公开(公告)号：US20050090192A1

公开(公告)日：2005-04-28

申请号：US10988585

申请日：2004-11-16

申请人： Georges Bancon ,  Jean-Marie Albrecht ,  Jean-Jacques Bris ,  Nicolas Faures

发明人： Georges Bancon ,  Jean-Marie Albrecht ,  Jean-Jacques Bris ,  Nicolas Faures

IPC分类号： B24D5/12 ,  B24D18/00 ,  B24B5/00

CPC分类号： B24D5/12 ,  B24D18/0009

摘要： An abrasive product is formed, in a blank making machine, into a layer forming a blank including at least abrasive grains. The layer is then set atop on at least another blank making machine, an assembly line along which successive posts are provided at the site whereof the elements designed to form the grinder are set on top of one another to form a stack, a station for heating the stack, and at least a pressing machine to compress the heated stack. An embodiment need not include the heating station. The grinder is a thin grinder that can include at least a reinforcing layer pierced with a hole wherein the abrasive product is distributed. The process is useful for making grinders for parting, machining, or pumicing.

摘要翻译： 研磨产品在造坯机中形成形成至少包括磨料颗粒的坯料的层。 然后将该层设置在至少另一制坯机上的装配线，沿着该装配线设置在设计成形成研磨机的元件的位置处的连续柱，以形成堆叠，加热站 并且至少一个压制机来压缩加热的堆叠。 实施例不需要包括加热站。 研磨机是一种薄的研磨机，其可以包括至少一个穿孔的增强层，其中磨料产品被分配。 该工艺可用于制造分切机，加工机或打浆机的磨床。

公开(公告)号：US20050070214A1

公开(公告)日：2005-03-31

申请号：US10671841

申请日：2003-09-25

申请人： Dave Marquardt ,  Sooyun Joh ,  David Cohen ,  Edward McInerney

发明人： Dave Marquardt ,  Sooyun Joh ,  David Cohen ,  Edward McInerney

IPC分类号： B24B37/04 ,  B24B57/02 ,  B24D13/14 ,  B24B5/00

CPC分类号： B24B37/26 ,  B24B57/02 ,  B24D13/147

摘要： An assembly for a chemical-mechanical polishing process includes a platen having an outer edge, a top surface, and at least one inlet for introducing fluid to the top surface; a manifold system, entrenched in the top surface and in communication with the at least one inlet, for channeling the fluid about the top surface; a polishing pad having a top pad surface, and a plurality of fluid delivery through-holes for introducing the fluid from the manifold system to the top pad surface; and a fluid distribution system, entrenched in the top pad surface and in communication with the through-holes, for substantially uniformly distributing the fluid about the top pad surface. The fluid distribution system includes a set of intersecting first grooves defining an array of lands, each of the first grooves having a first cross sectional area. The fluid distribution system also includes a plurality of second grooves disposed within each of the lands and communicating with the first grooves, each of the second grooves having a second cross sectional area that is smaller than the first cross sectional area.

公开(公告)号：US20050059328A1

公开(公告)日：2005-03-17

申请号：US10852366

申请日：2004-05-24

申请人： Michael Madsen ,  Svend Nielsen

发明人： Michael Madsen ,  Svend Nielsen

IPC分类号： B24D15/02 ,  B24B5/00

CPC分类号： B24D15/02

摘要： There is described a hand-held grinding tool with a replaceable grinding-plate part, preferably comprising a steel plate, where on a grinding surface there is applied an abrasive coating in the form of grains of hard metal, which is preferably secured by soldering, the hand tool further comprising a handling part and clamping means for clamping the grinding-plate part to the handling part in a replaceable manner.

摘要翻译： 描述了一种具有可替换的研磨板部分的手持研磨工具，优选地包括钢板，其中在研磨表面上施加硬质金属颗粒形式的磨料涂层，其优选通过焊接固定， 所述手动工具还包括处理部分和用于以可更换的方式将所述研磨板部分夹持到所述处理部分的夹紧装置。

公开(公告)号：US20050048882A1

公开(公告)日：2005-03-03

申请号：US10964624

申请日：2004-10-15

申请人： Etsuo Kiuchi ,  Toshiyuki Hayashi

发明人： Etsuo Kiuchi ,  Toshiyuki Hayashi

IPC分类号： B24B37/015 ,  B24B37/04 ,  B24B37/12 ,  B24B37/14 ,  B24B37/30 ,  B24B41/04 ,  B24B41/06 ,  B24B49/14 ,  B24B55/02 ,  B24B57/02 ,  B24B5/00

CPC分类号： B24B55/02 ,  B24B37/015 ,  B24B37/042 ,  B24B37/12 ,  B24B37/14 ,  B24B37/30 ,  B24B41/042 ,  B24B41/06 ,  B24B49/14 ,  B24B57/02

摘要： There are provided a polishing apparatus and a polishing method capable of performing polishing a work (such as a wafer) with high efficiency and high precision, a novel work holding plate effectively holding a work and an adhering method for a work capable of adhering the work on the work holding plate with high precision. The polishing apparatus comprises: a polishing table(29); and a work holding plate(38), wherein a work held on the work holding plate(38) is polished supplying a polishing agent solution(41) in the apparatus, and in polishing action, an amount of deformation of the polishing table(29) in a direction normal to an upper surface thereof with respect to the upper surface thereof and/or an amount of deformation of the work holding plate(38) in a direction normal to a work holding surface thereof is restricted to 100 m or less by forming the polishing table(29) in one-piece, contriving flow paths of cooling water and others.

摘要翻译： 提供了能够以高效率和高精度进行工件（例如晶片）的抛光装置和研磨方法，能够有效地保持作业的新型工作保持板和能够粘附工件的工件的粘合方法 在工作夹具上高精度。 抛光装置包括：抛光台（29）; 以及工件保持板（38），其中在所述设备中抛光保持在所述工件保持板（38）上的工件，供给抛光剂溶液（41），并且在抛光动作中，抛光台（29）的变形量 ）和/或工件保持板（38）在垂直于其工件保持表面的方向上的变形量限制在100μm以下，通过 将抛光台（29）形成为冷却水等的一体成型流动路径。

公开(公告)号：US20050048881A1

公开(公告)日：2005-03-03

申请号：US10653474

申请日：2003-09-02

申请人： David Wolff ,  James O'Donnell ,  Richard Hunter

发明人： David Wolff ,  James O'Donnell ,  Richard Hunter

IPC分类号： B24B3/46 ,  B24B5/00 ,  B24B29/00

CPC分类号： B24B3/46

摘要： The present invention relates to an apparatus for sharpening a circular blade. The sharpening apparatus is adapted to be positioned adjacent a power-driven sharpening wheel at an angle. The sharpening apparatus includes an angularly adjustable tool holder for angularly positioning the circular blade against the power-driven sharpening wheel. The sharpening apparatus of the present invention also includes a blade holder that quickly and easily locks the circular blade into place for sharpening and releases the blade after sharpening is complete. The present invention provides a reasonably safe and efficient sharpening apparatus for circular blades that provides uniform, high quality sharpening of one-sided and two-sided blades of varying circumferences.

摘要翻译： 本发明涉及一种用于磨削圆形刀片的​​设备。 锐化装置适于以一定的角度位于动力驱动的磨刀轮附近。 锐化装置包括角度可调节的刀架，用于将圆形刀片角度地定位在动力驱动的磨刀轮上。 本发明的磨边装置还包括刀片保持器，其能够快速且容易地将圆形刀片锁定到位，用于磨削并且在磨削完成之后释放刀片。 本发明提供了一种用于圆形刀片的​​相当安全和有效的锐化装置，其提供具有不同周长的单面和双面刀片的均匀，高质量的磨削。

公开(公告)号：US20050032381A1

公开(公告)日：2005-02-10

申请号：US10939750

申请日：2004-09-13

申请人： Yongsik Moon ,  David Mai ,  Kapila Wijekoon ,  Rajeev Bajaj ,  Rahul Surana ,  Yongqi Hu ,  Tony Kaushal ,  Shijian Li ,  Jui-Lung Li ,  Shi-Ping Wang ,  Gary Lam ,  Fred Redeker

发明人： Yongsik Moon ,  David Mai ,  Kapila Wijekoon ,  Rajeev Bajaj ,  Rahul Surana ,  Yongqi Hu ,  Tony Kaushal ,  Shijian Li ,  Jui-Lung Li ,  Shi-Ping Wang ,  Gary Lam ,  Fred Redeker

IPC分类号： B24B1/00 ,  B24B5/00 ,  B24B29/00 ,  B24B37/04 ,  C23F1/00 ,  H01L21/306 ,  H01L21/321 ,  H01L21/461 ,  H01L21/4763 ,  H01L21/768

CPC分类号： H01L21/3212 ,  B24B37/042 ,  B24B37/30 ,  H01L21/7684

摘要： Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material formed thereon in a polishing apparatus having one or more rotational carrier heads and one or more rotatable platens, wherein the carrier head comprises a retaining ring and a membrane for securing a substrate and the platen has a polishing article disposed thereon, contacting the substrate surface and the polishing article to each other at a retaining ring contact pressure of about 0.4 psi or greater than a membrane pressure, and polishing the substrate to remove conductive material.

公开(公告)号：US06840845B2

公开(公告)日：2005-01-11

申请号：US10295887

申请日：2002-11-18

申请人： Minoru Numoto

发明人： Minoru Numoto

IPC分类号： B24B37/005 ,  B24B37/04 ,  B24B37/30 ,  B24B49/16 ,  H01L21/304 ,  B24B5/00

CPC分类号： B24B37/30 ,  B24B37/32 ,  B24B49/16

摘要： The wafer polishing apparatus enables the control of proper polishing pressure, so that the quality of wafers can be maintained high. A wafer holding head is composed of a carrier for pressing the wafer against a polishing pad, a retainer ring at the circumference of the carrier, and a holding head body. The holding head body includes a carrier pressing device having an air bag of which pressing surface area is 50% or smaller of the area of the wafer, and the pressing force from the carrier pressing device is transmitted to the carrier.

摘要翻译： 晶片抛光装置能够控制适当的抛光压力，从而可以保持晶片的质量。 晶片保持头由用于将晶片压靠在抛光垫上的载体，在载体的圆周处的保持环和保持头本体构成。 保持头本体包括具有其表面积为晶片面积的50％以下的气囊的载体加压装置，并且来自载体加压装置的按压力被传递到载体。

公开(公告)号：US6393242B2

公开(公告)日：2002-05-21

申请号：US84922501

申请日：2001-05-07

申请人： BRIDGESTONE CORP

发明人： MIYASHITA MORIHIRO ,  HAMAGUCHI YUUICHI

IPC分类号： B21C37/30 ,  B24B5/00 ,  F16L9/02 ,  G03G5/10 ,  G03G15/08 ,  G03G15/09 ,  G03G15/20 ,  G03G21/00

CPC分类号： G03G15/0921 ,  B21C37/30 ,  B24B5/00 ,  Y10T29/49544 ,  Y10T428/12993 ,  Y10T428/13

摘要： A metal pipe excellent in dimensional accuracy, which is suitably used for a development sleeve, a fixing roller, or a photosensitive drum for electrophotographic apparatuses or electrostatic recording apparatuses such as copying machines or printers, or a base body thereof. The metal pipe is produced by cutting a long-sized metal pipe body into a specific length, to obtain a raw pipe, and adjusting the surface state and the dimensional accuracy of the raw pipe by cutting and polishing the outer peripheral surface of the raw pipe, wherein the raw pipe has an inner stress of 20 N/mm2 or less.

摘要翻译： 尺寸精度优良的金属管，其适用于显影套筒，定影辊或电子照相设备的感光鼓或复印机或打印机的静电记录装置或其基体。 金属管通过将长尺寸的金属管体切割成特定长度而制造，以获得原料管，并且通过对原料管的外周表面进行切割和抛光来调节原料管的表面状态和尺寸精度 其中，所述原料管的内应力为20N / mm 2以下。

公开(公告)号：US6149506A

公开(公告)日：2000-11-21

申请号：US168057

申请日：1998-10-07

申请人： Wayne O. Duescher

发明人： Wayne O. Duescher

IPC分类号： B24B1/00 ,  B24B5/00 ,  B24B7/00 ,  B24B9/00 ,  B24B37/00

CPC分类号： B24B37/00 ,  B24B1/00 ,  B24B5/00 ,  B24B7/00 ,  B24B9/00

摘要： Lapping or polishing at high speeds with fine abrasive particles offer significant advantages in the speed of lapping, savings of time in lapping, and smoothness in the finished articles. An improved lapping system comprises a lapper platen system comprising: a) a frame (e.g., having a total weight of at least 200 kg) supporting a work piece holder b) a rotatable platen having an abrasive surface comprising an abrasive sheet secured to said platen, said platen being capable of providing surface feet per minute speeds on in outer edge of at least about 1,500 surface feet per minute; and c) a work piece holder which is movable on said frame.

摘要翻译： 用高精度研磨颗粒高速研磨或抛光提供研磨速度，研磨时间节省以及成品中平滑度方面的显着优点。 一种改进的研磨系统，包括一个包括：a）支撑工件保持器的框架（例如总重量至少为200kg）; b）具有研磨表面的可旋转压板，该研磨表面包括固定到所述压板 ，所述压板能够以每分钟至少约1,500个表面英尺的外边缘提供每分钟速度的表面脚; 以及c）可在所述框架上移动的工件支架。

公开(公告)号：US6149503A

公开(公告)日：2000-11-21

申请号：US973417

申请日：1997-11-14

申请人： Michael Laycock

发明人： Michael Laycock

IPC分类号： B24B5/42 ,  B24B41/06 ,  B24B1/00 ,  B24B5/00

CPC分类号： B24B41/067 ,  B24B5/421

摘要： A method of supporting a workpiece having journal and eccentric regions, in a grinding machine for grinding the eccentric regions thereof, is described which involves mounting the workpiece in a headstock of the grinding machine, providing a coupling between the workpiece and a rotary drive mechanism for rotating the workpiece about its main axis and fitting around at least one remote journal region of the workpiece a pair of members which form a journal bearing complementary to the said region, and fixing the lower of the two members to the machine, thereby providing support for the workpiece at the said remote position. The method is particularly relevant to the grinding of crankpins of a crankshaft. A grinding machine for grinding the crankpins of a crankshaft workpiece comprises headstock means mounted on the machine bed, a grinding wheel mounted on a wheelhead assembly, drive means for moving the wheelhead towards and away from a workpiece when fitted to the headstock, drive means for rotating a workpiece when mounted in the headstock, and two part cradle means mounted in the machine at least one part of which presents at least an upwardly directed curved support surface for engaging the underside of a journal bearing region of a crankshaft workpiece when fitted to the headstock.

摘要翻译： PCT No.PCT / GB96 / 01494 Sec。 371日期：1997年11月14日 102（e）1997年11月14日PCT PCT 1996年6月19日PCT公布。 出版物WO97 / 00755 日本1997年1月9日描述了一种用于在用于研磨其偏心区域的研磨机中支撑具有轴颈和偏心区域的工件的方法，其涉及将工件安装在研磨机的主轴箱中，从而提供工件和 旋转驱动机构，用于使工件围绕其主轴旋转并且围绕工件的至少一个远程轴颈区域配合成一对构件，所述一对构件形成与所述区域互补的轴颈轴承，并且将两个构件的下部固定到机器 从而在所述远程位置处为工件提供支撑。 该方法与曲轴曲轴销的磨削特别相关。 用于研磨曲轴工件的曲柄销的磨床包括安装在机床上的主轴箱装置，安装在砂轮组件上的砂轮，用于当装配到主轴箱时将砂轮朝向和离开工件移动的驱动装置，用于 当安装在主轴箱中时旋转工件，以及安装在机器中的两个部件支架装置，其中至少一部分至少部分具有至少一个向上指向的弯曲支撑表面，用于在曲轴工件的轴颈轴承区域的下侧装配到 头架