DISPLAY DEVICE
    61.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190129227A1

    公开(公告)日:2019-05-02

    申请号:US16153861

    申请日:2018-10-08

    Abstract: The purpose of the invention is to realize the flexible display device of high reliability; specifically in a structure that a bending area is in a terminal area, and in that disconnection of the wiring does not occur in the bending area. The concrete structure is that: a display device having a display area, a driving circuit area and a bending area comprising: a first thin film transistor and a first interlayer insulating film are formed in the display area, a second thin film transistor and a second interlayer insulating film are formed in the driving circuit area, terminal wirings to connects the display area and the driving circuit area are formed in the bending area.

    THIN-FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME
    64.
    发明申请
    THIN-FILM TRANSISTOR AND METHOD OF MANUFACTURING THE SAME 有权
    薄膜晶体管及其制造方法

    公开(公告)号:US20160149046A1

    公开(公告)日:2016-05-26

    申请号:US14944676

    申请日:2015-11-18

    Abstract: According to one embodiment, a thin-film transistor and a method of manufacturing the thin-film transistor provided herein achieve enhanced reliability by preventing a disconnection in a gate insulating film at a position corresponding to an end surface of an oxide semiconductor layer. The oxide semiconductor layer includes a channel region, a source region, and a drain region. The channel region is placed between the source region and the drain region. The gate insulating film covers the oxide semiconductor layer in a range from at least a part of an upper surface to an end surface continuous with the upper surface of the oxide semiconductor layer. The oxide semiconductor layer is formed so as to have an oxygen concentration that becomes lower from a top side to a bottom side and the end surface is inclined so as to diverge from the top side to the bottom side.

    Abstract translation: 根据一个实施例,本文提供的薄膜晶体管和制造薄膜晶体管的方法通过防止栅极绝缘膜在与氧化物半导体层的端面相对应的位置处的断开而实现增强的可靠性。 氧化物半导体层包括沟道区,源极区和漏极区。 沟道区域放置在源极区域和漏极区域之间。 栅极绝缘膜在从上表面至与氧化物半导体层的上表面连续的端面的至少一部分的范围内覆盖氧化物半导体层。 氧化物半导体层形成为具有从上侧到底侧变低的氧浓度,并且端面倾斜以从顶侧向底侧发散。

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

    公开(公告)号:US20250113619A1

    公开(公告)日:2025-04-03

    申请号:US18890900

    申请日:2024-09-20

    Abstract: A semiconductor device includes a first gate electrode, an oxide semiconductor layer including a first oxide semiconductor having a polycrystalline structure over the first gate electrode, a source electrode and a drain electrode electrically connected to the oxide semiconductor layer, and a second gate electrode overlapping the first gate electrode and the oxide semiconductor layer over the source electrode and the drain electrode. The second gate electrode includes a second oxide semiconductor having a polycrystalline structure. The second gate electrode is electrically connected to the first gate electrode.

    SEMICONDUCTOR DEVICE
    66.
    发明申请

    公开(公告)号:US20250113542A1

    公开(公告)日:2025-04-03

    申请号:US18887091

    申请日:2024-09-17

    Abstract: A semiconductor device comprises a first insulating layer; an oxide semiconductor layer having a polycrystalline structure on the first insulating layer; a gate insulating layer on the semiconductor oxide layer; a buffer layer on the gate insulating layer; a gate wiring on the buffer layer; and a second insulating layer on the gate wiring. The oxide semiconductor layer has a first region, a second region and a third region aligned toward a first direction. An electrical resistivity of the second region is higher than an electrical resistivity of the first region and lower than an electrical resistivity of the third region. A sheet resistance of the third region is less than 1000 ohm/square.

    SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

    公开(公告)号:US20240128273A1

    公开(公告)日:2024-04-18

    申请号:US18393873

    申请日:2023-12-22

    CPC classification number: H01L27/1225 H01L27/1285 H01L29/66742 H01L29/7869

    Abstract: There is provided a technique that enables a reduction in the display failure of a display device and the improvement of the yields of the display device in a display device that adopts a semiconductor device including a thin film transistor using an oxide semiconductor. A semiconductor device according to an embodiment includes a thin film transistor having an oxide semiconductor. The oxide semiconductor has a drain region, a source region, and a channel region provided between the drain region and the source region. The thin film transistor includes a gate insulating film provided on the channel region, an aluminum oxide film provided on the gate insulating film, an insulating film provided on the aluminum oxide film, and a gate electrode provided on the insulating film.

    SEMICONDUCTOR DEVICE
    69.
    发明公开

    公开(公告)号:US20230395724A1

    公开(公告)日:2023-12-07

    申请号:US18318748

    申请日:2023-05-17

    Inventor: Akihiro HANADA

    Abstract: A transistor includes a gate line, a first gate insulating film, a semiconductor film, a pair of terminals, a second gate insulating film, and a second gate electrode. A part of the gate line functions as a first gate electrode. The first gate insulating film is located over the first gate electrode. The semiconductor film is located over the first gate insulating film and overlaps the first gate electrode. The terminals are located over and electrically connected to the at least one semiconductor film. The second gate insulating film is located over the terminals. The second gate electrode has a light-transmitting property, is located over the second gate insulating film, overlaps the first gate electrode and the at least one semiconductor film, and is electrically connected to the first gate electrode through a first pair of openings formed in the first gate insulating film and the second gate insulating film.

Patent Agency Ranking