K13/00 ,  H05K13/04 ,  G06F19/00 ,  H01L21/67

CPC分类号： H01L25/50 ,  H01L23/5387 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2225/06579 ,  Y10T29/5313 ,  Y10T29/53178 ,  Y10T29/53191

摘要： An apparatus for packaging a tape substrate is provided. The apparatus includes a plurality of robotic arms, a plurality of clamping elements attached to the robotic arms, a memory having a program stored therein, and a control module coupled to the memory to execute the program to perform a packaging process. The packaging process includes clamping a plurality of segments of a tape substrate to the clamping elements, encapsulating a first chip to a first side of a tape substrate to form a first capsule in a first segment, and securing a second segment of the tape substrate adjacent the first segment to a second clamping element. The packing process also includes moving the robotic arms relative to one another to stack the second segment over the first capsule. The first clamping element and second clamping element move independently of each other.

摘要翻译： 提供了一种用于包装带基材的设备。 该装置包括多个机器人臂，多个夹持元件，其连接到机器人手臂，存储有存储在其中的程序的存储器，以及耦合到存储器以执行程序以执行封装处理的控制模块。 封装过程包括将多个带状基片段夹持到夹紧元件上，将第一芯片封装在带基片的第一侧上以在第一段中形成第一胶囊，并将带基片的第二段相邻 第一段到第二夹紧元件。 包装过程还包括相对于彼此移动机器人手臂以将第二片段堆叠在第一胶囊上。 第一夹紧元件和第二夹紧元件彼此独立地移动。