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31 条记录 (耗时 0.035 秒)

    Method of chemical mechanical polishing with high throughput and low dishing
    2.
    发明申请
    Method of chemical mechanical polishing with high throughput and low dishing 失效
    化学机械抛光方法，具有高通量和低凹陷

    公开(公告)号：US20050026442A1

    公开(公告)日：2005-02-03

    申请号：US10924417

    申请日：2004-08-24

    申请人： Shijian Li ,  Jui-Lung Li ,  Shi-Ping Wang ,  Gary Lam ,  David Mai ,  Fred Redeker

    发明人： Shijian Li ,  Jui-Lung Li ,  Shi-Ping Wang ,  Gary Lam ,  David Mai ,  Fred Redeker

    IPC分类号： B24B1/00 ,  B24B5/00 ,  B24B29/00 ,  B24B37/04 ,  C23F1/00 ,  H01L21/306 ,  H01L21/321 ,  H01L21/461 ,  H01L21/4763 ,  H01L21/768 ,  H01L21/302 ,  H01L21/44

    CPC分类号： H01L21/3212 ,  B24B37/042 ,  B24B37/30 ,  H01L21/7684

    摘要： Method and apparatus are provided for polishing conductive materials with low dishing of features and reduced or minimal remaining residues. In one aspect, a method is provided for processing a substrate by polishing the substrate to remove bulk conductive material and polishing the substrate by a ratio of carrier head rotational speed to platen rotational speed of between about 2:1 and about 3:1 to remove residual conductive material. In another aspect, a method is provided for processing a substrate including polishing the substrate at a first relative linear velocity between about 600 mm/second and about 1900 mm/second at the center of the substrate, and polishing the substrate at a second relative linear velocity between about 100 mm/second and about 550 mm/second at the center of the substrate.

    摘要翻译： 提供了用于抛光导电材料的方法和装置，其具有低的特征凹陷和减少的或最小的剩余残余物。 在一个方面，提供了一种通过抛光衬底以去除体导电材料并通过载体头部旋转速度与平板旋转速度的比率在约2:1至约3:1之间来抛光衬底来进行衬底处理的方法，以去除 残留导电材料。 在另一方面，提供了一种用于处理衬底的方法，包括在衬底的中心以约600mm /秒至约1900mm /秒的第一相对线速度抛光衬底，并以第二相对线性 在衬底的中心处的速度在约100mm /秒到约550mm /秒之间。

    Vibration damping in chemical mechanical polishing system
    3.
    发明申请
    Vibration damping in chemical mechanical polishing system 失效
    化学机械抛光系统中的振动阻尼

    公开(公告)号：US20060148387A1

    公开(公告)日：2006-07-06

    申请号：US11333992

    申请日：2006-01-17

    申请人： Hung Chen ,  John White ,  Shijian Li ,  Fred Redeker ,  Ramin Emami

    发明人： Hung Chen ,  John White ,  Shijian Li ,  Fred Redeker ,  Ramin Emami

    IPC分类号： B24B29/00

    CPC分类号： B24B37/30 ,  B24B37/12 ,  B24B37/32 ,  B24B41/007

    摘要： A carrier head for chemical mechanical polishing, includes a base, a support structure attached to the base having a surface for contacting a substrate, and a retaining structure attached to the base to prevent the substrate from moving along the surface. The retaining structure and the surface define a cavity for receiving the substrate. The retaining structure includes an upper portion in contact with the base, a lower portion, and a vibration damper separating the upper portion and the lower portion. The vibration damper, the vibration damper includes a material that does not rebound to its original shape when subjected to a deformation.

    摘要翻译： 用于化学机械抛光的载体头包括基底，附着到具有用于接触基底的表面的基部的支撑结构以及附接到基部的保持结构，以防止基底沿着表面移动。 保持结构和表面限定用于接收基底的空腔。 保持结构包括与基座接触的上部，下部和分隔上部和下部的振动阻尼器。 振动阻尼器，减震器包括当经受变形时不能反弹到其原始形状的材料。

    Electroplating head and method for operating the same
    8.
    发明申请
    Electroplating head and method for operating the same 有权
    电镀头及其操作方法

    公开(公告)号：US20050284748A1

    公开(公告)日：2005-12-29

    申请号：US10879396

    申请日：2004-06-28

    申请人： Yezdi Dordi ,  Bob Maraschin ,  John Boyd ,  Fred Redeker

    发明人： Yezdi Dordi ,  Bob Maraschin ,  John Boyd ,  Fred Redeker

    IPC分类号： C25D17/00 ,  C25D17/14

    CPC分类号： C25D5/026 ,  C25D5/02 ,  C25D5/06 ,  C25D17/14

    摘要： An electroplating head including a chamber having a fluid entrance and a fluid exit is provided. The chamber is configured to contain a flow of electroplating solution from the fluid entrance to the fluid exit. The electroplating head also includes an anode disposed within the chamber. The anode is configured to be electrically connected to a power supply. The electroplating head further includes a porous resistive material disposed at the fluid exit such that the flow of electroplating solution is required to traverse through the porous resistive material.

    摘要翻译： 提供一种包括具有流体入口和流体出口的室的电镀头。 腔室被配置成包含从流体入口到流体出口的电镀溶液流。 电镀头还包括设置在室内的阳极。 阳极被配置为电连接到电源。 电镀头还包括设置在流体出口处的多孔电阻材料，使得电镀溶液的流动需要穿过多孔电阻材料。

    Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition
    9.
    发明申请
    Method and apparatus to form a planarized Cu interconnect layer using electroless membrane deposition 审中-公开

    公开(公告)号：US20050042861A1

    公开(公告)日：2005-02-24

    申请号：US10946411

    申请日：2004-09-20

    申请人： Fred Redeker ,  John Boyd

    发明人： Fred Redeker ,  John Boyd

    IPC分类号： H01L21/288 ,  H01L21/768 ,  H01L21/4763 ,  H01L31/062 ,  H01L31/113

    CPC分类号： H01L21/288 ,  H01L21/7684

    摘要： A planarized conductive material is formed over a substrate including narrow and wide features. The conductive material is formed through a succession of deposition processes. A first deposition process forms a first layer of the conductive material that fills the narrow features and at least partially fills the wide features. A second deposition process forms a second layer of the conductive material within cavities in the first layer. A flexible material can reduce a thickness of the first layer above the substrate while delivering a solution to the cavities to form the second layer therein. The flexible material can be a porous membrane attached to a pressurizable reservoir filled with the solution. The flexible material can also be a poromeric material wetted with the solution.

    SEMICONDUCTOR SUBSTRATE CLEANING SYSTEM
    10.
    发明申请
    SEMICONDUCTOR SUBSTRATE CLEANING SYSTEM 审中-公开
    半导体衬底清洗系统

    公开(公告)号：US20080041422A1

    公开(公告)日：2008-02-21

    申请号：US11877648

    申请日：2007-10-23

    申请人： Brian Brown ,  Anwar Husain ,  Fred Redeker

    发明人： Brian Brown ,  Anwar Husain ,  Fred Redeker

    IPC分类号： B08B7/04 ,  B08B3/00

    CPC分类号： H01L21/67057 ,  B08B1/04 ,  B08B3/08 ,  B08B3/12 ,  H01L21/02052 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67051 ,  H01L21/67751 ,  H01L21/67757 ,  H01L21/68 ,  Y10S134/902

    摘要： A modular semiconductor substrate cleaning system is provided that processes vertically oriented semiconductor substrates. The system features a plurality of cleaning modules that may include a megasonic tank-type cleaner followed by a scrubber. An input module may receive a horizontally oriented substrate and rotate the substrate to a vertical orientation, and an output module may receive a vertically oriented substrate and rotate the substrate to a horizontal orientation. Each of the modules (input, cleaning and output) has a substrate support and may be positioned such that the substrate supports of adjacent modules are equally spaced. The modules are coupled by an overhead transfer mechanism having a plurality of substrate handlers spaced the same distance (X) as the substrate supports of the modules therebelow. The transfer mechanism indexes forward and backward the distance X to simultaneously transport semiconductor substrates through the cleaning system, lifting and lowering substrates from the desired modules wafer rotation/orientation sensors, an input module cart for transporting wafers between a substrate handler of a previous tool (such as a semiconductor substrate polisher) and a substrate handler of the cleaning system are also included.

    摘要翻译： 提供了一种处理垂直取向的半导体衬底的模块化半导体衬底清洁系统。 该系统具有多个清洁模块，其可以包括紧随着洗涤器的兆声波槽式清洁器。 输入模块可以接收水平定向的基板并将基板旋转到垂直取向，并且输出模块可以接收垂直取向的基板并将基板旋转到水平取向。 每个模块（输入，清洁和输出）具有基板支撑件并且可以被定位成使得相邻模块的基板支撑件相等间隔。 模块通过具有多个衬底处理器的架空传送机构耦合，所述多个衬底处理器与其下面的模块的衬底支撑件间隔开相同的距离（X）。 传送机构向前和向后指示距离X，以同时传送半导体衬底通过清洁系统，从期望的模块提升和降低衬底晶片旋转/取向传感器，用于在先前工具的衬底处理器之间传送晶片的输入模块推车（ 例如半导体衬底抛光机）和清洁系统的衬底处理器也被包括在内。