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    BALL GRID ARRAY PACKAGE STACK
    61.
    发明申请
    BALL GRID ARRAY PACKAGE STACK 失效
    球网阵列包装

    公开(公告)号：US20060226543A1

    公开(公告)日：2006-10-12

    申请号：US11424055

    申请日：2006-06-14

    申请人： Jung-Jin KIM ,  Young-Hee SONG ,  Dong-Ho LEE

    发明人： Jung-Jin KIM ,  Young-Hee SONG ,  Dong-Ho LEE

    IPC分类号： H01L23/48

    CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and lower individual BGA packages. The foldable circuit substrate has three portions. By bending the middle second portion, the foldable circuit substrate is folded in two. In the lower BGA package, an IC chip is attached on and electrically connected to a top surface of the first portion, and external connection terminals such as solder balls are formed on a bottom surface of the first portion. The top surface of the first portion is covered with a molding resin to protect the chip, and the third portion is placed on an upper surface of the molding resin. The upper BGA package is constructed in a similar manner to the lower BGA package as described above. For stacking, the interconnection terminals of the upper BGA package are joined and electrically connected to the third portion of the foldable circuit substrate of the lower BGA package.

    摘要翻译： 本文公开了一种球栅阵列（BGA）封装堆叠，其不受球布置的限制，因为它使用可折叠电路基板，其允许上部和下部单个BGA封装之间的互连。 可折叠电路基板具有三个部分。 通过弯曲中间第二部分，可折叠电路基板折叠成两个。 在较低的BGA封装中，IC芯片附着在电连接到第一部分的顶表面上，并且在第一部分的底表面上形成诸如焊球的外部连接端子。 第一部分的顶表面被模制树脂覆盖以保护芯片，并且第三部分被放置在模制树脂的上表面上。 上部BGA封装以与上述较低BGA封装类似的方式构造。 为了堆叠，上部BGA封装的互连端子被接合并电连接到下部BGA封装的可折叠电路基板的第三部分。

    Broadcast retransmitting method, broadcast retransmitting apparatus, replay apparatus, and broadcast retransmitting system using the same
    63.
    发明授权
    Broadcast retransmitting method, broadcast retransmitting apparatus, replay apparatus, and broadcast retransmitting system using the same 有权
    广播重传方法，广播重发装置，重播装置，以及使用该广播重发装置的广播重传系统

    公开(公告)号：US08670368B2

    公开(公告)日：2014-03-11

    申请号：US12948378

    申请日：2010-11-17

    申请人： Yong-deok Chang ,  Jung-jin Kim ,  Sun-bum Han

    发明人： Yong-deok Chang ,  Jung-jin Kim ,  Sun-bum Han

    IPC分类号： H04J3/08

    CPC分类号： H04L27/0008 ,  H04H20/61 ,  H04H60/41 ,  H04L5/0062 ,  H04L27/0006 ,  H04L27/0012

    摘要： A broadcast retransmitting method, a broadcast retransmitting apparatus, a relay apparatus and a broadcast retransmitting system using the same, are provided. The broadcast retransmitting apparatus includes a demodulation unit which receives and demodulates a modulated broadcast, a modulation unit which modulates the demodulated broadcast, a spectrum sensing unit which detects an available band through spectrum sensing, and a control unit which retransmits the modulated broadcast to at least one surrounding apparatus. The broadcast retransmitting method includes receiving and demodulating a broadcast which has been modulated according to a first modulation method, and modulating the demodulated broadcast according to a second modulation method different from the first modulation method; detecting an available band from an idle band through spectrum sensing; and retransmitting the broadcast which has been modulated in the second modulation method to at least one surrounding apparatus using the detected available band.

    摘要翻译： 提供广播重发方法，广播重发装置，中继装置和使用其的广播重传系统。 广播重传装置包括接收和解调调制广播的解调单元，调制解调广播的调制单元，通过频谱感测检测可用频带的频谱感测单元，以及至少将调制广播重发的控制单元 一个周边设备。 广播重传方法包括：接收和解调根据第一调制方法被调制的广播，并且根据与第一调制方法不同的第二调制方法调制解调的广播; 通过频谱感测从空闲频段检测可用频带; 并且使用所检测的可用频带将已经以第二调制方法调制的广播重传到至少一个周围设备。

    Camera module and method of manufacturing the same
    66.
    发明授权
    Camera module and method of manufacturing the same 失效
    相机模块及其制造方法

    公开(公告)号：US08149321B2

    公开(公告)日：2012-04-03

    申请号：US12081218

    申请日：2008-04-11

    申请人： Jin Mun Ryu ,  Jung Jin Kim ,  Bo Kyoung Kim ,  Jae Sub Cho

    发明人： Jin Mun Ryu ,  Jung Jin Kim ,  Bo Kyoung Kim ,  Jae Sub Cho

    IPC分类号： H04N5/225

    CPC分类号： H04N5/2253 ,  H04N5/2257

    摘要： Provided is a camera module including a housing that is formed in a rectangular box shape and has a cylindrical barrel coupling portion extending upward from the central portion thereof; an image sensor module that is mounted in the housing; a lens barrel that has a lens insertion port provided in the central portion thereof and a housing coupling portion extending downward therefrom, the housing coupling portion being closely coupled to the barrel coupling portion of the housing; a wafer lens that is mounted in the lens insertion port of the lens barrel; and a lens fixing cap that is covered on the upper end portion of the lens barrel.

    摘要翻译： 本发明提供一种照相机模块，其包括：壳体，其形成为矩形盒状，并且具有从其中心部向上方延伸的筒状筒状连结部; 安装在所述壳体中的图像传感器模块; 透镜筒，其具有设置在其中心部分的透镜插入口和从其向下延伸的壳体联接部分，所述壳体联接部分紧密地联接到所述壳体的镜筒联接部分; 晶片透镜，其安装在透镜镜筒的透镜插入口中; 以及覆盖在镜筒的上端部的透镜固定帽。

    TRELLIS ENCODER AND TRELLIS ENCODING DEVICE HAVING THE SAME
    67.
    发明申请
    TRELLIS ENCODER AND TRELLIS ENCODING DEVICE HAVING THE SAME 有权
    TRELLIS编码器和TRELLIS编码器具

    公开(公告)号：US20110267209A1

    公开(公告)日：2011-11-03

    申请号：US13181154

    申请日：2011-07-12

    申请人： Eui-jun Park ,  Jung-jin Kim ,  Seok-hyun Yoon ,  Kyo-shin Choo ,  Keon-yong Seok

    发明人： Eui-jun Park ,  Jung-jin Kim ,  Seok-hyun Yoon ,  Kyo-shin Choo ,  Keon-yong Seok

    IPC分类号： H03M7/00 ,  G06F11/10 ,  H03M13/27

    CPC分类号： H04L1/004 ,  H03M13/235 ,  H04N21/2383

    摘要： A trellis encoding device includes a plurality of trellis encoders to perform trellis-encoding of a transport stream into which a supplementary reference signal (SRS) has been inserted, and performs a memory reset in a region that precedes an SRS; and a parity compensation unit to compensate for parities of the transport stream in accordance with values stored in memories included in the trellis encoders. The plurality of trellis encoders may be implemented in diverse types. The trellis encoding device can perform a memory reset selectively using the stored value of the memory and the inverted value thereof, or selectively using the stored value of the memory and a fixed value. By properly resetting the memory in processing the transport stream into which the SRS has been inserted, DC offset can be reduced.

    摘要翻译： 网格编码装置包括多个网格编码器，用于对已经插入补充参考信号（SRS）的传输流进行网格编码，并且在SRS之前的区域中执行存储器复位; 以及奇偶补偿单元，用于根据存储在包括在网格编码器中的存储器中的值来补偿传输流的奇偶校验。 多个网格编码器可以以不同类型实现。 网格编码装置可以使用存储器的存储值和其反相值有选择地执行存储器复位，或者选择性地使用存储器的存储值和固定值。 通过在处理已经插入SRS的传输流中适当地重置存储器，可以减小DC偏移。

    Ball grid array package stack
    69.
    发明授权
    Ball grid array package stack 失效
    球栅阵列封装堆栈

    公开(公告)号：US07585700B2

    公开(公告)日：2009-09-08

    申请号：US11424055

    申请日：2006-06-14

    申请人： Jung-Jin Kim ,  Young-Hee Song ,  Dong-Ho Lee

    发明人： Jung-Jin Kim ,  Young-Hee Song ,  Dong-Ho Lee

    IPC分类号： H01L21/44 ,  H01L21/48

    CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2924/00 ,  H01L2924/00012

    摘要： Disclosed herein is a ball grid array (BGA) package stack that is not limited by ball arrangement because it utilizes a foldable circuit substrate, which permits interconnection between upper and lower individual BGA packages. The foldable circuit substrate has three portions. By bending the middle second portion, the foldable circuit substrate is folded in two. In the lower BGA package, an IC chip is attached on and electrically connected to a top surface of the first portion, and external connection terminals such as solder balls are formed on a bottom surface of the first portion. The top surface of the first portion is covered with a molding resin to protect the chip, and the third portion is placed on an upper surface of the molding resin. The upper BGA package is constructed in a similar manner to the lower BGA package as described above. For stacking, the interconnection terminals of the upper BGA package are joined and electrically connected to the third portion of the foldable circuit substrate of the lower BGA package.

    摘要翻译： 本文公开了一种球栅阵列（BGA）封装堆叠，其不受球布置的限制，因为它利用可折叠电路基板，其允许上部和下部单个BGA封装之间的互连。 可折叠电路基板具有三个部分。 通过弯曲中间第二部分，可折叠电路基板折叠成两个。 在较低的BGA封装中，IC芯片附着在电连接到第一部分的顶表面上，并且在第一部分的底表面上形成诸如焊球的外部连接端子。 第一部分的顶表面被模制树脂覆盖以保护芯片，并且第三部分被放置在模制树脂的上表面上。 上部BGA封装以与上述较低BGA封装类似的方式构造。 为了堆叠，上部BGA封装的互连端子被接合并电连接到下部BGA封装的可折叠电路基板的第三部分。