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    Broadband flat optical elements and methods of manufacture
    61.
    发明授权
    Broadband flat optical elements and methods of manufacture 有权

    公开(公告)号：US10365535B2

    公开(公告)日：2019-07-30

    申请号：US15846065

    申请日：2017-12-18

    Applicant: Intel Corporation

    Inventor： Khaled Ahmed ,  Richmond Hicks

    IPC: G02F1/29 ,  F21V8/00 ,  C23C16/455 ,  C23C16/24 ,  B29C65/14 ,  B29C65/70 ,  B29L11/00 ,  G09G3/32 ,  G09G3/34

    Abstract: Flat optical elements including a multi-level metasurface stack having two or more metasurface levels. Each metasurface level includes an arrangement of nanostructures, or protrusions, of one or more optically transmissive materials. A metasurface level may further include another optically transmissive material between the nanostructures, achieving a desired index contrast. Another metasurface level including additional nanostructures may be over a planar surface of this additional transmissive material. Another optically transmissive material may be between the additional nanostructures. This architecture may be followed for any number of levels, (e.g., a bi-layer, tri-layer, etc.). Each metasurface within the multi-level metasurface structure may be tuned to a particular optical wavelength. Such a multi-level metasurface may have greater bandwidth and/or achieve higher optical efficiency for a given band than a single metasurface. Molding techniques may be employed in metasurface fabrication to reduce the starting material cost and fabrication cost.

    HIGH DYNAMIC RANGE IMAGER ENHANCEMENT TECHNOLOGY
    62.
    发明申请
    HIGH DYNAMIC RANGE IMAGER ENHANCEMENT TECHNOLOGY 审中-公开

    公开(公告)号：US20190141300A1

    公开(公告)日：2019-05-09

    申请号：US16164872

    申请日：2018-10-19

    Applicant: Intel Corporation

    Inventor： Khaled Ahmed ,  Richmond Hicks ,  Nilesh V. Shah

    IPC: H04N9/097 ,  H04N5/232 ,  H01L27/146 ,  H04N9/09 ,  H04N5/235

    Abstract: Imaging systems providing high resolution, low light images with significant dynamic range are disclosed. The improvements to photo imaging sensors providing low costs and yet higher performance sensors may be obtained an enhanced photosensor generating a single color channel image per photosensor. The single color channel image contains luminence values corresponding to light focused onto the photosensor. The plurality of photosensors are constructed using Indium gallium nitride (InGaN) nanowire structures and nanopyrimid structures used in cells within an array of cells. Photosensors may be constructed as single color imaging devices as well as multi-color devices. The generation of various color channel images are controlled using metasurface filter structures as well as color filter layers setting a wavelength for absorbed light by controlling a concentration of indium gallium nitride (InGaN) within the color filter layers.

    DISPLAY PANEL WITH REDUCED POWER CONSUMPTION
    64.
    发明申请
    DISPLAY PANEL WITH REDUCED POWER CONSUMPTION 有权

    公开(公告)号：US20180190678A1

    公开(公告)日：2018-07-05

    申请号：US15396001

    申请日：2016-12-30

    Applicant: INTEL CORPORATION

    Inventor： Khaled Ahmed ,  Dong Yeung Kwak ,  Ramon C. Cancel Olmo

    IPC: H01L27/12 ,  H01L29/786 ,  H01L29/20 ,  H01L29/66 ,  H01L21/02 ,  G09G3/3233 ,  G09G3/36

    Abstract: A display panel with reduced power consumption is described. An example of the display panel includes an array of light emitting elements that are controllable to form an image, and a Thin-Film-Transistor (TFT) backplane comprising circuitry to drive the array of light emitting elements. The TFT backplane includes a plurality of field effect transistors (FETs). Each FET includes a source electrode, a drain electrode, a channel layer contacting the source electrode and the drain electrode, and a gate electrode adjacent to the channel layer and separated from the channel layer by an insulator. The channel layer includes a layer of metal phosphide.

    MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANSPARENT SUBSTRATE
    69.
    发明申请
    MICRO LIGHT EMITTING DIODE STRUCTURES FORMED IN A RECESS OF A TRANSPARENT SUBSTRATE 有权

    公开(公告)号：US20250022908A1

    公开(公告)日：2025-01-16

    申请号：US18221601

    申请日：2023-07-13

    Applicant: Intel Corporation

    Inventor： Brandon Marin ,  Khaled Ahmed ,  Srinivas Pietambaram ,  Gang Duan

    IPC: H01L27/15

    Abstract: Techniques and mechanisms for a micro-LED (or “uLED”) device to facilitate communication of an optical signal which is propagated via a transparent substrate structure. In an embodiment, one or more recess structures are formed in a side of a transparent substrate structure, such as a glass core of a package substrate. A uLED structure extends partially through the transparent substrate structure in a first recess structure, and is oriented to transmit or receive an optical signal via the transparent substrate. In another embodiment, the uLED structure is coupled to integrated circuitry which provides functionality to operate the uLED structure, at different times, in either one of an optical signal receiver mode or an optical signal transmitter mode.

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