摘要:
A method of manufacturing a power device includes forming a first drift region on a substrate. A trench is formed by patterning the first drift region. A second drift region is formed by growing n-gallium nitride (GaN) in the trench, and alternately disposing the first drift region and the second drift region. A source electrode contact layer is formed on the second drift region. A source electrode and a gate electrode are formed on the source electrode contact layer. A drain electrode is formed on one side of the substrate which is an opposite side of the first drift region.
摘要:
A nitride based semiconductor package includes a nitride based semiconductor device, a package substrate, and a bonding substrate. The semiconductor device includes, on a surface thereof, a first electrode pattern having a source electrode, a drain electrode and a gate electrode. The bonding substrate includes, on a first surface thereof, a second electrode pattern corresponding to the first electrode pattern, and at least one first groove pattern. The first groove pattern exposes the second electrode pattern. The first electrode pattern is received in the at least one first groove pattern. The second electrode pattern is bonded to the first electrode pattern received in the at least one first groove pattern. A second surface of the bonding substrate is bonded to the package substrate.
摘要:
Provided is a power device. The power device may include a two-dimensional electron gas (2-DEG) layer in a portion corresponding to a gate electrode pattern since a second nitride layer is further formed on a lower portion of the gate electrode pattern after a first nitride layer is formed and thus, may be capable of performing a normally-OFF operation. Accordingly, the power device may adjust generation of the 2-DEG layer based on a voltage of a gate, and may reduce power consumption. The power device may regrow only the portion corresponding to the gate electrode pattern or may etch a portion excluding the portion corresponding to the gate electrode pattern and thus, a recess process may be omissible, a reproducibility of the power device may be secured, and a manufacturing process may be simplified.
摘要:
Disclosed herein is a camera module. The camera module according to preferred embodiments of the present invention includes: a housing; a printed circuit board disposed in the housing and having a heat dissipating hole formed at a first side thereof; an image sensor bonded to the printed circuit board and disposed on one surface of the heat dissipating hole; and a heat dissipating part having one side contacting the image sensor and the printed circuit board through the heat dissipating hole and the other side disposed at the outside of the housing to discharge heat generated from the image sensor and the printed circuit board to the outside of the housing.
摘要:
Provided is a power device. The power device may include a two-dimensional electron gas (2-DEG) layer in a portion corresponding to a gate electrode pattern since a second nitride layer is further formed on a lower portion of the gate electrode pattern after a first nitride layer is formed and thus, may be capable of performing a normally-OFF operation. Accordingly, the power device may adjust generation of the 2-DEG layer based on a voltage of a gate, and may reduce power consumption. The power device may regrow only the portion corresponding to the gate electrode pattern or may etch a portion excluding the portion corresponding to the gate electrode pattern and thus, a recess process may be omissible, a reproducibility of the power device may be secured, and a manufacturing process may be simplified.
摘要:
A traveling system for construction equipment is provided, which can secure an initial traveling manipulability regardless of a low-speed traveling or a high-speed traveling. If the high-speed traveling is selected and the traveling is manipulated, the inclination angle of a swash plate of a hydraulic pump is variably controlled, so that the discharge flow rate of the hydraulic pump exceeds a predetermined flow rate in comparison to the low-speed traveling.
摘要:
The present invention relates to a power factor correction circuit that can reduce distortion of input current in a switching mode power supply. The power factor correction circuit provided in the present invention basically comprises a first inductor which is electrically connected at a first end thereof to an input terminal, a second coil that is coupled to the first inductor to form an induced voltage, a switch electrically connected to the a second terminal of the first inductor, and a switching control unit for controlling turn-on and turn-off of the switch. In such a power factor correction circuit of the present invention, the switching control unit is configured to differently set a turn-on period of the switch depending on the input voltage by generating a signal for controlling the turn-off of the switch using a second coil voltage induced at the secondary coil of the inductor by input voltage or a directly sensed input voltage. Accordingly, distortion of input current can be effectively corrected.
摘要:
A method for establishing an interface between a host and a plurality of memory devices of a system that utilizes a Multimedia Card (MMC) or Digital (SD) protocol according to an interleaving scheme. A host sequentially transmits a first sequence of commands and data to a system bus in order to allow a first memory device among the memory devices to perform a first operation. The host then transmits a second sequence of commands and data to the system bus to allow a second memory device among the memory devices to perform a second operation after transmitting the first sequence of commands and data.
摘要:
A method of controlling a mobile terminal, and which includes receiving an blow signal corresponding to a blowing action into a microphone of the mobile terminal, and generating at least one of a visual effect and a vibration effect based on characteristics of the blow signal.
摘要:
A vertical GaN-based LED and a method of manufacturing the same are provided. The vertical GaN-based LED includes an n-electrode, a first n-type GaN layer, a first AlGaN layer, a GaN layer, a second AlGaN layer, a second n-type GaN layer, an active layer, a p-type GaN layer, and a structure support layer. The first n-type GaN layer has uneven patterns having a plurality of protuberances. The first AlGaN layer is formed under the first n-type GaN layer, and the GaN layer is formed under the first AlGaN layer. The active layer is formed under the second n-type GaN layer, and the p-type GaN layer is formed under the active layer. A p-electrode is formed under the p-type GaN layer, and the structure support layer is formed under the p-electrode.