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公开(公告)号：US20070181535A1
公开(公告)日：2007-08-09
申请号：US11673399
申请日：2007-02-09
申请人： Francesco De Rege Thesauro , Steven Grumbine , Phillip Carter , Shoutian Li , Jian Zhang , David Schroeder , Ming-Shih Tsai
发明人： Francesco De Rege Thesauro , Steven Grumbine , Phillip Carter , Shoutian Li , Jian Zhang , David Schroeder , Ming-Shih Tsai
IPC分类号： H01L21/461 , C09K13/00 , C03C15/00 , B44C1/22 , H01L21/302
CPC分类号： C09G1/02 , H01L21/3212
摘要： The invention provides a composition for chemical-mechanical polishing, The composition comprises an abrasive, a first metal rate polishing modifier agent, a second metal rate polishing modifier agent, and a liquid carrier. In one embodiment, the first metal rate polishing modifier agent has a standard reduction potential less than 0.34 V relative to a standard hydrogen electrode, and the second metal rate polishing modifier agent has a standard reduction potential greater than 0.34 V relative to a standard hydrogen electrode. In other embodiments, the first and second metal rate polishing modifier agents are different oxidizing agents.
摘要翻译： 本发明提供了一种用于化学机械抛光的组合物。该组合物包括研磨剂，第一金属速率抛光改性剂，第二金属速率抛光改性剂和液体载体。 在一个实施方案中，第一金属速率抛光改性剂相对于标准氢电极具有小于0.34V的标准还原电位，并且第二金属速率抛光改性剂相对于标准氢电极具有大于0.34V的标准还原电位 。 在其它实施方案中，第一和第二金属速率抛光改性剂是不同的氧化剂。
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公开(公告)号：US07247567B2
公开(公告)日：2007-07-24
申请号：US10869397
申请日：2004-06-16
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： C09G1/02 , C09K3/1463 , C23F3/06 , H01L21/3212
摘要： The invention provides a method of chemically-mechanically polishing a substrate comprising tungsten through use of a composition comprising a tungsten etchant, an inhibitor of tungsten etching, and water, wherein the inhibitor of tungsten polishing is a polymer, copolymer, or polymer blend comprising at least one repeating group comprising at least one nitrogen-containing heterocyclic ring or a tertiary or quaternary nitrogen atom. The invention further provides a chemical-mechanical polishing composition particularly useful in polishing tungsten-containing substrates.
摘要翻译： 本发明提供了通过使用包含钨蚀刻剂，钨蚀刻抑制剂和水的组合物对包含钨的基材进行化学机械抛光的方法，其中所述钨抛光抑制剂是聚合物，共聚物或聚合物共混物，其包含在 至少一个包含至少一个含氮杂环或叔或季氮原子的重复基团。 本发明还提供了一种特别适用于抛光含钨衬底的化学机械抛光组合物。
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63.发明授权公开(公告)号：US07204742B2
公开(公告)日：2007-04-17
申请号：US10808827
申请日：2004-03-25
申请人： Abaneshwar Prasad
发明人： Abaneshwar Prasad
IPC分类号： B24D11/00
摘要： The invention provides a chemical-mechanical polishing pad comprising a polishing layer comprising a hydrophobic region, a hydrophilic region, and an endpoint detection port. The hydrophobic region is substantially adjacent to the endpoint detection port. The hydrophobic region comprises a polymeric material having a surface energy of 34 mN/m or less and a polymeric material having a surface energy of more than 34 mN/m. The invention further provides a method of polishing a substrate comprising the use of the polishing pad.
摘要翻译： 本发明提供了一种化学机械抛光垫，其包括包含疏水区域，亲水区域和端点检测端口的抛光层。 疏水区基本上与端点检测端口相邻。 疏水区域包括表面能为34mN / m以下的聚合物材料和具有大于34mN / m的表面能的聚合材料。 本发明还提供一种抛光包括使用抛光垫的衬底的方法。
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公开(公告)号：US20070077865A1
公开(公告)日：2007-04-05
申请号：US11243140
申请日：2005-10-04
申请人： Jeffrey Dysard , Timothy Johns , Paul Feeney
发明人： Jeffrey Dysard , Timothy Johns , Paul Feeney
CPC分类号： H01L21/3212 , C09G1/02
摘要： The invention is directed to a method of chemically-mechanically polishing a substrate comprising polysilicon and a material selected from silicon oxide and silicon nitride with a chemical-mechanical polishing system comprising an abrasive, a polyethylene oxide/polypropylene oxide copolymer, water, and a polishing pad.
摘要翻译： 本发明涉及一种化学机械抛光包括多晶硅和选自氧化硅和氮化硅的材料的衬底的方法，该化学机械抛光系统包括研磨剂，聚环氧乙烷/聚丙烯氧化物共聚物，水和抛光 垫。
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公开(公告)号：US07198549B2
公开(公告)日：2007-04-03
申请号：US10869605
申请日：2004-06-16
IPC分类号： B24B1/00
摘要： A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and (ii) a back surface releasably associated with the resilient subpad.
摘要翻译： 一种化学机械抛光垫，以及使用抛光垫抛光衬底的方法，包括：（a）弹性子垫，和（b）与所述弹性子垫基本共同延伸的聚合物抛光膜，其中所述聚合物抛光膜包括（i） 基本上没有结合的磨料颗粒的抛光表面，和（ii）可释放地与弹性子垫相关联的背面。
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公开(公告)号：US07161247B2
公开(公告)日：2007-01-09
申请号：US10901420
申请日：2004-07-28
CPC分类号： C09G1/02 , C23F3/00 , H01L21/3212 , H01L2924/0002 , H01L2924/00
摘要： The invention provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising a noble metal, the polishing composition comprising (a) an oxidizing agent that oxidizes a noble metal, (b) an anion selected from the group consisting of sulfate, borate, nitrate, and phosphate, and (c) a liquid carrier. The invention further provides a polishing composition and a method of chemically-mechanically polishing a substrate comprising ruthenium, the polishing composition comprising (a) an oxidizing agent that oxidizes ruthenium above the +4 oxidation state, (b) a polishing additive selected from the group consisting of metal sequestering polymers, metal chelators, organic thiols, compounds that reduce ruthenium tetraoxide, lactones, and α-hydroxycarbonyl compounds.
摘要翻译： 本发明提供一种抛光组合物和一种化学机械抛光包含贵金属的基材的方法，所述抛光组合物包含（a）氧化贵金属的氧化剂，（b）选自硫酸盐， 硼酸盐，硝酸盐和磷酸盐，和（c）液体载体。 本发明还提供一种抛光组合物和一种化学机械抛光包含钌的基材的方法，该抛光组合物包含（a）氧化高于+4氧化态的钌的氧化剂，（b）选自下组的抛光添加剂： 由金属螯合聚合物，金属螯合剂，有机硫醇，还原四氧化钌的化合物，内酯和α-羟基羰基化合物组成。
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公开(公告)号：US07160807B2
公开(公告)日：2007-01-09
申请号：US10610407
申请日：2003-06-30
IPC分类号： H01L21/461 , H01L21/302
CPC分类号： C09G1/02 , C23F3/00 , H01L21/3212
摘要： The invention provides a method of polishing a substrate comprising (i) contacting a substrate comprising a noble metal layer with a chemical-mechanical polishing system comprising (a) a polishing component, (b) an oxidizing agent, and (c) a liquid carrier, and (ii) abrading at least a portion of the noble metal layer to polish the substrate. The polishing component is selected from the group consisting of an abrasive, a polishing pad, or a combination thereof, and the oxidizing agent is selected from the group consisting of bromates, bromites, hypobromites, chlorates, chlorites, hypochlorites, perchlorates, iodates, hypoiodites, periodates, peroxyacetic acid, organo-halo-oxy compounds, salts thereof, and combinations thereof. The chemical-mechanical polishing system has a pH of about 9 or less, and the oxidizing agent does not produce a substantial amount of elemental halogen. The invention also provides a method of polishing a substrate comprising a noble metal layer and a second layer using the aforementioned polishing system that further comprises a stopping compound.
摘要翻译： 本发明提供了一种抛光衬底的方法，其包括（i）使包含贵金属层的衬底与化学机械抛光系统接触，所述化学机械抛光系统包括（a）抛光组分，（b）氧化剂和（c）液体载体 ，和（ii）研磨贵金属层的至少一部分以抛光基底。 抛光组分选自研磨剂，抛光垫或其组合，氧化剂选自溴酸盐，溴酸盐，次溴酸盐，氯酸盐，亚氯酸盐，次氯酸盐，高氯酸盐，碘酸盐，次碘酸盐 ，高碘酸酯，过氧乙酸，有机卤代氧化合物，其盐，及其组合。 化学机械抛光系统的pH值约为9或更低，氧化剂不产生大量的元素卤素。 本发明还提供了一种使用上述抛光系统抛光包含贵金属层和第二层的衬底的方法，所述抛光系统还包括停止化合物。
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公开(公告)号：US20060281196A1
公开(公告)日：2006-12-14
申请号：US11150944
申请日：2005-06-13
申请人： Paul Feeney , Vlasta Brusic
发明人： Paul Feeney , Vlasta Brusic
IPC分类号： H01L21/00 , H01L21/461
摘要： The invention relates to a method of polishing a substrate comprising at least one metal layer by applying an electrochemical potential between the substrate and at least one electrode in contact with a polishing composition comprising a reducing agent or an oxidizing agent.
摘要翻译： 本发明涉及一种通过在衬底和至少一个与包含还原剂或氧化剂的抛光组合物接触的电极之间施加电化学电势来抛光包含至少一个金属层的衬底的方法。
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公开(公告)号：US20060273871A1
公开(公告)日：2006-12-07
申请号：US11084287
申请日：2005-03-18
申请人： Heinz Busta , Ian Wylie , Gary Snider
发明人： Heinz Busta , Ian Wylie , Gary Snider
IPC分类号： H01H51/22
CPC分类号： H01H1/0094 , Y10S977/709 , Y10S977/731 , Y10S977/743 , Y10S977/745 , Y10S977/932
摘要： An improved microelectromechanical switch assembly comprises a linearly movable switch rod constrained via a switch bearing, the switch rod being actuated by electrostatic deflection. Movement of the switch rod to one end of its travel puts the switch assembly in a closed state while movement of the switch rod to the other end of its travel puts the switch assembly in an open state. In an embodiment of the invention, one or both of the switch rod and the switch bearing are fabricated of a carbon nanotube. The improved microelectromechanical switch assembly provides low insertion loss and long lifetime in an embodiment of the invention.
摘要翻译： 改进的微机电开关组件包括通过开关轴承限制的线性可移动开关杆，开关杆由静电偏转致动。 开关杆移动到其行程的一端时，开关组件处于关闭状态，而开关杆移动到其行程的另一端则使开关组件处于打开状态。 在本发明的一个实施例中，开关杆和开关轴承中的一个或两个由碳纳米管制成。 改进的微机电开关组件在本发明的实施例中提供低插入损耗和长寿命。
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公开(公告)号：US07093722B2
公开(公告)日：2006-08-22
申请号：US10300196
申请日：2002-11-20
申请人： Steven K Grumbine
发明人： Steven K Grumbine
IPC分类号： A46B17/00
CPC分类号： B65D81/00 , B01D21/0012 , B01D21/0039 , B01D21/0042 , B01D21/02 , B01D2221/14
摘要： The invention provides devices and methods for removing and trapping large and/or dense abrasive particles from a polishing slurry. The polishing slurry is introduced into a container and allowed to stagnate, thereby causing large and/or dense particles to separate from the slurry under the influence of gravity. The container includes a cavity or plurality of cavities defined by an inner surface of the container into which the separated particles sink. To prevent the large and/or dense particles from becoming re-suspended into the slurry, the size and shape of the cavity is relatively deep and narrow with respect to the large and/or dense particles, thus providing a trapping effect. The cavities do not effectively trap the smaller particles.
摘要翻译： 本发明提供了用于从抛光浆料中去除和捕获大的和/或致密的磨料颗粒的装置和方法。 将抛光浆料引入容器中并停滞，从而使大颗粒和/或致密颗粒在重力作用下与浆料分离。 容器包括由容器的内表面限定的空腔或多个空腔，分离的颗粒沉入其中。 为了防止大的和/或致密的颗粒重新悬浮到浆料中，空腔的尺寸和形状相对于大的和/或致密的颗粒相对较深和较窄，从而提供捕获效果。 空腔不能有效地捕获较小的颗粒。
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