公开(公告)号：US6117001A

公开(公告)日：2000-09-12

申请号：US156705

申请日：1998-09-18

申请人： Toshiyuki Enomoto ,  Hiroyuki Endo ,  Yutaka Shimazaki ,  Yasuhiro Tani ,  Yoshiyuki Sato

发明人： Toshiyuki Enomoto ,  Hiroyuki Endo ,  Yutaka Shimazaki ,  Yasuhiro Tani ,  Yoshiyuki Sato

IPC分类号： B24B1/00 ,  B24B53/00 ,  B24D3/02 ,  B24D3/34 ,  B24D11/00

CPC分类号： B24B53/001

摘要： An electrolytic in-process dressing method, an electrolytic in-process dressing grinding apparatus, and an electrolytic in-process dressing grindstone, for grinding workpiece as the grindstone is being subjected to electrolytic in-process dressing, are provided, in which the grindstone is made of abrasive grains and a binding material which is capable of forming a uniform and fine passive layer at the grinding surface thereof and also capable of preventing excessive elusion of the binding material, thereby preventing the formation of chips at the ground surface in the course of grinding operation.

摘要翻译： 提供了一种电解过程中的修整方法，电解的在线修整研磨装置和电解的在线修整磨石，用于研磨作为磨石的工件进行电解过程中的修整，其中磨石是 由磨料颗粒和粘合材料制成，其能够在其研磨表面形成均匀且精细的钝化层，并且还能够防止粘结材料的过度剥离，从而防止在地面过程中形成碎屑 磨削操作。

公开(公告)号：US6077155A

公开(公告)日：2000-06-20

申请号：US909053

申请日：1997-08-11

申请人： Hideaki Hayakawa ,  Takatoshi Saito ,  Yoshiaki Komuro ,  Shuzo Sato

发明人： Hideaki Hayakawa ,  Takatoshi Saito ,  Yoshiaki Komuro ,  Shuzo Sato

IPC分类号： B24B37/005 ,  B24B37/30 ,  B24B37/34 ,  B24B41/06 ,  B24B49/16 ,  B24B49/18 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/304

CPC分类号： B24B37/345 ,  B24B37/30 ,  B24B41/061 ,  B24B49/16 ,  B24B49/18 ,  B24B53/00 ,  B24B53/017

摘要： Disclosed herein is a polishing device including a polishing plate having an upper surface on which a polishing pad is attached, a polishing head having a lower surface opposed to an upper surface of the polishing pad on the polishing plate, for holding a substrate to be polished on the lower surface, and a pressure source for applying a polishing pressure to the polishing head, whereby the substrate held by the polishing head is pressed against the upper surface of the polishing pad under the polishing pressure applied from the pressure source to perform polishing of the substrate. The polishing head is provided with a contact pressure adjusting mechanism capable of adjusting an in-plane contact pressure of the substrate against the upper surface of the polishing pad on the polishing plate at every area of the substrate. Accordingly, the uniformity and the planarity in the plane of the substrate surface to be polished can be improved with a high throughput.

摘要翻译： 本发明公开了一种抛光装置，包括：抛光板，其上表面上安装有抛光垫;抛光头，其具有与抛光板上的抛光垫的上表面相对的下表面，用于保持待抛光的基板 以及用于对抛光头施加抛光压力的压力源，由此由抛光头保持的基板在从压力源施加的研磨压力下被压靠在抛光垫的上表面上，以进行抛光 底物。 抛光头设置有接触压力调节机构，该接触压力调节机构能够在衬底的每个区域处调整衬底的面内接触压力与抛光板上的抛光垫的上表面。 因此，能够以高产量提高待研磨的基板表面的平面的均匀性和平坦度。

公开(公告)号：US6069080A

公开(公告)日：2000-05-30

申请号：US138628

申请日：1998-08-24

申请人： David B. James ,  William D. Budinger ,  John V. H. Roberts ,  Michael R. Oliver ,  Nina G. Chechik ,  Richard M. Levering, Jr. ,  Heinz F. Reinhardt

发明人： David B. James ,  William D. Budinger ,  John V. H. Roberts ,  Michael R. Oliver ,  Nina G. Chechik ,  Richard M. Levering, Jr. ,  Heinz F. Reinhardt

IPC分类号： B24B37/26 ,  B24B41/047 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B24D3/34 ,  B24D13/10 ,  B24D13/14 ,  B29C70/58 ,  B29C70/66 ,  C08J5/14 ,  G11B23/00 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/302

CPC分类号： H01L21/02024 ,  B24B37/26 ,  B24B41/047 ,  B24B53/00 ,  B24B53/017 ,  B24D13/10 ,  B24D3/28 ,  B24D3/32 ,  B24D3/34 ,  B29C70/58 ,  B29C70/66 ,  H01L21/30604 ,  H01L21/30625 ,  H01L21/31053 ,  B29L2031/736 ,  G11B23/0021

摘要： A fixed abrasive, chemical-mechanical polishing system which is particularly well suited for use in the manufacture of semiconductor devices, memory disks or the like.

公开(公告)号：US06040244A

公开(公告)日：2000-03-21

申请号：US927314

申请日：1997-09-11

申请人： Hatsuyuki Arai ,  Yasushi Ikeyama

发明人： Hatsuyuki Arai ,  Yasushi Ikeyama

IPC分类号： B24B37/20 ,  B24B37/24 ,  B24B49/04 ,  B24B49/12 ,  B24B53/00 ,  B24B53/017 ,  H01L21/302

CPC分类号： B24B53/017 ,  B24B37/005 ,  B24B49/04 ,  B24B49/12

摘要： A single sensor 19 simultaneously measures the thickness and contour of a polishing pad 3 before and after polishing to determine changes in the thickness and contour of the polishing pad 3 caused by polishing. Based on these changes, a reproduction signal for pad reproduction or a replacement signal for pad replacement is output from a controlling means 13 to enable the surface accuracy of the polishing pad to be efficiently controlled.

摘要翻译： 单个传感器19同时测量抛光前后的抛光垫3的厚度和轮廓，以确定由抛光引起的抛光垫3的厚度和轮廓的变化。 基于这些变化，从控制装置13输出用于焊盘再现的再现信号或用于焊盘更换的替换信号，以便能够有效地控制抛光垫的表面精度。

公开(公告)号：US5985093A

公开(公告)日：1999-11-16

申请号：US33097

申请日：1998-03-02

申请人： Lai-Juh Chen

发明人： Lai-Juh Chen

IPC分类号： B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  H01L21/302

CPC分类号： B24B53/017 ,  B24B53/001

摘要： An improved and new apparatus and process for conditioning a chemical-mechanical polishing (CMP) pad has been developed, wherein sufficient conditioning is assured in order to restore the "fresh pad" polish removal rate performance of the polishing pad, while at the same time prolong the life of the CMP polishing pad. The result is a lower cost process and improved product throughput for the CMP apparatus.

摘要翻译： 已经开发了一种用于调节化学机械抛光（CMP）垫的改进和新的装置和方法，其中确保了足够的调节以恢复抛光垫的“新垫”抛光去除速率性能，同时 延长CMP抛光垫的使用寿命。 结果是CMP设备的成本降低，产品吞吐量提高。

公开(公告)号：US5961377A

公开(公告)日：1999-10-05

申请号：US921651

申请日：1997-08-26

申请人： In-kwon Jeong

发明人： In-kwon Jeong

IPC分类号： B24B53/007 ,  B24B53/017 ,  H01L21/304 ,  B24B53/00

CPC分类号： B24B53/017

摘要： A chemical-mechanical polishing system includes a polishing pad having a polishing surface for polishing the semiconductor substrate, and a polishing pad brush including a plurality of bristles attached to a support for cleaning the polishing surface of the polishing pad. In addition, a polishing pad brush arm is operatively coupled to the brush support for transferring the polishing pad brush to and from the polishing pad. Related methods are also discussed.

摘要翻译： 化学机械抛光系统包括具有用于抛光半导体衬底的抛光表面的抛光垫，以及抛光垫刷，其包括附着到用于清洁抛光垫的抛光表面的支撑件上的多个刷毛。 此外，抛光垫刷臂可操作地耦合到刷子支撑件，用于将抛光垫刷移动到抛光垫和从抛光垫传送。 还讨论了相关方法。

公开(公告)号：US5951370A

公开(公告)日：1999-09-14

申请号：US944937

申请日：1997-10-02

申请人： Joseph V. Cesna

发明人： Joseph V. Cesna

IPC分类号： B24B37/04 ,  B24B49/12 ,  B24B53/007 ,  B24B53/02 ,  B24B53/00

CPC分类号： B24B37/042 ,  B24B37/20 ,  B24B49/12 ,  B24B53/017 ,  B24B53/02

摘要： A laser element is mounted above a polishing pad of a workpiece polishing machine to monitor and control flatness of the pad. Actual flatness of the pad is determined by a computer processor which receives thickness measurements from the laser element and compares the thickness at the inner diameter portion of the pad with the thickness at the outer diameter portion of the pad. If the flatness varies substantially from a target flatness, a conditioning device mounted on the machine is moved appropriately relative to the pad to conform its flatness to the target flatness.

摘要翻译： 激光元件安装在工件抛光机的抛光垫上方，以监测和控制焊盘的平整度。 垫的实际平坦度由计算机处理器确定，计算机处理器从激光元件接收厚度测量值，并将垫的内径部分处的厚度与垫的外径部分的厚度进行比较。 如果平坦度从目标平面度变化很大，则安装在机器上的调节装置相对于衬垫适当地移动，以使其平整度达到目标平面度。

公开(公告)号：US5900164A

公开(公告)日：1999-05-04

申请号：US954979

申请日：1997-10-20

申请人： William D. Budinger ,  Elmer William Jensen ,  Harry George McClain ,  John V. H. Roberts ,  Heinz F. Reinhardt

发明人： William D. Budinger ,  Elmer William Jensen ,  Harry George McClain ,  John V. H. Roberts ,  Heinz F. Reinhardt

IPC分类号： B05D5/00 ,  B05D7/02 ,  B24B37/26 ,  B24B53/00 ,  B24B53/007 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B29C70/58 ,  B29C70/66 ,  C08J5/14 ,  H01L21/304 ,  H01L21/306 ,  H01L21/3105 ,  H01L21/302

CPC分类号： B29C70/66 ,  B24B37/26 ,  B24B53/00 ,  B24B53/017 ,  B24D3/28 ,  B24D3/32 ,  B29C70/58 ,  B29L2031/736 ,  Y10S438/959 ,  Y10T428/24355 ,  Y10T428/24372 ,  Y10T428/24405 ,  Y10T428/24446 ,  Y10T428/24479 ,  Y10T428/24537 ,  Y10T428/2457 ,  Y10T428/24579 ,  Y10T428/249924 ,  Y10T428/249954 ,  Y10T428/249972 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T428/268 ,  Y10T428/2982 ,  Y10T428/31551 ,  Y10T428/31591

摘要： The present invention relates to an article of manufacture or polishing pad for altering a surface of a workpiece, such as polishing or planarizing a semiconductor device. The article includes a polymeric matrix impregnated with a plurality of polymeric microelements, each polymeric microelement having a void space therein. The article has a work surface and a subsurface proximate to the work surface. When the article is in contact with a working environment, polymeric microelements at the work surface of the article are less rigid than polymeric elements embedded in the subsurface. As the work surface of the article is abraded during use, the work surface of the pad may be continuously regenerated. In alternative preferred embodiments, the work surface may further include a minitexture and/or a macrotexture. Preferably, the minitexture is formed by fractal patterning at least a portion of the work surface. The present invention also includes methods for decreasing the effective rigidity of polymeric microelements at the work surface of the article, regenerating the work surface of the article and planarizing a surface of a semiconductor device utilizing the article.

摘要翻译： 本发明涉及一种用于改变工件表面的制造或抛光垫，例如抛光或平面化半导体器件。 该制品包括浸渍有多个聚合物微量元素的聚合物基质，每个聚合微量元素在其中具有空隙空间。 该物品具有靠近工作表面的工作表面和次表面。 当制品与工作环境接触时，制品的工作表面的聚合物微量元素比嵌入地下的聚合物元素刚度低。 由于在使用期间制品的工作表面被磨损，所以垫的工作表面可以被连续再生。 在替代的优选实施例中，工作表面还可以包括微小的和/或宏观的结构。 优选地，通过对工作表面的至少一部分进行分形图案形成微小的突起。 本发明还包括用于降低制品工作表面处的聚合物微量元素的有效刚度的方法，再生制品的工作表面并平面化利用该制品的半导体器件的表面。

公开(公告)号：US5885137A

公开(公告)日：1999-03-23

申请号：US884118

申请日：1997-06-27

申请人： Robert Ploessl

发明人： Robert Ploessl

IPC分类号： B24B37/04 ,  B24B53/00 ,  B24B55/06

CPC分类号： B24B53/017 ,  B24B37/04 ,  B24B55/06

摘要： A polishing pad conditioner and a method for conditioning a polishing pad of a chemical/mechanical polishing system. The polishing pad conditioner includes a body defining an upper surface and a lower surface; at least one conditioning element mounted at the lower surface of the body, the conditioning element including a conditioning surface and an opening adjacent the conditioning surface; and a vacuum source operatively connected to the opening in the conditioning element. The method for conditioning a polishing pad includes the steps of holding a polishing pad conditioner including a conditioning element, a conditioning surface thereon and an opening in the conditioning element adjacent the conditioning surface in contact with a surface of the polishing pad; applying a vacuum source to the pad, the vacuum source being operatively connected to the conditioning element; and conditioning the surface of the polishing pad while simultaneously vacuuming particles therefrom.

摘要翻译： 抛光垫调节剂和用于调节化学/机械抛光系统的抛光垫的方法。 抛光垫调节器包括限定上表面和下表面的主体; 至少一个调节元件安装在所述主体的下表面处，所述调节元件包括调节表面和邻近调节表面的开口; 以及可操作地连接到调节元件中的开口的真空源。 调理抛光垫的方法包括以下步骤：在抛光垫的表面上保持包括调理元件，调理表面的调理表面和与调节表面相邻的调理元件中的开口的步骤; 将真空源施加到所述垫，所述真空源可操作地连接到所述调节元件; 并调整抛光垫的表面，同时从其中抽出颗粒。

公开(公告)号：US5833519A

公开(公告)日：1998-11-10

申请号：US695763

申请日：1996-08-06

申请人： Scott E. Moore

发明人： Scott E. Moore

IPC分类号： B24B37/005 ,  B24B53/00 ,  B24B53/017

CPC分类号： B24B53/017 ,  B24B37/005 ,  B24B49/16

摘要： Method and apparatus for conditioning a polishing pad. In particular, a check loop system and associated code are described for monitoring force applied on a pad from an end effector attached to an arm. The pad is conditioned by the end effector for mechanical polishing to remove matter from a substrate assembly. This may be done with chemical-mechanical-polishing and is often used for planarization of a substrate assembly. Described are a modular turret and drive system which are used to manipulate an end effector over a pad.

摘要翻译： 调整抛光垫的方法和装置。 特别地，描述了一种检查循环系统和相关代码，用于监测从附接到臂的末端执行器施加在垫上的力。 该垫由末端执行器调节，用于机械抛光以从基底组件移除物质。 这可以通过化学机械抛光进行，并且通常用于基板组件的平面化。 描述了一种模块化转塔和驱动系统，其用于在衬垫上操纵端部执行器。