Abstract:
A nonvolatile semiconductor memory device according to one aspect includes a semiconductor substrate, a memory string, a plurality of first conductive layers, a second conductive layer, and a third conductive layer. The memory string has a plurality of memory cells, a dummy transistor and a back gate transistor connected in series in a direction perpendicular to the semiconductor substrate. The plurality of first conductive layers are electrically connected to gates of the memory cells. The second conductive layer is electrically connected to a gate of the dummy transistor. The third conductive layer is electrically connected to a gate of the back gate transistor. The second conductive layer is short-circuited with the third conductive layer.
Abstract:
According to one embodiment, a non-volatile semiconductor memory device comprises memory strings. Each memory string comprises a semiconductor layer, control gates, a first selection gate, and a second selection gate. A semiconductor layer comprises a pair of pillar portions which extend in a vertical direction to a substrate, and a coupling portion formed to couple the pair of pillar portions. Control gates orthogonally intersect one of the pair of pillar portions or the other of the pair of pillar portions. A first selection gate orthogonally intersects one of the pair of pillar portions and is formed above the control gates. A second selection gate orthogonally intersects the other of the pair of pillar portions, is formed above the control gates, and is on the same level as the first selection gate as well as integrated with the first selection gate.
Abstract:
There is provided a titanium alloy for corrosion-resistant materials, which contains 0.01-0.12% by mass in total of at least one of platinum group elements; at least Si and one of, or both of, Sn and Mn, selected from the group consisting of Al, Cr, Zr, Nb, Si, Sn and Mn, wherein the total content of Al, Cr, Zr, Nb, Si, Sn and Mn is 5% by mass or less; and the residue comprising Ti and impurities.
Abstract:
A non-volatile semiconductor storage device includes a control circuit performing an erase operation to erase data from a selected one of memory transistors. The control circuit applies a first voltage to the other end of selected one of selection transistors, causes the selected one of the selection transistors to turn on, and causes any one of the memory transistors to turn on that is closer to the selection transistor than the selected one of the memory transistors. The control circuit also applies a second voltage lower than the first voltage to a gate of the selected one of the memory transistors. Such a potential difference between the first voltage and the second voltage causing a change in electric charges in the electric charge storage layer.
Abstract:
A non-volatile semiconductor storage device includes: a memory string including a plurality of memory cells connected in series; a first selection transistor having one end connected to one end of the memory string; a first wiring having one end connected to the other end of the first selection transistor; a second wiring connected to a gate of the first selection transistor. A control circuit is configured to boost voltages of the second wiring and the first wiring in the erase operation, while keeping the voltage of the first wiring greater than the voltage of the second wiring by a certain potential difference. The certain potential difference is a potential difference that causes a GIDL current.
Abstract:
In a nonvolatile semiconductor memory device, a stacked body is formed by alternately stacking dielectric films and conductive films on a silicon substrate and a plurality of through holes extending in the stacking direction are formed in a matrix configuration. A shunt interconnect and a bit interconnect are provided above the stacked body. Conductor pillars are buried inside the through holes arranged in a line immediately below the shunt interconnect out of the plurality of through holes, and semiconductor pillars are buried inside the remaining through holes. The conductive pillars are formed from a metal, or low resistance silicon. Its upper end portion is connected to the shunt interconnect and its lower end portion is connected to a cell source formed in an upper layer portion of the silicon substrate.
Abstract:
A charged particle beam exposure apparatus which splits a charged-particle beam from a charged-particle beam source into a plurality of charged-particle beams by a plurality of apertures formed in an aperture array to expose a wafer using the plurality of charged-particle beams. The apparatus includes a stage on which the wafer is loaded, the wafer being irradiated with the plurality of charged-particle beams, which have been passed through the apertures of the aperture array, a plurality of detection electrodes which detect intensities of the plurality of charged-particle beams passing through the plurality of apertures of the aperture array to expose the wafer with the plurality of charged-particle beams, the plurality of detection electrodes being formed on the charged-particle beam source side of the light-shielding peripheral regions of the plurality of apertures of the aperture array, and a grid array which adjusts the intensities of the plurality of charged-particle beams on the basis of detection results obtained by the plurality of detection electrodes.
Abstract:
To produce activated carbon for an electrode of an electric double-layer capacitor, the following steps are carried out sequentially: a step of subjecting a massive mesophase pitch to a pulverizing treatment to provide a pulverized powder; a step of subjecting the pulverized powder to an infusibilizing treatment under conditions of a temperature in a range of 300° C. (inclusive) to 450° C. (inclusive) in the atmospheric air current, a step of subjecting the pulverized powder to a carbonizing treatment under conditions of a temperature in a range of 600° C. (inclusive) to 900° C. (inclusive) in an inert gas current to provide a carbonized powder, a step of subjecting the carbonized powder to an alkali activating treatment under conditions of a temperature in a range of 500° C. (inclusive) to 1,000° C. (inclusive) in an inert gas atmosphere, followed by the post treatments, thereby producing alkali-activated carbon, and a step of subjecting the alkali-activated carbon to a pulverizing treatment. If an electrode is produced using the activated carbon, the electrode density can be increased.
Abstract:
System for detecting stability/instability of behavior of a motor vehicle upon occurrence of tire slip or lock. State of the motor vehicle is determined on the basis of an alignment torque (Ta) applied from a road and a side slip angle (β). By taking advantage of such torque/slip-angle characteristic that although the alignment torque is proportional to a side slip angle when the latter is small, the alignment torque becomes smaller as the side slip angle increases, a normal value is determined from a straight line slope and the side slip angle in a region where the latter is small. Unstable behavior of the motor vehicle is determined when deviation of actual measured value from the normal value increases. Further, unstable state is determined when the slope of the alignment torque for the slip angle departs significantly from that of approximate straight line slope.
Abstract:
An access priority in bus arbitration is changed based on a cache hit ratio so as to perform the bus arbitration. In order to perform the bus arbitration, a cache hit ratio measuring device investigates a status of a cache access by a bus master. A bus arbitration managing device changes a priority in a priority storing device based on an information outputted from the cache hit ratio measuring device. Then, a bus arbitration device performs the bus arbitration in accordance with the priority.