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公开(公告)号：US20140027709A1
公开(公告)日：2014-01-30
申请号：US13562184
申请日：2012-07-30
申请人： John A. Higginson , Andreas Bibl , Hsin-Hua Hu
发明人： John A. Higginson , Andreas Bibl , Hsin-Hua Hu
CPC分类号： H01L25/167 , H01L21/56 , H01L23/3171 , H01L25/0753 , H01L25/50 , H01L27/1214 , H01L27/1248 , H01L27/1262 , H01L33/005 , H01L33/06 , H01L33/42 , H01L33/44 , H01L33/54 , H01L33/62 , H01L2924/0002 , H01L2933/0016 , H01L2933/0025 , H01L2933/0033 , H01L2933/005 , H01L2933/0066 , H01L2924/00
摘要： A method and structure for receiving a micro device on a receiving substrate are disclosed. A micro device such as a micro LED device is punched-through a passivation layer covering a conductive layer on the receiving substrate, and the passivation layer is hardened. In an embodiment the micro LED device is punched-through a B-staged thermoset material. In an embodiment the micro LED device is punched-through a thermoplastic material.
摘要翻译： 公开了一种用于在接收基板上接收微型装置的方法和结构。 诸如微型LED器件的微器件通过覆盖接收衬底上的导电层的钝化层穿孔，并且钝化层硬化。 在一个实施例中，微型LED器件通过B阶热固性材料穿孔。 在一个实施例中，微型LED器件穿过热塑性材料。
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公开(公告)号：US08523322B2
公开(公告)日：2013-09-03
申请号：US11479152
申请日：2006-06-30
申请人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory Debrabander , Paul A. Hoisington , Andreas Bibl
发明人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory Debrabander , Paul A. Hoisington , Andreas Bibl
IPC分类号： B41J2/135
CPC分类号： B41J2/1606 , B41J2/1433 , B82Y30/00
摘要： A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.
摘要翻译： 具有允许流体与内表面接触的内表面，外表面和孔的流体喷射器被喷射。 流体喷射器具有覆盖流体喷射器的外表面的至少一部分并且围绕流体喷射器中的孔的非润湿单层。 非润湿单层的制造可以包括从流体喷射器的第二区域去除非润湿单层，同时将非润湿单层留在围绕流体喷射器中的孔口的第一区域上，或保护流体的第二区域 喷射器具有在其上形成的非润湿单层，其中第二区域不包括围绕流体喷射器中的孔口的第一区域。
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63.发明申请公开(公告)号：US20130130440A1
公开(公告)日：2013-05-23
申请号：US13436314
申请日：2012-03-30
IPC分类号： H01L21/50
CPC分类号： H01L24/83 , H01L21/67144 , H01L24/75 , H01L24/95 , H01L33/0079 , H01L33/46 , H01L2224/7598 , H01L2224/83 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , Y10T156/1153 , H01L2924/00
摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
摘要翻译： 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。
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64.发明申请METHOD OF FORMING A MICRO LED STRUCTURE AND ARRAY OF MICRO LED STRUCTURES WITH AN ELECTRICALLY INSULATING LAYER 有权形成微型LED结构的方法和微型LED结构与电绝缘层的阵列公开(公告)号：US20130126081A1
公开(公告)日：2013-05-23
申请号：US13436260
申请日：2012-03-30
CPC分类号： H01L33/08 , H01L21/67144 , H01L24/75 , H01L24/83 , H01L24/95 , H01L27/156 , H01L33/0079 , H01L33/405 , H01L2224/7598 , H01L2224/83 , H01L2224/95145 , H01L2924/01322 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.
摘要翻译： 描述了将微器件和微器件阵列制造和传送到接收衬底的方法。 在一个实施例中，在蚀刻p-n二极管层以形成多个微p-n二极管期间，电绝缘层被用作蚀刻停止层。 在一个实施例中，在将微器件形成和传送到接收衬底期间，使用导电中间接合层。
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公开(公告)号：US08426227B1
公开(公告)日：2013-04-23
申请号：US13372245
申请日：2012-02-13
IPC分类号： H01L21/00
CPC分类号： H01L33/06 , F21V7/00 , H01L25/0753 , H01L27/15 , H01L29/0684 , H01L33/0079 , H01L33/04 , H01L33/20 , H01L33/28 , H01L33/30 , H01L2224/95
摘要： A micro light emitting diode (LED) and a method of forming an array of micro LEDs for transfer to a receiving substrate are described. The micro LED structure may include a micro p-n diode and a metallization layer, with the metallization layer between the micro p-n diode and a bonding layer. A conformal dielectric barrier layer may span sidewalls of the micro p-n diode. The micro LED structure and micro LED array may be picked up and transferred to a receiving substrate.
摘要翻译： 描述了微型发光二极管（LED）和形成用于传送到接收基板的微型LED阵列的方法。 微型LED结构可以包括微型p-n二极管和金属化层，金属化层位于微型p-n二极管和结合层之间。 保形介质阻挡层可以跨越微型p-n二极管的侧壁。 微型LED结构和微型LED阵列可以被拾取并转移到接收衬底。
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公开(公告)号：US08226208B2
公开(公告)日：2012-07-24
申请号：US13106737
申请日：2011-05-12
申请人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory De Brabander , Paul A. Hoisington , Andreas Bibl
发明人： Yoshimasa Okamura , Jeffrey Birkmeyer , John A. Higginson , Gregory De Brabander , Paul A. Hoisington , Andreas Bibl
IPC分类号： B41J2/135
CPC分类号： B41J2/1606 , B41J2/1433 , B82Y30/00
摘要： A fluid ejector having an inner surface, an outer surface, and an orifice that allows fluid in contact with the inner surface to be ejected. The fluid ejector has a non-wetting monolayer covering at least a portion of the outer surface of the fluid ejector and surrounding an orifice in the fluid ejector. Fabrication of the non-wetting monolayer can include removing a non-wetting monolayer from a second region of a fluid ejector while leaving the non-wetting monolayer on a first region surrounding an orifice in the fluid ejector, or protecting a second region of a fluid ejector from having a non-wetting monolayer formed thereon, wherein the second region does not include a first region surrounding the orifice in the fluid ejector.
摘要翻译： 具有允许流体与内表面接触的内表面，外表面和孔的流体喷射器被喷射。 流体喷射器具有覆盖流体喷射器的外表面的至少一部分并且围绕流体喷射器中的孔的非润湿单层。 非润湿单层的制造可以包括从流体喷射器的第二区域去除非润湿单层，同时将非润湿单层留在围绕流体喷射器中的孔口的第一区域上，或保护流体的第二区域 喷射器具有在其上形成的非润湿单层，其中第二区域不包括围绕流体喷射器中的孔口的第一区域。
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公开(公告)号：US07673969B2
公开(公告)日：2010-03-09
申请号：US12058139
申请日：2008-03-28
申请人： Paul A. Hoisington , Steven H. Barss , Andreas Bibl , John A. Higginson , David A. Swett , Daniel Cote , Edward R. Moynihan , Robert Wells
发明人： Paul A. Hoisington , Steven H. Barss , Andreas Bibl , John A. Higginson , David A. Swett , Daniel Cote , Edward R. Moynihan , Robert Wells
IPC分类号： B41J2/14
CPC分类号： B41J2/155 , B41J2/2103 , B41J2/2135 , B41J25/34 , B41J2202/14 , B41J2202/20 , B41J2202/21
摘要： In one aspect, the invention features assemblies for depositing droplets on a substrate during relative motion of the assembly and the substrate along a process direction. The assemblies include a first printhead module and a second printhead module contacting the first printhead module, each of the printhead modules including a surface that includes an array of nozzles through which the printhead modules can eject fluid droplets, wherein each nozzle in the first printhead module's nozzle array is offset with respect to a corresponding nozzle in the second printhead module's nozzle array in a direction orthogonal to the process direction.
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公开(公告)号：US20100039479A1
公开(公告)日：2010-02-18
申请号：US12486693
申请日：2009-06-17
申请人： Andreas Bibl , John A. Higginson , Paul A. Hoisington , Deane A. Gardner , Robert A. Hasenbein , Melvin L. Biggs , Edward R. Moynihan
发明人： Andreas Bibl , John A. Higginson , Paul A. Hoisington , Deane A. Gardner , Robert A. Hasenbein , Melvin L. Biggs , Edward R. Moynihan
IPC分类号： B41J2/05
CPC分类号： B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1628 , B41J2/1631 , B41J2/1632 , B41J2/1635 , B41J2/1637 , B41J2/1642 , B41J2/1645 , B41J2/1646 , B41J2002/14306 , B41J2002/14403 , B41J2002/14419 , B41J2202/20
摘要： Ink jet printheads and printhead components are described.
摘要翻译： 描述了喷墨打印头和打印头部件。
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公开(公告)号：US20090303269A1
公开(公告)日：2009-12-10
申请号：US12510513
申请日：2009-07-28
CPC分类号： B41J2/1433 , B41J2002/14475
摘要： A fluid drop delivery device is disclosed. The device includes a plurality of nozzle openings from which fluid is ejected and a waste control aperture.
摘要翻译： 公开了一种液滴输送装置。 该装置包括多个喷嘴开口，流体从该喷嘴开口排出，废物控制孔。
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公开(公告)号：US07526846B2
公开(公告)日：2009-05-05
申请号：US11851293
申请日：2007-09-06
申请人： Andreas Bibl , John A. Higginson
发明人： Andreas Bibl , John A. Higginson
IPC分类号： H01L41/22
CPC分类号： B41J2/1626 , B41J2/14233 , B41J2/161 , B41J2/1623 , B41J2/1631 , B41J2/1632 , B41J2/1637 , B41J2/1645 , B41J2/1646 , H01L27/20 , H01L41/0973 , H01L41/313 , H01L41/337 , Y10T29/42 , Y10T29/43 , Y10T29/435
摘要： Microelectromechanical systems with structures having piezoelectric actuators are described. The structures each have a body that supports piezoelectric islands. The piezoelectric islands have a first surface and a second opposite surface. The piezoelectric islands can be formed, in part, by forming cuts into a thick layer of piezoelectric material, attaching the cut piezoelectric layer to a body having etched features and grinding the piezoelectric layer to a thickness that is less than the depths of the cuts. Conductive material can be formed on the piezoelectric layer to form electrodes.
摘要翻译： 描述了具有压电致动器结构的微机电系统。 每个结构都具有支撑压电岛的主体。 压电岛具有第一表面和第二相对表面。 压电岛可以部分地通过形成切割成厚的压电材料层而形成，将切割的压电层附接到具有蚀刻特征的主体并且将压电层研磨到小于切口深度的厚度。 可以在压电层上形成导电材料以形成电极。
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