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52 条记录 (耗时 0.022 秒)

    TANDEM SOLAR CELL
    1.
    发明申请
    TANDEM SOLAR CELL 审中-公开
    TANDEM太阳能电池

    公开(公告)号：US20100175746A1

    公开(公告)日：2010-07-15

    申请号：US12686169

    申请日：2010-01-12

    申请人： Rong-Ren LEE ,  Yung-Szu Su ,  Shih-Chang Lee

    发明人： Rong-Ren LEE ,  Yung-Szu Su ,  Shih-Chang Lee

    IPC分类号： H01L31/00 ,  H01L31/18

    CPC分类号： H01L31/18 ,  H01L31/0725 ,  Y02E10/50

    摘要： This application is related to a tandem solar cell device including a substrate, a first tunnel junction formed on the substrate, and a first p-n junction formed on the first tunnel junction wherein the first tunnel junction including a heavily doped n-type layer and an alloy layer wherein the alloy layer having an element with atomic number larger than that of Gallium.

    摘要翻译： 该应用涉及包括衬底，形成在衬底上的第一隧道结和在第一隧道结上形成的第一pn结的串联太阳能电池器件，其中第一隧道结包括重掺杂n型层和合金 其中合金层具有原子序数大于镓的元素。

    LIGHT-EMITTING DEVICE
    4.
    发明申请
    LIGHT-EMITTING DEVICE 有权
    发光装置

    公开(公告)号：US20120138892A1

    公开(公告)日：2012-06-07

    申请号：US13313645

    申请日：2011-12-07

    申请人： Rong-Ren Lee ,  Shih-Chang Lee ,  Chien-Fu Huang ,  Tsen-Kuei Wang

    发明人： Rong-Ren Lee ,  Shih-Chang Lee ,  Chien-Fu Huang ,  Tsen-Kuei Wang

    IPC分类号： H01L33/04

    CPC分类号： H01L27/15 ,  H01L33/08 ,  H01L33/32

    摘要： A light-emitting device comprises a substrate, and a light-emitting structure formed on the substrate. The light-emitting structure comprises a first active layer emitting the light with a first wavelength, and a second active layer emitting the light with a second wavelength. The light-emitting structure is formed by the first active layer and the second active layer stacked alternately.

    摘要翻译： 发光器件包括衬底和形成在衬底上的发光结构。 发光结构包括发射具有第一波长的光的第一有源层和发射具有第二波长的光的第二有源层。 发光结构由交替堆叠的第一有源层和第二有源层形成。

    Transformer with conductive plate winding structure
    6.
    发明授权
    Transformer with conductive plate winding structure 失效
    变压器带导电板绕组结构

    公开(公告)号：US08179222B2

    公开(公告)日：2012-05-15

    申请号：US12615341

    申请日：2009-11-10

    申请人： Chung-Shu Lee ,  Shih-Chang Lee ,  Chi-Hsien Weng ,  Fu-Teng Hou

    发明人： Chung-Shu Lee ,  Shih-Chang Lee ,  Chi-Hsien Weng ,  Fu-Teng Hou

    IPC分类号： H01F27/30

    CPC分类号： H01F27/2847 ,  H01F27/303

    摘要： A transformer with a conductive plate winding structure includes a hollow core pillar, a partition, a conductive plate winding structure, and an insulating layer. The partition is fixed at the hollow core pillar for partitioning the hollow core pillar into two winding areas. The conductive plate winding structure is sheathed to the hollow core pillar and disposed at one of the two winding areas, and comprised of a plurality of conductive plates, and each conductive plate includes a ring having an opening and two conductive terminals extended out from the opening of the ring. The insulating layer is clamped between any two adjacent conductive plates, such that the conductive plates are stacked to from a winding for increasing the rated normal current and enhancing the assembling convenience.

    摘要翻译： 具有导电板绕组结构的变压器包括中空芯柱，隔板，导电板绕组结构和绝缘层。 分隔件固定在空心芯柱上，用于将空心芯柱分隔成两个卷绕区域。 导电板绕组结构被套在中空芯柱上并且设置在两个绕组区域中的一个上并且由多个导电板构成，并且每个导电板包括具有开口的环和从开口延伸出的两个导电端子 的戒指 绝缘层被夹在任何两个相邻的导电板之间，使得导电板从绕组堆叠以增加额定正常电流并增强组装方便性。

    Current-Sharing Power Supply Apparatus With Bridge Rectifier Circuit
    7.
    发明申请
    Current-Sharing Power Supply Apparatus With Bridge Rectifier Circuit 审中-公开
    具有桥式整流电路的分流电源装置

    公开(公告)号：US20110069513A1

    公开(公告)日：2011-03-24

    申请号：US12562374

    申请日：2009-09-18

    申请人： Chung-Shu Lee ,  Shih-Chang Lee

    发明人： Chung-Shu Lee ,  Shih-Chang Lee

    IPC分类号： H02M3/335

    CPC分类号： H02M3/33569 ,  Y02B70/1433

    摘要： A current-sharing power supply apparatus with a bridge rectifier circuit includes a conversion circuit, a square-wave generating circuit, a resonant circuit, a rectifier circuit, and a filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and at least one secondary winding. The square-wave generating circuit is electrically connected to a DC voltage to switch the DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier circuit has at least four switch components, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a rectified voltage, and the rectified voltage is outputted to at least one voltage output terminal.

    摘要翻译： 具有桥式整流电路的分流电源装置包括转换电路，方波发生电路，谐振电路，整流电路和滤波电路。 转换电路具有两个变压器，并且每个变压器具有初级绕组和至少一个次级绕组。 方波发生电路与直流电压电连接，将直流电压切换成脉动电压。 谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。 整流电路具有至少四个开关元件，与变压器次级绕组电连接，将交流输出电压整流为整流电压，整流电压输出至少一个电压输出端子。

    POWER SUPPLY APPARATUS WITH CURRENT-SHARING FUNCTION
    8.
    发明申请
    POWER SUPPLY APPARATUS WITH CURRENT-SHARING FUNCTION 有权
    具有电流共享功能的电源设备

    公开(公告)号：US20110019439A1

    公开(公告)日：2011-01-27

    申请号：US12509814

    申请日：2009-07-27

    申请人： Shih-Chang Lee ,  Chung-Shu Lee

    发明人： Shih-Chang Lee ,  Chung-Shu Lee

    IPC分类号： H02M3/335

    CPC分类号： H02M3/33569 ,  Y02B70/1433

    摘要： A power supply apparatus with a current-sharing function includes a conversion circuit, a square-wave generating circuit, a resonant circuit, and a rectifier-filter circuit. The conversion circuit has two transformers, and each of the transformers has a primary winding and two secondary windings. More particularly, two secondary windings of the different transformers are electrically connected in series and then the two in-series secondary windings are electrically connected in parallel. The square-wave generating circuit is used to switch a DC voltage into a pulsating voltage. The resonant circuit is electrically connected to the square-wave generating circuit, and having a first capacitor and the primary windings of the transformers. The rectifier-filter circuit has at least two switch components and a second capacitor, and electrically connected to the secondary windings of the transformers to rectify an AC output voltage into a DC output voltage, and the DC output voltage is outputted to at least one output terminal.

    摘要翻译： 具有电流共享功能的电源装置包括转换电路，方波发生电路，谐振电路和整流滤波电路。 转换电路具有两个变压器，并且每个变压器具有初级绕组和两个次级绕组。 更具体地，不同变压器的两个次级绕组串联电连接，然后两个串联的次级绕组并联电连接。 方波发生电路用于将直流电压切换为脉动电压。 谐振电路电连接到方波发生电路，并且具有第一电容器和变压器的初级绕组。 整流滤波电路具有至少两个开关部件和第二电容器，并且电连接到变压器的次级绕组以将AC输出电压整流为DC输出电压，并且将DC输出电压输出至少一个输出 终奌站。

    Electronic package structure and the packaging process thereof
    9.
    发明授权
    Electronic package structure and the packaging process thereof 有权
    电子封装结构及其封装过程

    公开(公告)号：US07439619B2

    公开(公告)日：2008-10-21

    申请号：US11028718

    申请日：2005-01-03

    申请人： Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

    发明人： Chi-Chih Chu ,  Gwo-Liang Weng ,  Shih-Chang Lee

    IPC分类号： H01L23/34

    CPC分类号： H01L23/564 ,  H01L21/563 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83102 ,  H01L2224/83851 ,  H01L2224/90 ,  H01L2224/92125 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/0665 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The present invention provides an electronic packaging process. The surface of the chip carrier includes at least a chip attachment region and a film attachment region adjacent to the chip attachment region. At least a baffle is formed on the surface of the chip carrier, between the chip attachment region and the film attachment region. After attaching the thin film to the film attachment region of the chip carrier through an affixture layer, the chip is electrically and physically connected to the chip attachment region of the chip carrier through an adhesive layer. The baffle can effectively prevent the gas that is released from the adhesive layer from damaging the bonding between the thin film and the affixture layer. Therefore, almost no bubbles are formed and good electrical connection between the thin film and the affixture layer is maintained.

    摘要翻译： 本发明提供一种电子包装方法。 芯片载体的表面至少包括芯片附着区域和与芯片连接区域相邻的膜附着区域。 在芯片载体的表面上，在芯片安装区域和膜附着区域之间形成至少一个挡板。 在通过粘合层将薄膜附着到芯片载体的膜附着区域之后，芯片通过粘合剂层电连接并且物理地连接到芯片载体的芯片连接区域。 挡板可以有效地防止从粘合剂层释放的气体损害薄膜和固定层之间的粘结。 因此，几乎不形成气泡，并且保持薄膜和附着层之间良好的电连接。

    Semiconductor package
    10.
    发明授权
    Semiconductor package 有权
    半导体封装

    公开(公告)号：US07126221B2

    公开(公告)日：2006-10-24

    申请号：US10868495

    申请日：2004-06-14

    申请人： Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

    发明人： Gwo-Liang Weng ,  Yung-Li Lu ,  Chi-Chih Chu ,  Shih-Chang Lee

    IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L23/40

    CPC分类号： H05K3/305 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613 ,  H01L2924/00014

    摘要： A semiconductor package comprising a substrate and a semiconductor device disposed on the substrate by flip-chip bonding. The present invention is characterized by a connection structure disposed between the semiconductor device and the substrate that extends along the periphery of the bottom surface of the semiconductor device. As a result, it can preferably provide additional mounting support between the two. The connection structure can be formed from cured adhesive. The present invention also provides a method of manufacturing the semiconductor package.

    摘要翻译： 一种半导体封装，包括通过倒装芯片接合设置在衬底上的衬底和半导体器件。 本发明的特征在于设置在半导体器件和基板之间的连接结构，该连接结构沿着半导体器件的底表面的周边延伸。 结果，它可以优选地在两者之间提供附加的安装支撑。 连接结构可以由固化的粘合剂形成。 本发明还提供一种半导体封装的制造方法。