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245 条记录 (耗时 0.03 秒)

    Process for stripping volatile substances from dispersion comprising polymer particles and process for producing toner
    63.
    发明授权
    Process for stripping volatile substances from dispersion comprising polymer particles and process for producing toner 有权
    从包含聚合物颗粒的分散体中除去挥发性物质的方法和用于生产调色剂的方法

    公开(公告)号：US07304124B2

    公开(公告)日：2007-12-04

    申请号：US10493216

    申请日：2002-11-01

    申请人： Takeo Fujino ,  Kazuhiro Sato

    发明人： Takeo Fujino ,  Kazuhiro Sato

    IPC分类号： C08F6/00

    CPC分类号： C08F6/003 ,  G03G9/0804 ,  G03G9/0806 ,  G03G9/093 ,  G03G9/09307

    摘要： A stripping process is provided which continuously strips volatile substances from a dispersion containing a polymer particles through stripping the volatile substances from a dispersion by blowing an inert gas into the dispersion to draw the volatile substances into the inert gas, removing the volatile substances from the gas mixture of the inert gas and the stripped volatile substances and circulating the purified inert gas obtained by removing the volatile substances from the gas mixture, and blowing the purified inert gas into the dispersion. Also provided is a production process for a toner which uses this stripping process.

    摘要翻译： 提供了一种剥离方法，其通过从分散体中除去挥发性物质而将挥发性物质从含有聚合物颗粒的分散体中连续剥离，通过向分散体中吹入惰性气体将挥发性物质吸入惰性气体中，从气体中除去挥发性物质 惰性气体和汽提的挥发性物质的混合物，并循环通过从气体混合物中除去挥发性物质而获得的纯化惰性气体，并将纯化的惰性气体吹入分散体中。 还提供了使用该剥离工艺的调色剂的生产方法。

    Design method for semiconductor integrated circuit suppressing power supply noise
    64.
    发明授权
    Design method for semiconductor integrated circuit suppressing power supply noise 有权
    半导体集成电路抑制电源噪声的设计方法

    公开(公告)号：US07278124B2

    公开(公告)日：2007-10-02

    申请号：US11024470

    申请日：2004-12-30

    申请人： Kenji Shimazaki ,  Kazuhiro Sato ,  Takahiro Ichinomiya ,  Shozo Hirano ,  Masao Takahashi ,  Hiroyuki Tsujikawa ,  Seijiro Kojima

    发明人： Kenji Shimazaki ,  Kazuhiro Sato ,  Takahiro Ichinomiya ,  Shozo Hirano ,  Masao Takahashi ,  Hiroyuki Tsujikawa ,  Seijiro Kojima

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5036 ,  G06F17/5063

    摘要： An impedance of a power supply wire is calculated based on design data of a semiconductor integrated circuit, a frequency characteristic of the calculated impedance is obtained, and a design of the semiconductor integrated circuit is changed based on the obtained frequency characteristic. As the above-described impedance, an impedance between power supplies that are different in potential such as a power supply and a ground may be calculated, or an impedance between power supplies that are substantially the same in potential such as a power supply and an N-well power supply may be calculated. By a design modification, a wiring method, the number of pads, separation of power supplies, a type of package, a characteristic of an inductance element, a substrate structure, a distance between wires, a decoupling capacitance, a length of a wire, and a characteristic of a resistance element, for example, are changed.

    摘要翻译： 基于半导体集成电路的设计数据计算电源线的阻抗，获得所计算的阻抗的频率特性，并且基于获得的频率特性改变半导体集成电路的设计。 作为上述阻抗，可以计算诸如电源和地之间的电位不同的电源之间的阻抗，或者在诸如电源和N之间的电位基本上相同的电源之间的阻抗 - 可以计算电源。 通过设计修改，布线方法，焊盘的数量，电源的分离，封装的类型，电感元件的特性，基板结构，电线之间的距离，去耦电容，电线的长度， 并且例如电阻元件的特性被改变。

    Camera capable of data transmission
    67.
    发明申请
    Camera capable of data transmission 有权
    相机能够进行数据传输

    公开(公告)号：US20060221191A1

    公开(公告)日：2006-10-05

    申请号：US11390642

    申请日：2006-03-28

    申请人： Osamu Nonaka ,  Kazuhiro Sato

    发明人： Osamu Nonaka ,  Kazuhiro Sato

    IPC分类号： H04N5/225

    CPC分类号： H04N1/00249 ,  H04N2101/00 ,  H04N2201/001 ,  H04N2201/0015 ,  H04N2201/0041 ,  H04N2201/0053 ,  H04N2201/0055 ,  H04N2201/0065

    摘要： A camera according to the present invention can use a captured image of a communication target device to identify the communication target device when transmitting data to the outside. The camera includes a formatting section for converting transmission data to a format suitable for transmission to the communication target device identified.

    摘要翻译： 根据本发明的照相机可以使用通信目标设备的捕获图像来在向外部发送数据时识别通信目标设备。 相机包括格式化部分，用于将发送数据转换成适合于发送到所识别的通信目标装置的格式。

    Film for laminate and laminate comprising the same
    68.
    发明申请
    Film for laminate and laminate comprising the same 有权
    用于层叠体的薄膜和包含该薄膜的层压体

    公开(公告)号：US20060199023A1

    公开(公告)日：2006-09-07

    申请号：US10549041

    申请日：2004-03-12

    申请人： Yuji Funagi ,  Kazuhiro Sato

    发明人： Yuji Funagi ,  Kazuhiro Sato

    IPC分类号： B32B15/09

    CPC分类号： B32B27/36 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/28 ,  B32B2307/30 ,  B32B2367/00 ,  B32B2439/66 ,  C08J5/18 ,  C08J2367/02 ,  Y10T428/24942 ,  Y10T428/2495 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786

    摘要： A film for lamination comprising a polyester resin containing a polyfunctional component in an amount of 0.01 to 0.50 mol % and having a melt tension of not smaller than 50 mN. Even when laminated on a metal plate by a high-speed extrusion lamination method, the film can be applied onto the metal plate maintaining a uniform thickness and good adhesiveness without undergoing oscillation or pulsation. Being blended with a copolymerizable component in an amount of 10 to 20 mol %, in particular, the laminated member coated with the film features excellent adhesiveness of the coating. By further laminating a layer of another polyester resin on the above film, the flavor-retaining property can be imparted as well.

    摘要翻译： 一种用于层压的膜，其包含含有0.01至0.50mol％的多官能组分并且熔体张力不小于50mN的聚酯树脂。 即使通过高速挤出层压法层压在金属板上，也可以将膜施加到金属板上，保持均匀的厚度和良好的粘合性而不会发生振荡或脉动。 与10〜20摩尔％的可共聚组分共混，特别是涂覆薄膜的层压体具有优异的涂层密合性。 通过在上述膜上进一步层压另一聚酯树脂层，也可以赋予香味保持性。

    Design method for semiconductor integrated circuit suppressing power supply noise
    70.
    发明申请
    Design method for semiconductor integrated circuit suppressing power supply noise 有权
    半导体集成电路抑制电源噪声的设计方法

    公开(公告)号：US20050149894A1

    公开(公告)日：2005-07-07

    申请号：US11024470

    申请日：2004-12-30

    申请人： Kenji Shimazaki ,  Kazuhiro Sato ,  Takahiro Ichinomiya ,  Shozo Hirano ,  Masao Takahashi ,  Hiroyuki Tsujikawa ,  Seijiro Kojima

    发明人： Kenji Shimazaki ,  Kazuhiro Sato ,  Takahiro Ichinomiya ,  Shozo Hirano ,  Masao Takahashi ,  Hiroyuki Tsujikawa ,  Seijiro Kojima

    IPC分类号： G06F17/50 ,  H01L21/82 ,  H01L21/822 ,  H01L27/04

    CPC分类号： G06F17/5036 ,  G06F17/5063

    摘要： An impedance of a power supply wire is calculated based on design data of a semiconductor integrated circuit, a frequency characteristic of the calculated impedance is obtained, and a design of the semiconductor integrated circuit is changed based on the obtained frequency characteristic. As the above-described impedance, an impedance between power supplies that are different in potential such as a power supply and a ground may be calculated, or an impedance between power supplies that are substantially the same in potential such as a power supply and an N-well power supply may be calculated. By a design modification, a wiring method, the number of pads, separation of power supplies, a type of package, a characteristic of an inductance element, a substrate structure, a distance between wires, a decoupling capacitance, a length of a wire, and a characteristic of a resistance element, for example, are changed.

    摘要翻译： 基于半导体集成电路的设计数据计算电源线的阻抗，获得所计算的阻抗的频率特性，并且基于获得的频率特性改变半导体集成电路的设计。 作为上述阻抗，可以计算诸如电源和地之间的电位不同的电源之间的阻抗，或者在诸如电源和N之间的电位基本上相同的电源之间的阻抗 - 可以计算电源。 通过设计修改，布线方法，焊盘的数量，电源的分离，封装的类型，电感元件的特性，基板结构，电线之间的距离，去耦电容，电线的长度， 并且例如电阻元件的特性被改变。