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145 条记录 (耗时 0.028 秒)

    LATENT HARDENER, PROCESS FOR PRODUCING THE SAME, AND ADHESIVE CONTAINING LATENT HARDENER
    63.
    发明申请
    LATENT HARDENER, PROCESS FOR PRODUCING THE SAME, AND ADHESIVE CONTAINING LATENT HARDENER 有权
    最佳硬化剂，其生产方法和含有最终硬化剂的胶粘剂

    公开(公告)号：US20100143604A1

    公开(公告)日：2010-06-10

    申请号：US12703104

    申请日：2010-02-09

    申请人： Takayuki Matsushima ,  Masao Saito

    发明人： Takayuki Matsushima ,  Masao Saito

    IPC分类号： B05D1/18

    CPC分类号： C09J163/00 ,  C08G59/18 ,  C08G59/188 ,  C08G59/682 ,  C08G59/70 ,  C08J3/241 ,  Y10T156/10 ,  Y10T428/2998

    摘要： A latent curing agent (30) of the present invention includes a core member (31) and a capsule (37) covering up the surface of the core member (31). The core member (31) includes a secondary particle (32) and a curing agent (35) retained in a gap (38) of the secondary particle (32). The curing agent (35) is liquid at ambient temperature. When the capsule (37) is destructed so that the curing agent (35) is emitted into an adhesive, the curing agent (35) is mixed with other ingredients in the adhesive. A metal alcoholate which is liquid at ambient temperature or a metal chelate which is liquid at ambient temperature is used as the curing agent (35), while a silane coupling agent is added to the adhesive. A reaction takes place between the curing agent (35) and the silane coupling agent to yield cations. By these cations, the epoxy resin undergoes cation in polymerization. Since the cation generating reaction proceeds at a temperature lower than in the case of the conventional adhesive, curing proceeds more promptly and at a lower temperature than in the case of the conventional adhesive.

    摘要翻译： 本发明的潜在性固化剂（30）包括芯部件（31）和覆盖在芯部件（31）的表面上的胶囊（37）。 芯构件（31）包括保留在二次颗粒（32）的间隙（38）中的二次颗粒（32）和固化剂（35）。 固化剂（35）在环境温度下为液体。 当胶囊（37）被破坏使得固化剂（35）被发射到粘合剂中时，固化剂（35）与粘合剂中的其它成分混合。 在环境温度下为液体的金属醇化物或在环境温度下为液体的金属螯合物用作固化剂（35），同时将硅烷偶联剂加入到粘合剂中。 在固化剂（35）和硅烷偶联剂之间发生反应以产生阳离子。 通过这些阳离子，环氧树脂在聚合中经历阳离子。 由于阳离子产生反应在比常规粘合剂的情况下低的温度下进行，所以在常规粘合剂的情况下，固化进行得更快且温度更低。

    Semiconductor Device
    64.
    发明申请
    Semiconductor Device 审中-公开
    半导体器件

    公开(公告)号：US20090091892A1

    公开(公告)日：2009-04-09

    申请号：US12234771

    申请日：2008-09-22

    申请人： Takukazu Otsuka ,  Keiji Okumura ,  Masao Saito

    发明人： Takukazu Otsuka ,  Keiji Okumura ,  Masao Saito

    IPC分类号： H05K7/20

    CPC分类号： H05K7/20918 ,  H01L2224/49171 ,  H01L2924/30107 ,  H02M7/003 ,  H05K7/1432 ,  H01L2924/00

    摘要： A semiconductor device includes: a first output unit configured to output a first phase; a second output unit configured to output a second phase different from the first phase, the second output unit being disposed on a plane intersecting with a plane having the first output unit disposed thereon; and a controller configured to control the output units.

    摘要翻译： 半导体器件包括：第一输出单元，被配置为输出第一相位; 第二输出单元，被配置为输出与所述第一相不同的第二相，所述第二输出单元设置在与其上设置有所述第一输出单元的平面相交的平面上; 以及控制器，被配置为控制所述输出单元。

    Two-pack type adhesive
    66.
    发明授权
    Two-pack type adhesive 有权
    双组分胶粘剂

    公开(公告)号：US07491290B2

    公开(公告)日：2009-02-17

    申请号：US10505489

    申请日：2003-02-14

    申请人： Takayuki Matsushima ,  Masao Saito

    发明人： Takayuki Matsushima ,  Masao Saito

    IPC分类号： C09J163/00 ,  B32B27/38

    CPC分类号： H05K3/323 ,  C08G59/18 ,  C08J3/243 ,  C08L63/00 ,  C09J9/02 ,  C09J163/00 ,  H01L2224/16 ,  H01L2224/83101 ,  H05K2201/0239 ,  H05K2201/0379 ,  H05K2203/1163 ,  H05K2203/121 ,  Y10T428/31511 ,  Y10T428/31515

    摘要： Disclosed is a two-component adhesive used for electrically and mechanically interconnecting two objects for bonding. The two-component adhesive is made up by first and second adhesive materials separately containing first and second curing agents, respectively. It is only after reaction of the first and second curing agents that the first and second resin components are polymerized. As long as the two adhesive materials are isolated from each other, the adhesive is not cured. In case a metal chelate or a metal alcoholate is used as the first curing agent and a silane coupling agent is used as the second curing agent, cations as a curing component are isolated to cause cationinc polymerization of the first and second resin components to allow for curing at a lower temperature in a shorter time than in case a conventional adhesive is used.

    摘要翻译： 公开了一种双组分粘合剂，用于将两个物体电连接和机械互连以进行粘结。 双组分粘合剂分别由分别含有第一和第二固化剂的第一和第二粘合剂材料制成。 仅在第一和第二固化剂反应之后，第一和第二树脂组分聚合。 只要两种粘合剂材料彼此分离，粘合剂就不会固化。 在使用金属螯合物或金属醇化物作为第一固化剂并且使用硅烷偶联剂作为第二固化剂的情况下，分离作为固化组分的阳离子以使第一和第二树脂组分的阳离子聚合以允许 在比使用常规粘合剂的情况下更短的时间内在较低温度下固化。

    Optical switch
    69.
    发明授权
    Optical switch 失效
    光开关

    公开(公告)号：US06961485B2

    公开(公告)日：2005-11-01

    申请号：US10648864

    申请日：2003-08-25

    申请人： Michikazu Kondo ,  Kei Chiba ,  Masao Saito

    发明人： Michikazu Kondo ,  Kei Chiba ,  Masao Saito

    IPC分类号： G02B26/08 ,  G02B6/35

    CPC分类号： G02B6/3572 ,  G02B6/3514 ,  G02B6/3528 ,  G02B6/3546 ,  G02B6/355

    摘要： An optical switch has an electromagnetic driving mechanism that includes a U-shaped magnetic core having an intermediate portion between two leg parts, a coil wound on the U-shaped magnetic core, an armature having two end portions that can face each other on the two leg parts and supported in such a manner that the armature can make an oscillating motion, and a permanent magnet arranged to apply a magnetic flux to the U-shaped magnetic core and the armature. The optical switch also has a mirror as an optical path switching unit directly fixed on the armature, an incidence-side optical fiber for making light incident on the mirror, and emission-side optical fibers where the light with its optical path switched by the mirror is coupled.

    摘要翻译： 光开关具有电磁驱动机构，该电磁驱动机构包括U形磁芯，该U形磁芯具有两个腿部之间的中间部分，缠绕在U形磁芯上的线圈，具有两个端部的电枢， 腿部，并且以使得电枢能够进行摆动的方式被支撑，以及设置成将磁通量施加到U形磁芯和电枢的永磁体。 光开关还具有作为直接固定在电枢上的光路切换单元的反射镜，用于使入射在反射镜上的光的入射侧光纤和其反射镜的光路切换的发光侧光纤 被耦合。