摘要:
A large area optical diagnosis apparatus and the operating method thereof are disclosed. The large area optical diagnosis apparatus includes a light source, a light path structure, and a sensing module. The light source is used to at least emit a coherent light. The light path structure includes a plurality of optical units used for dividing the coherent light into a plurality of first incident lights and a plurality of second incident lights. The plurality of first incident lights are emitted toward an object to be diagnosed and the plurality of second incident lights are emitted toward a reference end. The object to be diagnosed and the reference end reflect the plurality of first incident lights and the plurality of second incident lights to be a plurality of reflected lights. The sensing module senses the plurality of reflected lights to generate a sensing result related to the object to be diagnosed.
摘要:
An endoscopy apparatus having high degree of motion freedom and the operating method thereof are disclosed. The endoscopy apparatus having high degree of motion freedom includes a multi-stage endoscopy module and a control module. The multi-stage endoscopy module includes at least a first endoscopy unit and a second endoscopy unit. The first endoscopy unit and the second endoscopy unit can provide a first bending and a second bending respectively. The second bending is larger than the first bending. When the multi-stage endoscopy module moves to a region near a target observing position, the control module will control the second endoscopy unit to generate slight deformation to observe a real-time state of the target observing position.
摘要:
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要:
An optical touch apparatus and operating method thereof are disclosed. The optical touch apparatus comprises an optical module, a light sensing module, and a processing module. The optical module and the light sensing module are set at a first side and an opposite second side of a surface of the optical touch apparatus respectively. The optical module receives a light source and uniformly emits a plurality of lights. When at least one of the plurality of lights is blocked by an object above the surface, the light sensing module generates a sensing result based on the condition of receiving the plurality of lights. The processing module determines a touch point location corresponding to the object on the surface based on the sensing result.
摘要:
The invention discloses an integrated circuit package. The integrated circuit package comprises a substrate having a first surface and a second surface opposite thereto and a first hole passing through the substrate from the first surface to the second surface. A plurality of conductive lines is disposed on a portion of the second surface of the substrate. A semiconductor chip is disposed above the second surface of the substrate, wherein a chamber is formed between the semiconductor chip and the substrate. A plurality of bonding pads are disposed on a side of the semiconductor chip which is toward the second surface of the substrate, wherein at least one of the bonding pads are electrically connected to one of the plurality of conductive lines. A first heat dissipation layer is disposed in the first hole, and extends into the chamber. A method for fabricating the integrated circuit package is also provided.
摘要:
The invention provides a semiconductor device package. The package includes a chip disposed on a supported board and a conductive path formed between the chip and the supported board, on the backside of the supported board, or on the chip, so that the conductive path does not have to go around a region where the chip is located. Accordingly, the dimensions of the semiconductor device package are reduced.
摘要:
An apparatus for driving a fluid includes a substrate, at least one electrode group and a controlling unit. The substrate has at least one plane. The electrode group is disposed on the substrate and includes a first electrode, a second electrode and a third electrode. A projecting position of the second electrode on the plane is disposed between that of the first electrode and that of the third electrode. The controlling unit electrically connected to electrode group is for driving the first to third electrodes. When the controlling unit drives the first to third electrodes to make the first and third electrodes have opposite polarities and to make the second and third electrodes have the same polarity, an electric field produced by the electrode group enables the fluid on the substrate to flow from the first electrode to the third electrode.
摘要:
An SRAM write assist apparatus comprises a timer unit and a voltage divider. The voltage divider unit is configured to divide a voltage potential down to a lower level. The output of the voltage divider is connected to a memory cell in a write operation. The timer unit is configured to generate a pulse having a width inversely proportional to the voltage potential applied to a memory chip. Furthermore, the timer unit controls the period in which a lower voltage from the output of the voltage divider is applied to the memory cell. Moreover, external level and timing programmable signals can be used to further adjust the voltage divider's ratio and the pulse width from the timer unit. By employing the SRAM write assist apparatus, a memory chip can perform a reliable and fast write operation.
摘要:
An internal clock gating apparatus comprises a static logic block and a domino logic block. The static logic block is configured to receive a clock signal and a clock enable signal. The domino logic block is configured to receive the clock signal and a control signal from an output of the static logic block. The static logic block and the domino logic block are further configured such that an output of the domino logic block generates a signal similar to the clock signal in phase when the clock enable signal has a logic high state. On the other hand, the output of the domino logic block generates a logic low signal when the clock enable signal has a logic low state. Furthermore, the static logic block and the domino logic block can reduce the setup time and delay time of the internal clock gating apparatus respectively.
摘要:
An internal clock gating apparatus comprises a static logic block and a domino logic block. The static logic block is configured to receive a clock signal and a clock enable signal. The domino logic block is configured to receive the clock signal and a control signal from an output of the static logic block. The static logic block and the domino logic block are further configured such that an output of the domino logic block generates a signal similar to the clock signal in phase when the clock enable signal has a logic high state. On the other hand, the output of the domino logic block generates a logic low signal when the clock enable signal has a logic low state. Furthermore, the static logic block and the domino logic block can reduce the setup time and delay time of the internal clock gating apparatus respectively.