Abstract:
A two-way wireless messaging system includes a messaging network having at least one user agent corresponding to a subscriber of a two-way wireless messaging service. The subscriber receives messages from the messaging network along a first communication channel. The user agent includes a plurality of messages stored therein wherein a predetermined message is stored in the user agent and forwarded to a desired destination in response to an originating message code that is received from a two-way messaging device of the subscriber along a second communication return channel. The originating message code can be expanded by the user agent. The messages stored by the user agent can be modified so that different messages can be forwarded to the predetermined destination. The user agent also maintains location information of the two-way messaging device of the subscriber.
Abstract:
A microscope stage assembly prevents particles generated by the meshing of gears of the assembly from dispersing onto the hands of an operator. The assembly includes a stage, a drive system for the stage which is made up of X- and Y-axis drive pinions meshing with X- and Y-axis racks, respectively, and control knobs which are manipulated by an operator to rotate the drive pinions. In one embodiment, a particle collection tray is positioned between the gears and the control knobs to catch any particles falling from the gears before the particles reach the hands of the operator. In another embodiment, a vacuum system includes vacuum lines which open to the sides of the racks meshing with the drive pinions. Any particles produced by the meshing of the gears are removed from the area of the microscope via the vacuum lines. Thus, if the operator is taking part in a process that is sensitive to particle contamination, such as a semiconductor manufacturing process, the operator will not bring particles from the microscope with him when entering the clean room after having used the microscope to examine products being made in the clean room.
Abstract:
A printed circuit board manufacturing system and a manufacturing method thereof are disclosed. A method of manufacturing printed circuit board, comprising: providing a substrate that comprises a pad and an insulation layer covering the pad; acquiring an image of the substrate; acquiring location information of the pad by analyzing the image of the substrate; forming a via hole by removing a part of the insulation layer that corresponds the location information of the pad; and forming a via by filling the via hole with a conductive material, provides improved process conformity, even if the substrate has partial or nonlinear deformation, by considering the location information of the pad in the via hole forming. The improved conformity may allow more flexibility to substrate design and more integrity for circuitries on printed circuit board.
Abstract:
Techniques are described to replicate multicast packets in accordance with a hierarchical data structure. For example, upon receiving a multicast packet, a packet-forwarding engine may communicate the packet to packet-forwarding engines corresponding to starting nodes of the hierarchical data structure. The packet-forwarding engines corresponding to starting nodes of the hierarchical data structure may replicate the multicast packet for local interface cards, and forward the replicated packets to the network. Furthermore, the packet-forwarding engines may replicate the packet for packet-forwarding engines corresponding to downstream nodes. In this manner, the packet replication process is distributed throughout the router decreasing the complexity of necessary replication hardware. Furthermore, the packet replication process is highly scalable resulting in a latency of one fabric hop when the number of packet-forwarding engines doubles. Also, when the hierarchical data structure has more than one starting node, the packet replication process is less susceptible to a single point failure.
Abstract:
Provided are a complementary nonvolatile memory device, methods of operating and manufacturing the same, a logic device and semiconductor device having the same, and a reading circuit for the same. The complementary nonvolatile memory device includes a first nonvolatile memory and a second nonvolatile memory which are sequentially stacked and have a complementary relationship. The first and second nonvolatile memories are arranged so that upper surfaces thereof are contiguous.
Abstract:
A liquid crystal display having a receiving member, and a backlight unit wherein the receiving member includes a mold frame having a part mounting unit that has a predetermined receiving space, and a chassis fastened to the mold frame which includes a reinforcing tab in contact with and reinforcing the part mounting unit.
Abstract:
A semiconductor memory device includes a first dopant area and a second dopant area in a semiconductor substrate, the first dopant area and the second dopant area doped with one selected from the group consisting of Sb, Ga, and Bi. The semiconductor memory device includes an insulating layer disposed in contact with the first dopant area and the second dopant area, and a gate electrode layer disposed in contact with the insulating layer.
Abstract:
A multi-bit non-volatile memory device and methods of operating and fabricating the same may be provided. The memory device may include a channel region formed in a semiconductor substrate, and a source and drain that form a Schottky contact with the channel region. Also, a central gate electrode may be located on a portion of the channel region, and first and second sidewall gate electrodes may be formed on the channel region along the outer sides of the central gate electrode. First and second storage nodes may be formed between the channel region and the sidewall gate electrodes.
Abstract:
A semiconductor memory device a first dopant area and a second dopant area, the first dopant area and the second dopant area disposed in a semiconductor substrate, an insulating layer disposed in contact with the first dopant area and the second dopant area, the insulating layer including a material selected from the group consisting of Hf, Zr, Y, and Ln, and a gate electrode layer disposed on the insulating layer.
Abstract:
A flash memory device can include a semiconductor pin protruding from a semiconductor substrate of a first conductive type to extend in one direction, a first doped layer and a second doped layer provided to an upper portion and a lower portion of the semiconductor pin, respectively, to be vertically spaced apart from each other, the first and second doped layers having a second conductive type, and a plurality of word lines extending over a top and a sidewall of the semiconductor pin to intersect the direction. The word lines overlap the first doped layer and the second doped layer to have vertical channels.