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    Detecting and isolating domain specific faults
    63.
    发明授权
    Detecting and isolating domain specific faults 有权
    检测和隔离域特定故障

    公开(公告)号：US08248953B2

    公开(公告)日：2012-08-21

    申请号：US11782906

    申请日：2007-07-25

    Applicant: Rajesh Kumar ,  Randall P. J. Ethier

    Inventor： Rajesh Kumar ,  Randall P. J. Ethier

    IPC: G01R31/08

    CPC classification number: H04B3/46

    Abstract: A method for detecting and isolating domain specific faults includes comparing a first media quality report for a communication from a first node with a second media quality report for the communication from a second node. The first node comprises an ingress node of a first domain for the communication and the second node comprises an egress node of the first domain for the communication. The method also includes determining that the difference between at least one aspect of the first media quality report and at least one corresponding aspect of the second media quality report exceeds a first threshold. The method further includes, upon determining that the difference exceeds the first threshold, determining a first path between the first node and the second node used by the communication. The method additionally includes isolating at least one source causing the difference between the first media quality report and the second media quality report.

    Abstract translation: 用于检测和隔离域特定故障的方法包括将来自第一节点的通信的第一媒体质量报告与用于来自第二节点的通信的第二媒体质量报告进行比较。 第一节点包括用于通信的第一域的入口节点，并且第二节点包括用于通信的第一域的出口节点。 该方法还包括确定第一媒体质量报告的至少一个方面与第二媒体质量报告的至少一个对应方面之间的差超过第一阈值。 该方法还包括：在确定差异超过第一阈值时，确定通信使用的第一节点和第二节点之间的第一路径。 该方法还包括隔离至少一个来源，导致第一媒体质量报告和第二媒体质量报告之间的差异。

    SYSTEMS AND METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING BLIND AND INTERNAL MICRO VIAS TO COUPLE SUBASSEMBLIES
    65.
    发明申请
    SYSTEMS AND METHODS OF MANUFACTURING PRINTED CIRCUIT BOARDS USING BLIND AND INTERNAL MICRO VIAS TO COUPLE SUBASSEMBLIES 有权
    使用黑色和内部微型VIAS制作打印电路板的系统和方法

    公开(公告)号：US20120003844A1

    公开(公告)日：2012-01-05

    申请号：US13153254

    申请日：2011-06-03

    Applicant: Rajesh Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

    Inventor： Rajesh Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

    IPC: H01R12/51 ,  H05K3/42 ,  H05K3/46

    CPC classification number: H05K3/4623 ,  H05K3/4069 ,  H05K3/4614 ,  H05K2201/0195 ,  H05K2201/096 ,  H05K2203/061 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49165 ,  Y10T29/532

    Abstract: Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies. An embodiment of the invention provides a method of manufacturing a printed circuit including attaching a plurality of metal layer carriers to form a first subassembly including at least one copper foil pad on a first surface, applying an encapsulation material onto the first surface of the first subassembly, curing the encapsulation material and the first subassembly; applying a lamination adhesive to a surface of the cured encapsulation material, forming at least one via in the lamination adhesive and the cured encapsulation material to expose the at least one copper foil pad, attaching a plurality of metal layer carriers to form a second subassembly, and attaching the first subassembly and the second subassembly.

    Abstract translation: 使用盲孔和内部微通孔来制造印刷电路板来耦合子组件的系统和方法。 本发明的一个实施例提供一种制造印刷电路的方法，包括附接多个金属层载体以形成第一子组件，该第一子组件包括在第一表面上的至少一个铜箔焊盘，将封装材料施加到第一子组件的第一表面上 固化封装材料和第一子组件; 在所述固化的包封材料的表面上施加层压粘合剂，在所述层压粘合剂和所述固化的封装材料中形成至少一个通孔，以暴露所述至少一个铜箔垫，附接多个金属层载体以形成第二子组件， 以及附接第一子组件和第二子组件。

    Sequence numbering for distributed wireless networks
    67.
    发明授权
    Sequence numbering for distributed wireless networks 有权
    分布式无线网络的序列号

    公开(公告)号：US07978656B2

    公开(公告)日：2011-07-12

    申请号：US12055019

    申请日：2008-03-25

    Applicant: Nileshkumar J. Parekh ,  Rajesh Kumar ,  Maksim (Max) Krasnyanskiy ,  Eric Hall

    Inventor： Nileshkumar J. Parekh ,  Rajesh Kumar ,  Maksim (Max) Krasnyanskiy ,  Eric Hall

    IPC: H04L12/28 ,  H04L12/56

    CPC classification number: H04L1/1642

    Abstract: Systems and methodologies are described that facilitate maintaining consistent radio-link layer protocol (RLP) sequence numbers in the event of an RLP sequence number reset. An offset can be adjusted upon occurrence of the event to reflect a subsequent expected sequence number. The offset can be added to the RLP sequence numbers such that receiving devices and/or higher layer applications can operate without realizing the sequence number reset. Additionally, the offset can be synchronized among base stations to facilitate operability following handoff of the receiving device.

    Abstract translation: 描述了在RLP序列号重置的情况下有助于维持一致的无线电链路层协议（RLP）序列号的系统和方法。 发生事件时可以调整偏移量以反映随后的预期序列号。 可以将偏移量添加到RLP序列号，使得接收设备和/或更高层应用可以在不实现序列号重置的情况下操作。 此外，可以在基站之间同步偏移，以便于在接收设备切换之后的可操作性。

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