公开(公告)号：USD872872S1

公开(公告)日：2020-01-14

申请号：US29672418

申请日：2018-12-05

Applicant: A.L.M.T. Corp.

Designer： Yoshitake Fukaya ,  Masahiro Kato ,  Makoto Watanabe ,  Kiyohide Sasaki

公开(公告)号：US20190297725A1

公开(公告)日：2019-09-26

申请号：US16349340

申请日：2017-11-08

Applicant: Sumitomo Electric Industries, Ltd. ,  A.L.M.T. Corp.

Inventor： Isao IWAYAMA ,  Shigeki KOYAMA ,  Masashi OKAMOTO ,  Yuta INOUE ,  Hiroyuki KONTANI ,  Takehisa YAMAMOTO

IPC: H05K1/02 ,  H01L23/373 ,  H05K1/18 ,  H05K1/03 ,  C22C29/06

Abstract: A composite member includes a substrate composed of a composite material containing a metal and a non-metal. One surface of the substrate has spherical warpage of which radius of curvature R is not smaller than 5000 mm and not greater than 35000 mm. A sphericity error is not greater than 10.0 μm, the sphericity error being defined as an average distance between a plurality of measurement points on a contour of a warped portion of the substrate and approximate arcs defined by the plurality of measurement points. The substrate has a thermal conductivity not lower than 150 W/m·K and a coefficient of linear expansion not greater than 10 ppm/K.

公开(公告)号：USD839444S1

公开(公告)日：2019-01-29

申请号：US29543974

申请日：2015-10-29

Applicant: A.L.M.T. Corp.

Designer： Yoshitake Fukaya ,  Masahiro Kato ,  Makoto Watanabe ,  Kiyohide Sasaki

公开(公告)号：US10100390B2

公开(公告)日：2018-10-16

申请号：US14531663

申请日：2014-11-03

Applicant: A.L.M.T. Corp.

Inventor： Takanori Kadokura ,  Hidenobu Nishino ,  Ayuri Tsuji ,  Shigekazu Yamazaki ,  Akihiko Ikegaya

IPC: C22C27/04 ,  C22C38/50 ,  B21C25/02 ,  C22C1/04 ,  C22C32/00 ,  C22C38/44 ,  B22F3/17 ,  B22F3/20

Abstract: A heat-resistant member comprising a molybdenum alloy that comprises a first phase containing Mo as a main component and a second phase comprising a Mo—Si—B-based intermetallic compound particle phase, wherein the balance is an inevitable impurity and wherein the Si content is 0.05 mass % or more and 0.80 mass % or less and the B content is 0.04 mass % or more and 0.60 mass % or less. The member may be coated.

公开(公告)号：US09803291B2

公开(公告)日：2017-10-31

申请号：US14430591

申请日：2013-09-12

Applicant: A.L.M.T. Corp.

Inventor： Masahiro Katoh ,  Makoto Watanabe

IPC: C30B11/02 ,  C30B11/00 ,  C30B29/20 ,  C30B35/00 ,  C23C4/02 ,  C23C4/08 ,  C23C4/12 ,  C23C4/18 ,  F27D5/00

CPC classification number: C30B11/002 ,  C23C4/02 ,  C23C4/08 ,  C23C4/12 ,  C23C4/18 ,  C30B29/20 ,  C30B35/002 ,  F27D2005/0075 ,  Y10T117/1092

Abstract: An object of this invention is to provide a crucible for growing a sapphire single crystal, which is optimized for providing a sapphire single crystal and is reusable. A crucible for growing a sapphire single crystal of this invention includes: a base material (3) containing molybdenum as a main component and having a crucible shape; and a coating layer (5) with which only an inner periphery of the base material (3) is coated and which is formed of tungsten and inevitable impurities, in which the coating layer (5) has a surface roughness Ra of 5 μm or more and 20 μm or less.

公开(公告)号：US20170145280A1

公开(公告)日：2017-05-25

申请号：US15327269

申请日：2015-09-01

Applicant: A.L.M.T. Corp.

Inventor： Tatsuya Morikawa ,  Takanori Kadokura ,  Kensuke Osawa

IPC: C09K5/14 ,  H01L23/373 ,  C22C26/00 ,  B22F1/00 ,  C22C5/08

CPC classification number: C09K5/14 ,  B22F1/0003 ,  B22F7/08 ,  B22F2007/066 ,  B22F2301/255 ,  B22F2302/05 ,  B22F2302/20 ,  B22F2302/406 ,  B22F2302/45 ,  B22F2304/10 ,  B22F2998/10 ,  B22F2999/00 ,  C22C1/0466 ,  C22C5/06 ,  C22C5/08 ,  C22C26/00 ,  C22C2001/1073 ,  C22C2026/005 ,  C22C2026/006 ,  C22C2026/007 ,  C22C2026/008 ,  H01L21/4871 ,  H01L23/3732 ,  H01L23/3735 ,  C22C1/05 ,  C22C1/058 ,  C22C2001/1057 ,  C22C2001/1089

Abstract: Provided are a diamond composite material which is excellent in thermal conductivity, suitable as a material for a heat radiating member, and dense, the heat radiating member, and a method for producing a diamond composite material that can productively produce a diamond composite material which is excellent in wettability between diamond and metal and dense. The diamond composite material includes: a coated diamond particle including a diamond particle and a carbide layer covering a surface of the diamond particle and including an element of group 4 of the periodic table; and silver or a silver alloy binding such coated diamond particles together, with an oxygen content of 0.1 mass % or less.

公开(公告)号：USD771167S1

公开(公告)日：2016-11-08

申请号：US29468973

申请日：2013-10-04

Applicant: A.L.M.T. Corp.

Designer： Yoshitake Fukaya ,  Masahiro Kato ,  Makoto Watanabe ,  Kiyohide Sasaki

公开(公告)号：US09249479B2

公开(公告)日：2016-02-02

申请号：US14139598

申请日：2013-12-23

Applicant: A.L.M.T. Corp. ,  Sumitomo Electric Hardmetal Corp. ,  Sumitomo Electric Industries, Ltd.

Inventor： Yoshiharu Yamamoto ,  Kazuo Sasaya ,  Takayuki Fudo ,  Akira Nakano ,  Syunsuke Yamanaka ,  Takahisa Iguchi ,  Fumiatsu Sato ,  Akihiko Ikegaya

IPC: C22B34/36 ,  C01G41/00 ,  C01G41/02 ,  C22B7/00 ,  B01J8/10 ,  C01G23/00 ,  C01G35/00 ,  C01G37/02 ,  C01G53/00 ,  C01G37/14 ,  C01G51/00

CPC classification number: C22B34/36 ,  B01J8/10 ,  B01J19/28 ,  B01J2219/0004 ,  B01J2219/00132 ,  B01J2219/00157 ,  C01G23/005 ,  C01G35/00 ,  C01G37/02 ,  C01G37/14 ,  C01G41/00 ,  C01G41/003 ,  C01G41/02 ,  C01G51/42 ,  C01G53/42 ,  C01P2002/72 ,  C22B7/001 ,  C22B7/006 ,  Y02P10/214 ,  Y02P10/234 ,  Y02W30/54

Abstract: Provided are a method for producing sodium tungstate by supplying an oxidant made of sodium nitrate or sodium nitrite to bring a tungsten containing material and the oxidant into contact with each other in an atmosphere containing oxygen to thereby continuously produce a reaction product; a method for collecting tungsten using the method; and an apparatus for producing sodium tungstate. Also provided are a method for producing a sodium tungstate aqueous solution in which a reductant is introduced into a melt containing the above-described reaction product which is then dissolved in water; and a method for collecting tungsten using the method.

Abstract translation: 提供一种通过供给由硝酸钠或亚硝酸钠制成的氧化剂以使含钨材料和氧化剂在含氧气氛中相互接触从而连续产生反应产物来生产钨酸钠的方法; 采用该方法收集钨的方法; 以及生产钨酸钠的装置。 还提供了一种生产钨酸钠水溶液的方法，其中将还原剂引入含有上述反应产物的熔体中，然后溶解在水中; 以及使用该方法收集钨的方法。

公开(公告)号：US20140308536A1

公开(公告)日：2014-10-16

申请号：US14363401

申请日：2012-11-27

Applicant: A.L.M.T. CORP.

Inventor： Gouhei Toyoshima ,  Noboru Uenishi ,  Norihito Goma ,  Satoshi Umemoto ,  Takanori Kadokura ,  Tomohiro Takida ,  Kazunaga Sakakibara

IPC: C22C27/04

CPC classification number: C22C27/04 ,  B22F3/24 ,  B22F5/006 ,  C22C1/045 ,  C22F1/02 ,  C22F1/18 ,  Y10T428/12014

Abstract: There is provided a flat plate-like sintered tungsten alloy that can be molded into a complex shape by press working or forge processing. The flat plate-like sintered tungsten alloy contains 85% by mass or more and 98% by mass or less of W, 1.4% by mass or more and 11% by mass or less of Ni, and 0.6% by mass or more and 6% by mass or less of at least one substance selected from the group consisting of Fe, Cu and Co, wherein an elongation percentage of the flat plate-like sintered tungsten alloy in a planar direction is 20% or more.

Abstract translation: 提供一种平板状烧结钨合金，其可以通过冲压加工或锻造加工成型成复杂形状。 平板状烧结钨合金含有85质量％以上且98质量％以下的W，1.4质量％以上且11质量％以下的Ni，0.6质量％以上且6以下 从Fe，Cu，Co组成的组中选出的至少一种物质的质量％以下，其中平板状烧结钨合金在平面方向的伸长率为20％以上。

公开(公告)号：US20040119161A1

公开(公告)日：2004-06-24

申请号：US10724603

申请日：2003-12-02

Applicant: SUMITOMO ELECTRIC INDUSTRIES, LTD. ,  A.L.M.T. CORP.

Inventor： Hirohisa Saito ,  Takashi Tsuno ,  Chihiro Kawai ,  Shinya Nishida ,  Motoyoshi Tanaka

IPC: H01L023/06

CPC classification number: H01L23/66 ,  H01L23/3732 ,  H01L24/28 ,  H01L24/45 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/45014 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/1306 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/01027 ,  H01L2924/01074 ,  H01L2924/01032 ,  H01L2924/01079 ,  H01L2924/0105 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/48 ,  H01L2924/206

Abstract: The present invention provides an economical package for housing semiconductor chip that allows a semiconductor chip to operate normally and stably over long periods by efficiently transferring heat generated during the operation of the semiconductor chip to the package mount substrate. A package for housing semiconductor chip that has a substrate, whose upper face is provided with a mounting space whereon a semiconductor chip is mounted, and whose opposite sides are provided with a screw mounting part which is a through-hole or notch; a frame, which is provided on the upper face of the substrate so as to enclose the mounting space and whose side or top has a joint for an input/output terminal; and an input/output terminal, which is connected to the joint, wherein at least a portion of the substrate below the semiconductor chip mounting space thereof comprises a metal-diamond composite that is produced by infiltrating a base material in which diamond grains are joined via a metal carbide with a metal containing copper and/or silver as the main component, and the other part including the screw mounting part consists of metal.

Abstract translation: 本发明提供了一种用于容纳半导体芯片的经济型封装，其通过有效地将半导体芯片的操作期间产生的热量传输到封装安装基板，使半导体芯片能够长时间正常且稳定地工作。 一种用于容纳半导体芯片的封装，其具有基板，其上表面设置有安装半导体芯片的安装空间，并且其相对侧设置有作为通孔或凹口的螺钉安装部; 框架，其设置在基板的上表面上，以便包围安装空间，并且其侧面或顶部具有用于输入/输出端子的接头; 以及连接到所述接头的输入/输出端子，其中在所述半导体芯片安装空间下方的所述基板的至少一部分包括金属 - 金刚石复合材料，所述金属 - 金刚石复合材料是通过渗透其中金刚石晶粒被接合的基底材料而产生的， 具有含有铜和/或银的金属作为主要成分的金属碳化物，而包括螺钉安装部分的另一部分由金属构成。