公开(公告)号：US06335522B1

公开(公告)日：2002-01-01

申请号：US09426946

申请日：1999-10-26

Applicant: Yasuhiro Shimada ,  Takayuki Yagi ,  Takayuki Teshima ,  Ryo Kuroda

Inventor： Yasuhiro Shimada ,  Takayuki Yagi ,  Takayuki Teshima ,  Ryo Kuroda

IPC: G02B704

CPC classification number: G01Q60/22 ,  Y10S977/862

Abstract: An optical probe which comprises a substrate, an elastic body supported by the substrate and having a free end, a projection having a micro-aperture and arranged at the free end of the elastic body, and a refractive index micro-lens also arranged at the free end of the elastic body and adapted to focus light to the micro-aperture.

Abstract translation: 一种光学探针，其包括基板，由基板支撑并具有自由端的弹性体，具有微孔并且布置在弹性体自由端的突起，以及折射率微透镜，其还布置在 弹性体的自由端并适于将光聚焦到微孔。

公开(公告)号：US06211532B1

公开(公告)日：2001-04-03

申请号：US09005016

申请日：1998-01-09

Applicant: Takayuki Yagi

Inventor： Takayuki Yagi

IPC: H01L3100

CPC classification number: G01Q60/06 ,  G01Q60/22 ,  G01Q80/00 ,  Y10S977/868

Abstract: A microprobe chip for detecting evanescent waves includes a photoconductive material and a substrate for supporting the photoconductive material. The photoconductive material is connected to electrodes formed on the substrate. A method for making a microprobe chip for detecting evanescent waves includes forming a film comprising a photoconductive material on a peeling layer of a first substrate, the film having a shape of the microprobe chip, and transferring the film on the peeling layer onto a junction layer provided on a second substrate. A method for making a probe provided with a microprobe chip for detecting evanescent waves includes forming a film comprising a photoconductive material and having the shape of the microprobe chip on a peeling layer of a first substrate, forming a thin film cantilever on a second substrate, and transferring the film on the peeling layer onto a junction layer formed on the thin film cantilever.

Abstract translation: 用于检测ev逝波的微探针芯片包括光导材料和用于支撑光电导材料的基片。 光电导材料连接到形成在基片上的电极。 一种制造用于检测ev逝波的微探针芯片的方法包括在第一衬底的剥离层上形成包含光电导材料的膜，该膜具有微探针芯片的形状，并将该剥离层上的膜转移到接合层 设置在第二基板上。 提供具有用于检测ev逝波的微探针芯片的探针的制造方法包括在第一基板的剥离层上形成包含感光材料并具有微探针芯片的形状的膜，在第二基板上形成薄膜悬臂， 并将所述剥离层上的膜转移到形成在薄膜悬臂上的接合层上。

公开(公告)号：US6154302A

公开(公告)日：2000-11-28

申请号：US191534

申请日：1998-11-13

Applicant: Takayuki Yagi ,  Hajime Sakata ,  Etsuro Kishi

Inventor： Takayuki Yagi ,  Hajime Sakata ,  Etsuro Kishi

IPC: G02B26/08

CPC classification number: G02B26/0816

Abstract: A light deflection device includes a deflection member having a sphere body enclosing a deflection face portion for deflecting a light beam, or a segmental sphere body having the deflection face portion and a segmental sphere face opposing to the deflection face portion. The device also includes a supporting member for supporting the deflection member in a turnable manner, and a driver for turning the deflection member. The driver is provided on the sphere face of the deflection member, and at a position opposing the sphere face or the segmental sphere face of the deflection member to apply a driving force to the sphere face or the segmental face. In one embodiment, a light deflection device array includes the arrangement of light deflection devices in a one-dimensional or two-dimensional array.

Abstract translation: 光偏转装置包括具有包围用于偏转光束的偏转面部分的球体的偏转构件或具有偏转面部分的节段球体和与偏转面部分相对的节段球面。 该装置还包括用于以可转动的方式支撑偏转构件的支撑构件和用于转动偏转构件的驱动器。 驱动器设置在偏转构件的球面上，并且在与偏转构件的球体面或节段球面相对的位置处，以向球面或节段面施加驱动力。 在一个实施例中，光偏转装置阵列包括一维或二维阵列中的光偏转装置的布置。

公开(公告)号：US6020215A

公开(公告)日：2000-02-01

申请号：US844971

申请日：1997-04-28

Applicant: Takayuki Yagi ,  Masatake Akaike

Inventor： Takayuki Yagi ,  Masatake Akaike

IPC: B81B3/00 ,  B81C1/00 ,  G03F7/00 ,  H01H59/00 ,  H01L23/00 ,  H02N1/00 ,  H02N2/00 ,  H02N2/02 ,  H01L21/311

CPC classification number: B81C1/0092 ,  B81C1/00936 ,  H01H59/0009 ,  H02N1/006 ,  B81B2203/0118 ,  B81C2201/0107 ,  B81C2201/0109 ,  B81C2203/031

Abstract: A microstructure comprising a substrate (1), a patterned structure (beam member) (2) suspended over the substrate (1) with an air-space (4) therebetween and supporting structure (3) for suspending the patterned structure (2) over the substrate (1). The microstructure is prepared by using a sacrificial layer (7) which is removed to form the space between the substrate (1) and the patterned structure (2) adhered to the sacrificial layer. In the case of using resin as the material of the sacrificial layer, the sacrificial layer can be removed without causing sticking, and an electrode can be provided on the patterned structure. The microstructure can have application as electrostatic actuator, etc., depending on choice of shape and composition.

Abstract translation: 一种微结构，其包括衬底（1），悬挂在衬底（1）上的图案化结构（梁构件）（2），其间具有空气空间（4）和用于将图案化结构（2）悬挂在其上的支撑结构（3） 基板（1）。 通过使用牺牲层（7）来制备微结构，所述牺牲层被除去以形成衬底（1）和附着到牺牲层的图案化结构（2）之间的空间。 在使用树脂作为牺牲层的材料的情况下，可以除去牺牲层而不引起粘附，并且可以在图案化结构上提供电极。 根据形状和组成的选择，微结构可以用作静电致动器等。

公开(公告)号：US6013573A

公开(公告)日：2000-01-11

申请号：US804407

申请日：1997-02-21

Applicant: Takayuki Yagi

Inventor： Takayuki Yagi

IPC: G01B7/34 ,  B81B1/00 ,  B81B3/00 ,  B81C1/00 ,  B81C3/00 ,  G01B7/00 ,  G01B21/30 ,  G01N37/00 ,  G01Q60/16 ,  G01Q60/38 ,  G01Q70/10 ,  G01Q70/16 ,  G02B21/00 ,  G11B9/14 ,  H01L21/764 ,  H01L29/84

CPC classification number: B81C1/00142 ,  H01L21/764 ,  B81C2201/017 ,  B81C2201/0191

Abstract: An air bridge type structure of a bridge shape which joins to a substrate or micro-structure is manufactured by forming an air bridge type structure on a first substrate and transferring the air bridge type structure to a second substrate and/or a micro-structure formed on the second substrate. A mold substrate, comprising a recessed portion provided on the surface of the mold substrate and a peeling layer formed on the recessed portion, is used for formation of the air bridge type structure. A micro-structure can be supported by the air bridge type structure, for example, a probe for detecting tunneling current or micro-force, supported by the air bridge type structure. Accordingly, electrical connection between structures and the substrate or between the structures one to another can be performed, even if there is undercutting underneath the structures. Film stress generated upon formation of air bridge type structures can be avoided, and increasing of productivity and lowering of costs can be simultaneously achieved.

Abstract translation: 通过在第一基板上形成空气桥型结构并将空气桥型结构转移到形成的第二基板和/或微结构来制造与基板或微结构连接的桥接形状的气桥式结构 在第二基板上。 模具基板包括设置在模具基板的表面上的凹部和形成在凹部上的剥离层，用于形成气桥式结构。 微型结构可以由气桥式结构支撑，例如用于检测由气桥式结构支撑的隧道电流或微力的探针。 因此，即使结构下面存在底切，也可以执行结构与基板之间或结构之间的电连接。 可以避免在形成气桥式结构时产生的薄膜应力，同时可以实现生产率的提高和成本的降低。

公开(公告)号：US5994750A

公开(公告)日：1999-11-30

申请号：US552936

申请日：1995-11-03

Applicant: Takayuki Yagi

Inventor： Takayuki Yagi

IPC: G01N37/00 ,  B05D7/02 ,  B32B15/08 ,  B81B3/00 ,  B81C1/00 ,  C23F1/00 ,  C23F4/00 ,  G01Q10/02 ,  G01Q10/04 ,  G01Q60/00 ,  G01Q70/16 ,  G01Q80/00 ,  G01Q90/00 ,  G02B26/08 ,  H01H59/00 ,  H02N1/00 ,  H01L29/82

CPC classification number: H01H59/0009 ,  H02N1/006 ,  Y10S977/873

Abstract: There is provided a microstructure comprising a substrate, support members, a lever and an electrode formed on the lever is characterized in that said support members support said substrate and said beam and/or the electrode section with a void interposed therebetween and an electrode is formed on the lower surface of said beam. There are also provided a method of forming such a microstructure and an electrostatic actuator having a beam that is displaced by applying a voltage to the electrodes of the actuator.

Abstract translation: 提供了一种包括基板，支撑构件，杠杆和形成在杠杆上的电极的微结构，其特征在于，所述支撑构件支撑所述基板和所述梁和/或电极部分，并且形成有空隙并形成电极 在所述梁的下表面上。 还提供了一种形成这种微结构的方法和具有通过向致动器的电极施加电压而移位的光束的静电致动器。

公开(公告)号：US5923637A

公开(公告)日：1999-07-13

申请号：US715391

申请日：1996-09-13

Applicant: Yasuhiro Shimada ,  Takayuki Yagi ,  Tsutomu Ikeda

Inventor： Yasuhiro Shimada ,  Takayuki Yagi ,  Tsutomu Ikeda

IPC: G01B21/30 ,  G01B7/34 ,  G01N37/00 ,  G01Q60/16 ,  G01Q60/38 ,  G01Q60/54 ,  G01Q70/10 ,  G01Q70/14 ,  G01Q80/00 ,  G01Q90/00 ,  G01R33/038 ,  G11B5/35 ,  G11B9/00 ,  G11B9/14 ,  G02B21/00

CPC classification number: G01Q60/16 ,  B82Y35/00 ,  G01Q60/38 ,  G01Q60/54 ,  G01Q70/14 ,  G01R33/0385 ,  G11B5/35 ,  G11B9/14 ,  G11B9/1409 ,  G11B9/1418 ,  G11B9/1436 ,  B82Y10/00 ,  B82Y25/00 ,  Y10S977/875

Abstract: A micro-tip for detecting tunneling current, micro force or magnetic force is manufactured as follows. A recess portion is formed on the surface of a first substrate. A peeling layer are formed on the substrate including the recess of the first substrate. A micro-tip is formed on the peeling layer of the first substrate. A joining layer is formed on a second substrate. The micro-tip on the peeling layer including the recess in the first substrate is transferred onto the joining layer on the second substrate. The peeling layer mainly consists of an oxide or a nitride, of a metal element, a semi-metal element or a semiconductor element.

Abstract translation: 用于检测隧道电流，微力或磁力的微尖端如下制造。 在第一基板的表面上形成凹部。 在包括第一基板的凹部的基板上形成剥离层。 在第一基板的剥离层上形成微尖端。 接合层形成在第二基板上。 包括第一基板中的凹部的剥离层上的微尖端被转印到第二基板上的接合层上。 剥离层主要由金属元素，半金属元素或半导体元件的氧化物或氮化物构成。

公开(公告)号：US5866021A

公开(公告)日：1999-02-02

申请号：US713228

申请日：1996-09-12

Applicant: Takayuki Yagi ,  Tsutomu Ikeda ,  Yasuhiro Shimada

Inventor： Takayuki Yagi ,  Tsutomu Ikeda ,  Yasuhiro Shimada

IPC: G01N37/00 ,  B81B3/00 ,  B81C1/00 ,  G01B7/34 ,  G01N27/00 ,  G01Q60/16 ,  G01Q60/24 ,  G01Q60/38 ,  G01Q70/18 ,  G11B9/14 ,  H01J9/02 ,  B44C1/22

CPC classification number: G01Q70/16 ,  B81C1/00111 ,  B82Y35/00 ,  H01J9/025 ,  B81B2201/12 ,  B81C2201/0191

Abstract: A micro-tip is manufactured by forming a recess portion on a first substrate consisting of monocrystalline silicon for forming a tip. A peeling layer is formed on the recess portion, and contact layer is formed on at least a portion other than the peeling layer on the substrate. A tip material layer is formed on the peeling layer and the contact layer. The tip material layer on the peeling layer is transferred onto a second substrate.

Abstract translation: 通过在由用于形成尖端的单晶硅组成的第一衬底上形成凹部来制造微尖端。 在凹部上形成剥离层，在基板上的剥离层以外的至少一部分上形成接触层。 在剥离层和接触层上形成尖端材料层。 剥离层上的尖端材料层被转印到第二基板上。

公开(公告)号：US5753911A

公开(公告)日：1998-05-19

申请号：US783847

申请日：1997-01-16

Applicant: Susumu Yasuda ,  Takayuki Yagi

Inventor： Susumu Yasuda ,  Takayuki Yagi

IPC: G01B7/34 ,  B25J9/12 ,  B81B3/00 ,  G01B7/00 ,  G01N27/60 ,  G01N37/00 ,  G01Q10/04 ,  G01Q30/04 ,  G01Q60/04 ,  G01Q60/16 ,  G01Q60/38 ,  G01Q80/00 ,  G11B9/00 ,  G11B9/14 ,  H02N1/00 ,  H01J37/20

CPC classification number: G01Q10/04 ,  B82Y35/00 ,  G11B9/1418 ,  H02N1/006 ,  B82Y10/00 ,  G01Q80/00 ,  Y10S977/725 ,  Y10S977/851 ,  Y10S977/864 ,  Y10S977/872 ,  Y10S977/891 ,  Y10S977/904

Abstract: An electrostatic actuator includes a movable plate arranged on a substrate through a gap, a movable electrode arranged on the movable plate, and a fixed electrode arranged on the substrate to oppose the movable electrode. The movable electrode and the fixed electrode are arranged not to overlap at any portion in a direction perpendicular to a surface of the fixed electrode. The movable electrode and the fixed electrode have comb-like shapes.

Abstract translation: 静电致动器包括通过间隙布置在基板上的可动板，布置在可动板上的可动电极和布置在基板上以与可动电极相对的固定电极。 可动电极和固定电极在垂直于固定电极的表面的方向上的任何部分处被布置成不重叠。 可动电极和固定电极具有梳状形状。

公开(公告)号：US5673476A

公开(公告)日：1997-10-07

申请号：US563906

申请日：1995-11-22

Applicant: Masatake Akaike ,  Takayuki Yagi ,  Masahiro Fushimi

Inventor： Masatake Akaike ,  Takayuki Yagi ,  Masahiro Fushimi

IPC: G01P15/08 ,  G01P15/093 ,  G01P15/12 ,  H01L21/02 ,  H01L21/20 ,  H01L29/84 ,  H01R43/00

CPC classification number: G01P15/0802 ,  G01P15/093 ,  G01P15/12 ,  G01P15/18 ,  H01L21/2007 ,  G01P2015/0814 ,  G01P2015/084 ,  Y10T29/49117

Abstract: An anode bonding method for bonding a first substrate and a second substrate, both of which have a recessed portion, includes the steps of heating the first and second substrates in a stacked state; and bonding the substrates by applying a voltage between the substrates.

Abstract translation: 两者具有凹部的用于接合第一基板和第二基板的阳极接合方法包括以堆叠状态加热第一基板和第二基板的步骤; 以及通过在基板之间施加电压来结合基板。