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公开(公告)号:US20220219284A1
公开(公告)日:2022-07-14
申请号:US17711239
申请日:2022-04-01
Applicant: Samsung Display Co., Ltd. , KCTECH CO.,LTD.
Inventor: Junggun NAM , Seungik KANG , Seungbae KANG , Pungseok KIM , Heesung YANG , Keunwoo LEE , Woojin CHO , Byoungkwon CHOO
Abstract: An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.
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公开(公告)号:US20220145216A1
公开(公告)日:2022-05-12
申请号:US17516668
申请日:2021-11-01
Applicant: KCTECH CO., LTD.
Inventor: Kyong Jin JUNG , Ga Young JUNG , Young Ho YUN , Kun Hee PARK , Young Gon KIM , Yong Ho JEONG
Abstract: A composition for dissolving abrasive particles, and a cleaning method using the composition are provided. The composition includes a sulfur-containing organic acid, a fluorine ion-containing compound, and a solvent, and a turbidity change rate (%) measured at 60° C. for 15 minutes may be in a range of −80 to −99.
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公开(公告)号:US20220126328A1
公开(公告)日:2022-04-28
申请号:US17505185
申请日:2021-10-19
Applicant: KCTECH CO., LTD.
Inventor: Hyung Chul KIM , You Sun JUNG
Abstract: A cleaning solution detection device includes a transfer part configured to unload and transfer a substrate having a surface to which a cleaning solution is applied when a cleaning process is completed, a detector configured to detect the cleaning solution that falls from the surface of the substrate in a process in which the substrate is unloaded and transferred by the transfer part, and a controller configured to determine whether a dangerous situation occurs due to a fall of the cleaning solution based on information detected by the detector.
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公开(公告)号:US20220056373A1
公开(公告)日:2022-02-24
申请号:US17416420
申请日:2019-08-07
Applicant: KCTECH CO., LTD.
Inventor: Ga Young JUNG , Yong Ho JEONG , Kun Hee PARK , Young Gon KIM , Young Ho YOON , Young Lok YOON
Abstract: The present disclosure relates to a cleaning liquid composition and a cleaning method using the same. A polishing slurry composition according to an embodiment of the present disclosure includes: a chelating agent containing an organic salt; and an anionic surfactant.
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公开(公告)号:US20210229236A1
公开(公告)日:2021-07-29
申请号:US17158657
申请日:2021-01-26
Applicant: Samsung Display Co., Ltd. , KCTECH CO.,LTD.
Inventor: Junggun NAM , Seungik KANG , Seungbae KANG , Pungseok KIM , Heesung YANG , Keunwoo LEE , Woojin CHO , Byoungkwon CHOO
Abstract: An apparatus for manufacturing a display device includes a moving part including a belt that circulates, a roller that circulates the belt, and at least one meandering prevention portion that moves in a first direction parallel to a direction of a rotation shaft of the roller and prevents meandering of the belt, and a polishing head disposed corresponding to the moving part, the polishing head polishing a surface of a base material disposed on a first surface of the belt. A part of the at least one meandering prevention portion faces a second surface of the belt, the second surface being a side surface of the belt.
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公开(公告)号:US20210114163A1
公开(公告)日:2021-04-22
申请号:US17036062
申请日:2020-09-29
Applicant: Samsung Display Co., LTD. , KCTECH CO.,LTD.
Inventor: Seung Bae KANG , Sung Hyeon PARK , Jung Gun NAM , Joon-Hwa BAE , Kyung Bo LEE , Keun Woo LEE , Woo Jin CHO , Byoung Kwon CHOO
Abstract: A substrate processing apparatus includes: a conveyor belt configured to have an outer surface on which a bottom surface of a substrate is seated; and a polishing head unit configured to face an upper surface of the substrate, wherein the polishing head unit includes: a polishing head connected to a driver; a polishing pad configured to face the polishing head; a polishing pad fixing ring disposed between the polishing head and the polishing pad; and a temperature sensor configured to overlap the polishing pad fixing ring and to be spaced apart from the polishing pad fixing ring.
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公开(公告)号:US20210079262A1
公开(公告)日:2021-03-18
申请号:US16954350
申请日:2018-11-13
Applicant: KCTECH CO., LTD.
Inventor: Hae Won YANG , Jun Ha HWANG , Jung Yoon KIM , Kwang Soo PARK
IPC: C09G1/02 , H01L21/321
Abstract: The present invention relates to a polishing slurry composition for an STI process, the polishing slurry composition comprising: a polishing solution including polishing particles; and an additive solution containing a nitride film polishing barrier inclusive of a polymer having an amide bond.
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公开(公告)号:US10784113B2
公开(公告)日:2020-09-22
申请号:US15773904
申请日:2016-08-08
Applicant: KCTECH CO., LTD.
Inventor: Kyunam Park
IPC: H01L21/304 , H01L21/306 , H01L21/67 , H01L21/02 , C09G1/02 , B24B37/12 , B24B37/20
Abstract: Provided are a chemical mechanical polishing apparatus and a control method thereof. The chemical mechanical polishing apparatus includes a plurality of polishing platens provided with a polishing pad on an upper surface thereof, and a polishing platen transferring unit for transferring the plurality of polishing platens to different process positions according to a predetermined process sequence. Here, different processes are performed at different process positions.
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公开(公告)号:US20200243306A1
公开(公告)日:2020-07-30
申请号:US16750317
申请日:2020-01-23
Applicant: KCTECH CO.,LTD.
Inventor: Yong Ki HAN
Abstract: Disclosed are an opening and shutting device and a substrate processing apparatus including the same. A device for opening and closing an entrance through which a substrate is carried into and out of a processing chamber includes an opening and shutting part that is disposed between the entrance and the processing chamber and that opens and closes the entrance while rotating so as to be brought into close contact with the entrance.
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公开(公告)号:US20200071566A1
公开(公告)日:2020-03-05
申请号:US16553623
申请日:2019-08-28
Applicant: Samsung Electronics Co., Ltd.
Inventor: Sang-hyun Park , Hyo-san Lee , Won-ki Hur , Jung-yoon Kim , Jun-ha Hwang , Chang-gil Kwon , Sung-pyo Lee
IPC: C09G1/02
Abstract: A slurry composition for a chemical mechanical polishing (CMP) process includes about 0.1% by weight to about 10% by weight of polishing particles, about 0.001% by weight to about 1% by weight of an amine compound, about 0.001% by weight to about 1% by weight of a first cationic compound that is amino acid, about 0.001% by weight to about 1% by weight of a second cationic compound that is organic acid, and about 1% by weight to about 5% by weight of polyhydric alcohol including at least two hydroxyl groups.
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