Semiconductor device
    61.
    发明授权

    公开(公告)号:US10410916B2

    公开(公告)日:2019-09-10

    申请号:US16106266

    申请日:2018-08-21

    Abstract: A semiconductor device includes an interlayer insulation layer on a semiconductor substrate, a via plug and a wiring line on the via plug, in the interlayer insulation layer, the via plug and the wiring line coupled with each other and forming a stepped structure. The semiconductor device includes a first air-gap region between the interlayer insulation layer and the via plug, and a second air-gap region between the interlayer insulation layer and the wiring line. The first air-gap region and the second air-gap region are not vertically overlapped with each other.

    SEMICONDUCTOR DEVICE
    63.
    发明申请

    公开(公告)号:US20250151259A1

    公开(公告)日:2025-05-08

    申请号:US18657885

    申请日:2024-05-08

    Abstract: Provided is a semiconductor device including a first word line extending in a first direction, bit lines extending in a second direction different from the first direction in a plan view, a second word line between ones of the bit lines and extending in the second direction, and a first memory cell. The first memory cell may include a first transistor electrically connected to a first one of the bit lines and the first word line, a second transistor electrically connected to the second word line and including source/drain electrodes, and a capacitor electrically connected to the second transistor. One of the source/drain electrodes of the second transistor may be electrically connected to the first transistor.

    SEMICONDUCTOR DEVICE
    64.
    发明申请

    公开(公告)号:US20250071969A1

    公开(公告)日:2025-02-27

    申请号:US18623816

    申请日:2024-04-01

    Abstract: A semiconductor device may include a plurality of active patterns disposed on a substrate, a gate structure extending in a first direction, a bit line structure extending in a second direction, and a plurality of capacitors electrically connected to the plurality of active patterns, respectively, the plurality of active patterns having a shape extending in a third direction oblique to the first and second directions, the gate structure passing through centers of the plurality of active patterns, the bit line structure connected to first end portions of the plurality of active patterns, the plurality of capacitors connected to second end portions of the plurality of active patterns, respectively, the first end portion and the second end portion positioned at opposite sides with respect to the gate structure, and the first end portion and the second end portion having point-symmetrical shapes with respect to a center of the active pattern.

    SEMICONDUCTOR DEVICE INCLUDING DATA STORAGE STRUCTURES

    公开(公告)号:US20240404947A1

    公开(公告)日:2024-12-05

    申请号:US18673201

    申请日:2024-05-23

    Abstract: A semiconductor device includes: cell transistors stacked in a first direction perpendicular to an upper surface of a base, wherein each cell transistor includes a first source/drain region, a second source/drain region, and a gate electrode, a bit line extending in the first direction and electrically connected to the first source/drain regions; and data storage structures electrically connected to the second source/drain regions, wherein each gate electrode has a line shape extending in a second direction parallel to the upper surface, each data storage structure includes a first electrode, a second electrode, and a dielectric layer between the first and second electrodes, wherein the first electrodes are electrically connected to the second source/drain regions, wherein the second electrodes are stacked and spaced apart from each other in the first direction, and wherein each second electrode includes a line portion having a line shape extending in the second direction.

    SEMICONDUCTOR MEMORY DEVICE
    66.
    发明公开

    公开(公告)号:US20240357801A1

    公开(公告)日:2024-10-24

    申请号:US18530342

    申请日:2023-12-06

    Abstract: A semiconductor memory device includes a bit line extending in a first direction, an active pattern on the bit line, the active pattern including first and second vertical portions facing each other in the first direction and a horizontal portion connecting the first and second vertical portions, first and second word lines on the horizontal portion between the first and second vertical portions, the first and second word lines extending in a second direction crossing the first direction, a gate insulating pattern between the first and second word lines and the active pattern, and a capacitor connected to each of the first and second vertical portions, the capacitor including a first electrode pattern connected to one of the first and second vertical portions, a second electrode pattern on the first electrode pattern, and a ferroelectric pattern between the first electrode pattern and the second electrode pattern.

    Semiconductor memory device
    67.
    发明授权

    公开(公告)号:US12075611B2

    公开(公告)日:2024-08-27

    申请号:US17481583

    申请日:2021-09-22

    CPC classification number: H10B12/315 G11C5/063 H01L29/0607 H10B12/05 H10B12/50

    Abstract: A semiconductor memory includes a bit line extending in a first direction, first and second active patterns, which are alternately disposed in the first direction and on the bit line, and each of which includes a horizontal portion and a vertical portion, first word lines disposed on the horizontal portions of the first active patterns to cross the bit line, second word lines disposed on the horizontal portions of the second active patterns to cross the bit line, and an intermediate structure provided in a first gap region between the first and second word lines or in a second gap region between the vertical portions of the first and second active patterns. The first and second active patterns, which are adjacent to each other, may be disposed to be symmetric with respect to each other.

    Semiconductor devices having supporter structures

    公开(公告)号:US12015064B2

    公开(公告)日:2024-06-18

    申请号:US17683765

    申请日:2022-03-01

    Inventor: Hoin Lee Kiseok Lee

    CPC classification number: H01L29/423 H01L29/402

    Abstract: A semiconductor device includes lower electrodes, a first supporter structure including first supporter patterns interconnecting the lower electrodes, wherein side surfaces of the first supporter patterns and side surfaces of the lower electrodes that are exposed by the first supporter patterns at least partially define a first open region, the first supporter patterns being spaced apart from one another, the first open region extending among the first supporter patterns in a horizontal direction, a dielectric layer covering the first supporter structure and the lower electrodes, and an upper electrode on the dielectric layer. A distance between adjacent ones of the first supporter patterns is smaller than or equal to a pitch of the lower electrodes.

    Semiconductor device including carbon-containing contact fence

    公开(公告)号:US11980025B2

    公开(公告)日:2024-05-07

    申请号:US17705991

    申请日:2022-03-28

    CPC classification number: H10B12/485 H10B12/34 H10B12/482 H10B12/488

    Abstract: A semiconductor device includes; an active region defined by an isolation film on a substrate, a word line in the substrate, the word line extending in a first direction and crossing the active region, a bit line above the word line and extending in a second direction, a contact between bit lines adjacent in the first direction, the contact connecting the active region and extending in a vertical direction, and a contact fence disposed on each of opposing side surfaces of the contact in the second direction and extending in the vertical direction, wherein the active region has a bar shape extending oblique to the first direction, and the contact fence includes a carbon-containing insulating film.

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