公开(公告)号：US08064228B2

公开(公告)日：2011-11-22

申请号：US12509814

申请日：2009-07-27

申请人： Shih-Chang Lee ,  Chung-Shu Lee

发明人： Shih-Chang Lee ,  Chung-Shu Lee

IPC分类号： H02M3/335

CPC分类号： H02M3/33569 ,  Y02B70/1433

摘要： A power supply apparatus with a current-sharing function includes a conversion circuit, a square-wave generating circuit, a resonant circuit, and a rectifier-filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and two secondary windings. More particularly, two secondary windings of the different transformers are electrically connected in series and then the two in-series secondary windings are electrically connected in parallel. The square-wave generating circuit is used to switch a DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier-filter circuit has at least two switch components and a second capacitor, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a DC output voltage, and the DC output voltage is outputted to at least one output terminal.

摘要翻译： 具有电流共享功能的电源装置包括转换电路，方波发生电路，谐振电路和整流滤波电路。 转换电路具有两个变压器，并且每个变压器具有初级绕组和两个次级绕组。 更具体地，不同变压器的两个次级绕组串联电连接，然后两个串联的次级绕组并联电连接。 方波发生电路用于将直流电压切换为脉动电压。 谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。 整流滤波电路具有至少两个开关部件和第二电容器，并且电连接到变压器的次级绕组以将AC输出电压整流为DC输出电压，并且将DC输出电压输出至少一个输出 终奌站。

公开(公告)号：US20100175746A1

公开(公告)日：2010-07-15

申请号：US12686169

申请日：2010-01-12

申请人： Rong-Ren LEE ,  Yung-Szu Su ,  Shih-Chang Lee

发明人： Rong-Ren LEE ,  Yung-Szu Su ,  Shih-Chang Lee

IPC分类号： H01L31/00 ,  H01L31/18

CPC分类号： H01L31/18 ,  H01L31/0725 ,  Y02E10/50

摘要： This application is related to a tandem solar cell device including a substrate, a first tunnel junction formed on the substrate, and a first p-n junction formed on the first tunnel junction wherein the first tunnel junction including a heavily doped n-type layer and an alloy layer wherein the alloy layer having an element with atomic number larger than that of Gallium.

摘要翻译： 该应用涉及包括衬底，形成在衬底上的第一隧道结和在第一隧道结上形成的第一pn结的串联太阳能电池器件，其中第一隧道结包括重掺杂n型层和合金 其中合金层具有原子序数大于镓的元素。

公开(公告)号：US06610924B1

公开(公告)日：2003-08-26

申请号：US09625023

申请日：2000-07-25

申请人： Shih-Chang Lee ,  Su Tao

发明人： Shih-Chang Lee ,  Su Tao

IPC分类号： H01L2302

CPC分类号： H01L23/544 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

摘要： A semiconductor package has a semiconductor chip disposed on a die pad and electrically connected to a plurality of leads arranged around the die pad. There are a plurality of tie bars connected to the die pad. Each tie bar extends from a corner of the die pad to a corresponding corner of the leadless semiconductor package. The semiconductor chip, the leads and the tie bars are encapsulated in a package body wherein the backside surface of the leads is exposed from the lower surface of the semiconductor package. All the tie bars of the semiconductor package are embedded in the package body except a part of at least one tie bar or an odd number of tie bars exposed from the lower surface of the semiconductor package to work as an indicial mark.

摘要翻译： 半导体封装具有设置在管芯焊盘上的半导体芯片，并且电连接到围绕管芯焊盘布置的多个引线。 存在连接到管芯焊盘的多个连接杆。 每个连接杆从芯片焊盘的角延伸到无引线半导体封装的相应角部。 半导体芯片，引线和连接条被封装在封装主体中，其中引线的背面从半导体封装的下表面露出。 半导体封装的所有连接条都嵌入在封装主体中，除了从半导体封装的下表面暴露的至少一个连接条或奇数个连接条的一部分作为指示标记之外。

公开(公告)号：US06524886B2

公开(公告)日：2003-02-25

申请号：US09863323

申请日：2001-05-24

申请人： Shih Chang Lee

发明人： Shih Chang Lee

IPC分类号： H01L2100

CPC分类号： H01L21/568 ,  H01L23/3107 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014

摘要： A method of making a leadless semiconductor package mainly comprising the steps of: attaching a tape onto the bottom of a lead frame; attaching a semiconductor chip to the die pad of the lead frame and electrically coupling the semiconductor chip to the leads of the lead frame; forming a package body over the semiconductor chip and the lead frame in a manner that each lead of the lead frame has at least a portion exposed from the bottom of the package body; removing the tape; and grinding the bottom of the package body as well as the exposed portions of the lead frame till each lead of the lead frame is less than about 1 mil thick thereby reducing the problems due to CTE mismatch between the leads and the package body.

摘要翻译： 一种制造无引线半导体封装的方法，主要包括以下步骤：将带附接到引线框的底部; 将半导体芯片附接到引线框架的管芯焊盘并将半导体芯片电耦合到引线框架的引线; 在半导体芯片和引线框架上形成封装主体，使得引线框架的每个引线具有从封装主体的底部露出的至少一部分; 取出胶带; 并且研磨包装体的底部以及引线框架的暴露部分，直到引线框架的每个引线小于约1密耳厚，从而减少了由于引线和封装体之间的CTE不匹配引起的问题。

公开(公告)号：US06380002B2

公开(公告)日：2002-04-30

申请号：US09839212

申请日：2001-04-23

申请人： Kao-Yu Hsu ,  Shih-Chang Lee

发明人： Kao-Yu Hsu ,  Shih-Chang Lee

IPC分类号： H01L2148

CPC分类号： H05K1/0271 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85444 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/111 ,  H05K2201/0394 ,  H05K2201/09781 ,  H05K2201/10734 ,  H05K2203/0315 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099 ,  H01L2924/00012

摘要： A flexible substrate based BGA package mainly comprises a semiconductor chip securely attached onto a flexible film substrate through a nonconductive adhesive. The flexible film substrate is formed from a flexible film having a chip attaching area for carrying the semiconductor chip. The upper surface of the flexible film is provided with a plurality of chip connection pads, a plurality of solder pads, and at least a dummy pad which is disposed centrally on the chip attaching area. The purpose of the dummy pad is to increase the rigidity and strength of the central part of the chip attaching area. The chip connection pads are arranged about the periphery of the chip attaching area for electrically connected to the semiconductor chip. The solder pads are disposed about the dummy pad(s) and electrically connected to the corresponding chip connection pads. The flexible film has a plurality of through-holes formed corresponding to the solder pads such that each solder pad has a portion exposed within the corresponding through-hole for mounting a solder ball. A package body is formed over the semiconductor chip and the upper surface of the flexible film substrate.

摘要翻译： 基于柔性基板的BGA封装主要包括通过非导电粘合剂牢固地附接到柔性膜基底上的半导体芯片。 柔性膜基板由具有用于承载半导体芯片的芯片附着区域的柔性膜形成。 柔性膜的上表面设置有多个芯片连接焊盘，多个焊盘和至少设置在芯片安装区域中央的虚拟焊盘。 虚拟焊盘的目的是增加芯片安装区域的中心部分的刚度和强度。 芯片连接焊盘围绕芯片安装区域的周边布置以电连接到半导体芯片。 焊盘围绕虚拟焊盘设置并电连接到相应的芯片连接焊盘。 柔性膜具有与焊料焊盘相对形成的多个通孔，使得每个焊盘具有暴露在相应通孔内的部分，用于安装焊球。 在半导体芯片和柔性膜基板的上表面上形成封装体。

公开(公告)号：US06257857B1

公开(公告)日：2001-07-10

申请号：US09494649

申请日：2000-01-31

申请人： Shih-Chang Lee ,  Gwo Liang Weng

发明人： Shih-Chang Lee ,  Gwo Liang Weng

IPC分类号： B29C4514

CPC分类号： B29C45/14655 ,  H01L21/565 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/181 ,  Y10T428/234 ,  Y10T428/24612 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A molding apparatus for use in forming a flexible substrate based package comprises a plurality of pots. Two flexible substrates are installed at two sides of the pots. A plurality of sets of chips mounted on the upper surface of the substrate wherein each set of chips is in an array arrangement. The molding apparatus further comprises a plurality of runners. Each runner independently extends from one side of the pot to one side of the substrate, and connects to a cavity of a upper part of a mold disposed on the substrate through a gate. The present invention characterized in that, the molding apparatus is provided with a first communication channel formed corresponding to one side of the substrate and a second communication channel formed corresponding to the other side of the substrate. The first and the second communication channels interconnect the cavities at two opposite sides thereof. Therefore, the molded product removed from the mold has a first and a second connection bar, which form interconnection at two opposite sides of each unit package body thereby integrating all unit package bodies, and thereby enhancing the mechanical strength of the molded product.

摘要翻译： 用于形成基于柔性基底的包装的成型装置包括多个盆。 两个柔性基板安装在锅的两侧。 安装在基板的上表面上的多组芯片，其中每组芯片是阵列布置。 成型装置还包括多个流道。 每个流道独立地从罐的一侧延伸到基板的一侧，并且通过浇口连接到设置在基板上的模具的上部的空腔。 本发明的特征在于，所述成型装置设置有与所述基板的一侧对应地形成的第一连通流路和与所述基板的另一侧对应地形成的第二连通流路。 第一和第二通信通道将空腔的两个相对侧互连。 因此，从模具中取出的模制产品具有第一和第二连接杆，其在每个单元封装主体的两个相对侧形成互连，从而整合所有单元封装主体，从而增强模制产品的机械强度。