Fabrication method of semiconductor integrated circuit device
    62.
    发明授权
    Fabrication method of semiconductor integrated circuit device 有权
    半导体集成电路器件的制造方法

    公开(公告)号:US06686108B2

    公开(公告)日:2004-02-03

    申请号:US09964341

    申请日:2001-09-28

    IPC分类号: G03F900

    摘要: On the occasion of the aligning process to transfer a predetermined pattern to a semiconductor wafer by irradiating a photoresist on the semiconductor wafer with an aligning laser beam of the modified lighting via a photomask MK, the photomask MK allocating, to provide periodicity, the main apertures to transfer the predetermined pattern as the apertures formed by removing a part of the half-tone film on the mask substrate and the auxiliary apertures not resolved on the semiconductor wafer as the apertures formed by removing a part of the half-tone film is used to improve the resolution of the pattern.

    摘要翻译: 在通过经由光掩模MK照射经修改的照明的定向激光束在半导体晶片上照射光致抗蚀剂以将预定图案转印到半导体晶片的对准处理的情况下,光掩模MK分配以提供周期性的主孔 通过去除掩模基板上的半色调膜的一部分而形成的孔,并且通过将半色调膜的一部分形成的孔用于 提高模式的分辨率。

    SRAM cells with two P-well structure
    63.
    发明授权
    SRAM cells with two P-well structure 有权
    具有两个P阱结构的SRAM单元

    公开(公告)号:US06677649B2

    公开(公告)日:2004-01-13

    申请号:US09565535

    申请日:2000-05-05

    IPC分类号: H01L2976

    摘要: Prior known static random access memory (SRAM) cells are required that a diffusion layer be bent into a key-like shape in order to make electrical contact with a substrate with a P-type well region formed therein, which would result in a decrease in asymmetry leading to occurrence of a problem as to the difficulty in micro-patterning. To avoid this problem, the P-type well region in which an inverter making up an SRAM cell is formed is subdivided into two portions, which are disposed on the opposite sides of an N-type well region NW1 and are formed so that a diffusion layer forming a transistor has no curvature while causing the layout direction to run in a direction parallel to well boundary lines and bit lines. At intermediate locations of an array, regions for use in supplying power to the substrate are formed in parallel to word lines in such a manner that one regions is provided per group of thirty two memory cell rows or sixty four cell rows.

    摘要翻译: 现有的已知的静态随机存取存储器(SRAM)单元需要将扩散层弯曲成键状形状,以便与其中形成有P型阱区的衬底进行电接触,这将导致 不对称性导致了微图案化困难的问题的发生。 为了避免这个问题,构成SRAM单元的逆变器的P型阱区被细分成两部分,它们设置在N型阱区NW1的相对侧上,并形成为扩散 形成晶体管的层没有曲率,同时使得布局方向在平行于阱边界线和位线的方向上运行。 在阵列的中间位置处,以与字线平行的方式形成用于向基板供电的区域,以每组三十二个存储单元行或六十四个单元行提供一个区域。

    Process for manufacturing semiconductor integrated circuit device
    67.
    发明授权
    Process for manufacturing semiconductor integrated circuit device 有权
    半导体集成电路器件制造工艺

    公开(公告)号:US06245611B1

    公开(公告)日:2001-06-12

    申请号:US09434385

    申请日:1999-11-05

    IPC分类号: H01L218244

    摘要: In a complete CMOS SRAM having a memory cell composed of six MISFETs formed over a substrate, a capacitor element having a stack structure is formed of a lower electrode covering the memory cell, an upper electrode, and a capacitor insulating film (dielectric film) interposed between the lower electrode and the upper electrode. One electrode (the lower electrode) of the capacitor element is connected to one storage node of a flip-flop circuit, and the other electrode (the upper electrode) is connected to the other storage node. As a result, the storage node capacitance of the memory cell of the SRAM is increased to improve the soft error resistance.

    摘要翻译: 在具有由衬底上形成的六个MISFET构成的存储单元的完整CMOS SRAM中,具有堆叠结构的电容器元件由覆盖存储单元的下电极,上电极和插入了电容器绝缘膜(电介质膜)的电极形成 在下电极和上电极之间。 电容器元件的一个电极(下电极)连接到触发器电路的一个存储节点,另一个电极(上电极)连接到另一个存储节点。 结果,SRAM的存储单元的存储节点电容增加,以提高软错误电阻。