Abstract:
Provided is a semiconductor device which can achieve a reduction in its area, reduction in power consumption, and operation at a high speed. A semiconductor device 10 has a structure in which a circuit 31 including a memory circuit and a circuit 32 including an amplifier circuit are stacked. With this structure, the memory circuit and the amplifier circuit can be mounted on the semiconductor device 10 while the increase in the area of the semiconductor device 10 is suppressed. Thus, the area of the semiconductor device 10 can be reduced. Further, the circuits are formed using OS transistors, so that the memory circuit and the amplifier circuit which have low off-state current and which can operate at a high speed can be formed. Therefore, a reduction in power consumption and improvement in operation speed of the semiconductor device 10 can be achieved.
Abstract:
To read multilevel data from a memory cell having a transistor using silicon and a transistor using an oxide semiconductor, without switching a signal for reading the multilevel data in accordance with the number of the levels of the multilevel data. The potential of the bit line is precharged, the electrical charge of the bit line is discharged via a transistor for writing data, and the potential of the bit line which is changed by the discharging is read as multilevel data. With such a structure, the potential corresponding to data held in a gate of the transistor can be read by only one-time switching of a signal for reading data.
Abstract:
One object of the present invention is to provide a regulator circuit with an improved noise margin. In a regulator circuit including a bias circuit generating a reference voltage on the basis of the potential difference between a first power supply terminal and a second power supply terminal, and a voltage regulator outputting a potential to an output terminal on the basis of a reference potential input from the bias circuit, a bypass capacitor is provided between a power supply terminal and a node to which a gate of a transistor included in the bias circuit is connected.
Abstract:
The semiconductor device includes a source line, a bit line, a signal line, a word line, memory cells connected in parallel between the source line and the bit line, a first driver circuit electrically connected to the source line and the bit line through switching elements, a second driver circuit electrically connected to the source line through a switching element, a third driver circuit electrically connected to the signal line, and a fourth driver circuit electrically connected to the word line. The memory cell includes a first transistor including a first gate electrode, a first source electrode, and a first drain electrode, a second transistor including a second gate electrode, a second source electrode, and a second drain electrode, and a capacitor. The second transistor includes an oxide semiconductor material.
Abstract:
A semiconductor device including a nonvolatile memory cell in which a writing transistor which includes an oxide semiconductor, a reading transistor which includes a semiconductor material different from that of the writing transistor, and a capacitor are included is provided. Data is written to the memory cell by turning on the writing transistor and applying a potential to a node where a source electrode (or a drain electrode) of the writing transistor, one electrode of the capacitor, and a gate electrode of the reading transistor are electrically connected, and then turning off the writing transistor, so that the predetermined amount of charge is held in the node. Further, when a p-channel transistor is used as the reading transistor, a reading potential is a positive potential.
Abstract:
Provided is a method for driving a semiconductor device, which allows a reduction in scale of a circuit, reduce the power consumption, and increase the speed of reading data. An H level (data “1”) potential or an L level (data “0”) potential is written to a node of a memory cell. Potentials of a source line and a bit line are set to the same potential at an M level (L level
Abstract:
In a memory cell including first to third transistors, the potential of a bit line is set to VDD or GND when data is written through the first transistor. In a standby period, the potential of the bit line is set to GND. In reading operation, the bit line is brought into a floating state at GND, and a source line is set to a potential VDD−α, consequently, the third transistor is turned on. Then, the potential of the source line is output according to the potential of a gate of the second transistor. Note that α is set so that the second transistor is surely off even when the potential of the gate of the second transistor becomes lower from VDD by ΔV in the standby period. That is, Vth+ΔV
Abstract:
To read multilevel data from a memory cell having a transistor using silicon and a transistor using an oxide semiconductor, without switching a signal for reading the multilevel data in accordance with the number of the levels of the multilevel data. The potential of the bit line is precharged, the electrical charge of the bit line is discharged via a transistor for writing data, and the potential of the bit line which is changed by the discharging is read as multilevel data. With such a structure, the potential corresponding to data held in a gate of the transistor can be read by only one-time switching of a signal for reading data.
Abstract:
A sample-and-hold circuit including a transistor and a capacitor is connected to the differential circuit. The sample-and-hold circuit acquires voltage for correcting the offset voltage of the differential circuit by charging or discharging the capacitor through sampling operation. Then, it holds the potential of the capacitor through holding operation. In normal operation of the differential circuit, the output potential of the differential circuit is corrected by the potential held by the capacitor. The transistor in the sample-and-hold circuit is preferably a transistor whose channel is formed using an oxide semiconductor. An oxide semiconductor transistor has extremely low leakage current; thus, a change in the potential held in the capacitor of the sample-and-hold circuit can be minimized.
Abstract:
A semiconductor device in which stored data can be held even when power is not supplied and there is no limitation on the number of writing operations is provided. A semiconductor device is formed using a material which can sufficiently reduce the off-state current of a transistor, such as an oxide semiconductor material that is a wide-gap semiconductor. When a semiconductor material which can sufficiently reduce the off-state current of a transistor is used, the semiconductor device can hold data for a long period. In addition, by providing a capacitor or a noise removal circuit electrically connected to a write word line, a signal such as a short pulse or a noise input to a memory cell can be reduced or removed. Accordingly, a malfunction in which data written into the memory cell is erased when a transistor in the memory cell is instantaneously turned on can be prevented.