摘要:
A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.
摘要:
The present invention relates generally to a new multi-density ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of thicker green sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin punched green sheets were tacked/bonded to thicker punched and screened green sheets to form a sub-structure which had excellent stability in screening and enabled further processing.
摘要:
The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates using at least one flexible preform insert. More particularly, the invention encompasses apparatus and method for fabricating cavities in MLC (multi-layer ceramic) substrates using at least one flexible preform insert that is inserted into the cavity of the MLC substrate prior to lamination and this insert helps in preventing the collapse of the shelves of the cavity during this lamination process. After the lamination process the inventive temporary preform insert is then removed.
摘要:
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
摘要:
A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particularly copper filled via) and ceramic upon sintering. The novel via composition exhibits enhanced adhesion to the ceramic. A sintering process by which shrinkage of the novel via composition is controlled and adhesion is improved is also disclosed.
摘要:
A method includes directing first and second fluids into a plurality of first ports fluidly connected to a mixing chamber disposed between a first plate and a base plate, guiding the first and second fluids into a mixing chamber, directing the first and second fluid into a plurality of second ports fluidly connected to the plurality of first ports, guiding the first and second fluids from the plurality of second ports into another mixing chamber disposed between a second plate and the first plate and fluidly connected to the mixing chamber, activating a heating element to heat one of the first and second fluids entering the mixing chamber, creating a temperature gradient between the first and second fluids entering the mixing chamber, and operating a diaphragm operatively associated with the mixing chamber and the another mixing chamber to agitate the first and second fluids to form a fluid mixture.
摘要:
Methods of making and the resultant micro-spotting plates having a plurality of feed holes, a plurality of dispensing nozzles, an open cavity in communication with the dispensing nozzles and a plurality of channels. The channels connect the feed holes to the dispensing nozzles for transferring a fluid from the feed holes to the dispensing nozzles under a capillary force. A channel may connect a single feed hole retaining a liquid to a dispensing nozzle for dispensing such liquid, or a channel may connect two or more feed holes to a dispensing nozzle for enabling mixing of fluids from the feed holes within the channel prior to dispensing such mixture. The micro-spotting plates allow the continuous self-feeding flow of fluids by capillary forces through its hydrophilic layers for enabling the controlled dispensing of a multi-array of drops of fluids onto a substrate, preferably a test slide, for later use.
摘要:
A method of making and the resultant micro well plate that includes a plurality of greensheets, either laminated or sintered together, whereby these greensheets have a plurality of vertical micro well reaction chamber openings therein, and optionally a plurality horizontal channels connecting selected well reaction chamber openings. The vertical micro well reaction chambers have at, at least one end thereof a plurality of optical micro plugs which are aligned to the vertical micro well reaction chamber openings. The plurality of optical micro plugs allow for the micro well plate to be integrated with macro analytical instrumentation for the analysis, examination, and/or testing of chemicals, reagents or samples provided within the vertical micro well reaction chamber openings.
摘要:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.
摘要:
An apparatus for providing uniform axial load distribution for laminate layers of multilayer ceramic chip carriers includes a base plate configured to support a plurality of green sheet layers thereon, the base plate having at least one resiliently mounted load support bar disposed adjacent outer edges of the base plate. The load support bar is mounted on one or more biasing members such that the top surface of the support bar extends above the top surface of the base plate by a selected distance.