公开(公告)号：US20130210110A1

公开(公告)日：2013-08-15

申请号：US13437340

申请日：2012-04-02

Applicant: Ming-Yu Lin ,  Yuh-Shyong Yang ,  Yen-Pei Lu ,  Chih-Heng Lin

Inventor： Ming-Yu Lin ,  Yuh-Shyong Yang ,  Yen-Pei Lu ,  Chih-Heng Lin

IPC: C12N11/16 ,  C07K14/195 ,  C07K14/00

CPC classification number: C12N11/14

Abstract: A method that modifies surface properties of a substrate by manipulating the immobilized biomolecules in mild biological condition. The manipulation comprised steps of: providing a biomolecule combined with at least one ssDNA combined with a first protein through an affinity binding tag; adding a second ssDNA conjugated with a second protein with a concentration greater than that of the first protein; and replacing the first protein on the ssDNA with the second protein through chemical competitive principle. The invention may comprise the steps with proper design of biotinylated DNA probes, the functionalized ssDNA nanotemplates can be recovered to its unbound state through a thermodynamic principle.

Abstract translation: 通过在温和的生物学条件下操纵固定化的生物分子来修饰底物的表面性质的方法。 操作包括以下步骤：通过亲和结合标签提供与至少一种与第一蛋白质组合的ssDNA组合的生物分子; 加入与第二种蛋白质缀合的第二种ssDNA，其浓度大于第一种蛋白质的浓度; 并通过化学竞争原理用ssDNA替代第二个蛋白质上的第一个蛋白质。 本发明可以包括具有适当设计生物素化DNA探针的步骤，功能化的ssDNA纳米模板可以通过热力学原理回收到其未结合状态。

公开(公告)号：US08497199B1

公开(公告)日：2013-07-30

申请号：US13569371

申请日：2012-08-08

Applicant: Der-Jun Jan ,  Shih-Shou Lo ,  Chen-Yu Lin

Inventor： Der-Jun Jan ,  Shih-Shou Lo ,  Chen-Yu Lin

IPC: H01L21/44

CPC classification number: H01L31/022483 ,  H01L21/02554 ,  H01L21/02576 ,  H01L21/02601 ,  H01L21/02628

Abstract: The present invention relates to a method for fabricating a thin film formed with a uniform single-size monolayer of spherical AZO nanoparticles. Because of its own advantages in cost and transparency, Al-doped ZnO (AZO) transparent conductive film is becoming the most commonly used transparent conducting oxide (TCO) replacement for solar cells. In this invention, a colloidal chemical means is adopted for enabling a chemical reaction between metal salts, water, and polyhydric alcohols at a room-temperature environment, and thereby, a process for fabricating spherical AZO nanoparticles in a diameter ranged between 100 nm to 400 nm according to different parameter configurations can be achieved while controlling the actual Al/Zn ratio to be ranged between 0.1% to 3%. In addition, a dip coating means is adopted for densely distributing the spherical AZO nanoparticles on a substrate into a monolayer close-packed structure.

Abstract translation: 本发明涉及一种用均匀的单尺寸单球形AZO纳米颗粒制成薄膜的方法。 由于其自身的成本和透明度优势，Al掺杂的ZnO（AZO）透明导电膜正在成为太阳能电池最常用的透明导电氧化物（TCO）替代品。 在本发明中，采用胶体化学方法，可在室温环境下使金属盐，水和多元醇发生化学反应，从而制备直径范围为100nm至400nm的球形AZO纳米颗粒的方法 可以实现不同参数配置，同时控制实际的Al / Zn比在0.1％到3％之间。 此外，采用浸涂装置将底物上的球形AZO纳米颗粒密集分布成单层密堆积结构。

公开(公告)号：US08493705B2

公开(公告)日：2013-07-23

申请号：US12982004

申请日：2010-12-30

Applicant: Chun-Yu Lin ,  Li-Wei Chu ,  Ming-Dou Ker ,  Ming-Hsien Tsai ,  Ping-Fang Hung ,  Ming-Hsiang Song

Inventor： Chun-Yu Lin ,  Li-Wei Chu ,  Ming-Dou Ker ,  Ming-Hsien Tsai ,  Ping-Fang Hung ,  Ming-Hsiang Song

IPC: H02H9/04 ,  H01L29/66

CPC classification number: H02H9/046 ,  H01L27/0262 ,  H03F3/24 ,  H04B1/0475 ,  H04B2001/0408

Abstract: A representative electrostatic discharge (ESD) protection circuit includes a silicon-controlled rectifier (SCR) that is electrically coupled to the output of a power amplifier; an ESD detection circuit that triggers the SCR responsive to detect an electrostatic discharge on an ESD bus; and an ESD clamp circuit that is coupled to the first voltage line.

Abstract translation: 代表性的静电放电（ESD）保护电路包括电耦合到功率放大器的输出的硅控整流器（SCR）; ESD检测电路，其触发SCR响应于检测ESD总线上的静电放电; 以及耦合到第一电压线的ESD钳位电路。

公开(公告)号：US20130181099A1

公开(公告)日：2013-07-18

申请号：US13454341

申请日：2012-04-24

Applicant: An Szu HSU ,  Chien Yu LIN

Inventor： An Szu HSU ,  Chien Yu LIN

IPC: H05K7/00

CPC classification number: A47B23/043 ,  F16M11/041 ,  F16M11/105 ,  F16M11/2021 ,  F16M13/00 ,  F16M2200/024

Abstract: A support structure for tablet display apparatus includes a support member and a connection assembly. The support member has a first end section and a second end section opposite to the first end section. The first end section is connected with the connection assembly via an angle adjustment seat, whereby the connection assembly can be rotated or tilted relative to the angle adjustment seat and located. The connection assembly is formed with a receiving space for receiving a tablet display apparatus. The second end section of the support member is pivotally connected with a base seat. Accordingly, the tablet display apparatus can be rotated and tilted by different angles and supported in an inclined position in adaptation to different situations and requirements.

Abstract translation: 平板显示装置的支撑结构包括支撑构件和连接组件。 支撑构件具有与第一端部相对的第一端部部分和第二端部部分。 第一端部通过角度调节座与连接组件连接，由此连接组件可相对于角度调整座旋转或倾斜并定位。 连接组件形成有用于接收图形输入板显示装置的容纳空间。 支撑构件的第二端部与基座枢转连接。 因此，平板显示装置可以以不同的角度旋转和倾斜，并且在适应不同情况和要求的情况下以倾斜位置支撑。

公开(公告)号：US08470621B2

公开(公告)日：2013-06-25

申请号：US12722231

申请日：2010-03-11

Applicant: Chester Kuo ,  Lung Hsin Chen ,  Wen Liang Tseng ,  Shih Cheng Huang ,  Po Min Tu ,  Ying Chao Yeh ,  Wen Yu Lin ,  Peng Yi Wu ,  Shih Hsiung Chan

Inventor： Chester Kuo ,  Lung Hsin Chen ,  Wen Liang Tseng ,  Shih Cheng Huang ,  Po Min Tu ,  Ying Chao Yeh ,  Wen Yu Lin ,  Peng Yi Wu ,  Shih Hsiung Chan

IPC: H01L33/48 ,  H01L27/15 ,  H01L33/00

CPC classification number: H01L33/62 ,  H01L27/156 ,  H01L33/0079 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/00014

Abstract: A method for fabricating flip-chip semiconductor optoelectronic devices initially flip-chip bonds a semiconductor optoelectronic chip attached to an epitaxial substrate to a packaging substrate. The epitaxial substrate is then separated using lift-off technology.

Abstract translation: 用于制造倒装芯片半导体光电器件的方法首先将连接到外延衬底的半导体光电芯片倒装芯片结合到封装衬底。 然后使用剥离技术分离外延衬底。

公开(公告)号：US20130156064A1

公开(公告)日：2013-06-20

申请号：US13572774

申请日：2012-08-13

Applicant: XIA XU ,  WEN-MING YI ,  YU-LIN LIU

Inventor： XIA XU ,  WEN-MING YI ,  YU-LIN LIU

IPC: G01R31/00

CPC classification number: G01R31/317 ,  G01R31/31721

Abstract: A system for testing electronic device includes an electronic device, a temperature detecting module, a testing instrument and a testing computer. The testing electronic includes a main board and a power supply. The main board includes a slot and a card inserted in the slot. A plurality of dummy loads is located on the card. The slot includes at least one voltage interface. The power supply includes at least one power wire electrically connected to the at least one voltage interface. The temperature detecting module detects temperature signals of the plurality of dummy loads. The testing instrument is electrically connected to the at least one power wire to test current signals or power signals of the at least one power wire. The testing computer receives and displays the temperature signals, the current signals and the power signals.

Abstract translation: 一种用于电子设备测试的系统包括电子设备，温度检测模块，测试仪器和测试计算机。 测试电子包括主板和电源。 主板包括插槽和插入插槽中的卡。 多个虚拟负载位于卡上。 该插槽包括至少一个电压接口。 电源包括电连接到至少一个电压接口的至少一个电源线。 温度检测模块检测多个虚拟负载的温度信号。 所述测试仪器电连接到所述至少一个电源线以测试所述至少一根电源线的当前信号或功率信号。 测试电脑接收并显示温度信号，电流信号和电源信号。

公开(公告)号：US20130155743A1

公开(公告)日：2013-06-20

申请号：US13563814

申请日：2012-08-01

Applicant: ZHI-YONG GAO ,  YUN-FEI ZHANG ,  YU-LIN LIU

Inventor： ZHI-YONG GAO ,  YUN-FEI ZHANG ,  YU-LIN LIU

IPC: H02M7/06

CPC classification number: G01R31/40 ,  G01R19/16576 ,  Y10T307/878

Abstract: A power supply switch apparatus includes a voltage decreasing circuit, a rectification circuit, a comparison circuit, and a control circuit. The voltage decreasing circuit receives a first alternating voltage output from a power supply and converts the first alternating voltage to a second alternating voltage. The rectification circuit receives the second alternating voltage and converts the second alternating voltage to a first direct voltage. The voltage regulating circuit receives the first direct voltage and converts the first direct voltage to a second direct voltage. The comparison circuit receives the second direct voltage, compares the second direct voltage with a reference voltage, and outputs a control signal. The control circuit receives the control circuit and connects the power supply to different circuits according to the control circuit.

Abstract translation: 电源开关装置包括降压电路，整流电路，比较电路和控制电路。 电压降低电路接收从电源输出的第一交流电压，并将第一交流电压转换为第二交流电压。 整流电路接收第二交流电压，并将第二交流电压转换为第一直流电压。 电压调节电路接收第一直流电压并将第一直流电压转换成第二直流电压。 比较电路接收第二直流电压，将第二直流电压与参考电压进行比较，并输出控制信号。 控制电路接收控制电路，并根据控制电路将电源连接到不同的电路。

公开(公告)号：US20130153272A1

公开(公告)日：2013-06-20

申请号：US13598842

申请日：2012-08-30

Applicant: HSING-HUI CHIU ,  PEI-JYUN SU ,  SZE-YU LIN

Inventor： HSING-HUI CHIU ,  PEI-JYUN SU ,  SZE-YU LIN

IPC: H05K1/09

CPC classification number: H05K1/0215 ,  H05K1/116 ,  H05K3/28 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/0949 ,  H05K2201/09618 ,  H05K2201/10409

Abstract: A printed circuit board includes a top layer, a bottom layer, and a mounting hole vertically extending through the top layer and the bottom layer. A first copper ring is located on a top surface of the top layer and around the mounting hole. A second copper ring is located a bottom surface of the bottom layer and around the mounting hole. A number of first pads are positioned on the first copper ring. A number of second pads are positioned on the second copper ring. The first and second copper rings are covered with solder mask, but the first and second pads are not covered with the solder mask.

Abstract translation: 印刷电路板包括顶层，底层和垂直延伸穿过顶层和底层的安装孔。 第一铜环位于顶层的顶表面和安装孔周围。 第二个铜环位于底层的底部表面，并位于安装孔周围。 多个第一焊盘位于第一铜环上。 多个第二垫位于第二铜环上。 第一和第二铜环用焊接掩模覆盖，但第一和第二焊盘不被焊接掩模覆盖。

公开(公告)号：US20130153192A1

公开(公告)日：2013-06-20

申请号：US13426598

申请日：2012-03-22

Applicant: Chia-Yu Lin

Inventor： Chia-Yu Lin

IPC: F28F7/00

CPC classification number: H01L21/4882 ,  H01L23/3672 ,  H01L23/3677 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat dissipating device includes a base and a plurality of heat dissipating fins. The base includes a substrate and a box, wherein the substrate and the box are formed integrally and the box has an accommodating space therein. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Abstract translation: 散热装置包括基座和多个散热翅片。 底座包括基底和盒子，其中基底和盒体一体地形成，并且盒体中具有容纳空间。 每个散热片包括散热部分，固定部分和防溢出结构。 固定部分固定在基座中。 防溢结构连接在散热部和固定部之间。 防溢结构的宽度大于散热部的宽度，大于固定部的宽度。

公开(公告)号：US20130153189A1

公开(公告)日：2013-06-20

申请号：US13329313

申请日：2011-12-18

Applicant: Chia-Yu Lin ,  Yen Tsai

Inventor： Chia-Yu Lin ,  Yen Tsai

IPC: F28F7/00 ,  B22D19/00 ,  B21D53/02

CPC classification number: B23P15/26 ,  B21D53/02 ,  B22D19/0063 ,  B23P2700/10 ,  F28F3/00 ,  F28F3/022 ,  F28F3/06 ,  F28F2275/14 ,  H01L23/367 ,  H01L23/3677 ,  H01L2924/0002 ,  Y10T29/4935 ,  H01L2924/00

Abstract: A heat dissipating device includes a base and a plurality of heat dissipating fins. Each of the heat dissipating fins includes a heat dissipating portion, a fixing portion and an overflow-proof structure. The fixing portion is fixed in the base. The overflow-proof structure is connected between the heat dissipating portion and the fixing portion. A width of the overflow-proof structure is larger than a width of the heat dissipating portion and larger than a width of the fixing portion.

Abstract translation: 散热装置包括基座和多个散热翅片。 每个散热片包括散热部分，固定部分和防溢出结构。 固定部分固定在基座中。 防溢结构连接在散热部和固定部之间。 防溢结构的宽度大于散热部的宽度，大于固定部的宽度。