公开(公告)号：US20160358919A1

公开(公告)日：2016-12-08

申请号：US14727875

申请日：2015-06-02

Applicant: United Microelectronics Corp.

Inventor： Kuan-Chuan Chen ,  Chih-Chung Wang ,  Wen-Fang Lee ,  Nien-Chung Li ,  Shih-Yin Hsiao

IPC: H01L27/092 ,  H01L29/06 ,  H01L29/423 ,  H01L29/66 ,  H01L21/8238

CPC classification number: H01L29/0653 ,  H01L21/28238 ,  H01L21/823418 ,  H01L21/823462 ,  H01L27/088 ,  H01L29/4236 ,  H01L29/42364 ,  H01L29/66545 ,  H01L29/66568 ,  H01L29/66613

Abstract: A method for forming a high voltage transistor is provided. First, a substrate having a top surface is provided, following by forming a thermal oxide layer on the substrate. At least a part of the thermal oxidation layer is removed to form a recess in the substrate, wherein a bottom surface of the recess is lower than the top surface of the substrate. A gate oxide layer is formed in the recess, then a gate structure is formed on the gate oxide layer. The method further includes forming a source/drain region in the substrate.

Abstract translation: 提供一种用于形成高压晶体管的方法。 首先，提供具有顶面的基板，接着在基板上形成热氧化层。 去除热氧化层的至少一部分以在衬底中形成凹部，其中凹部的底表面低于衬底的顶表面。 在凹部中形成栅极氧化层，然后在栅极氧化物层上形成栅极结构。 该方法还包括在衬底中形成源极/漏极区域。

公开(公告)号：US09136375B2

公开(公告)日：2015-09-15

申请号：US14085939

申请日：2013-11-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Te Lee ,  Ming-Shun Hsu ,  Ke-Feng Lin ,  Chih-Chung Wang ,  Hsuan-Po Liao ,  Shih-Teng Huang ,  Shu-Wen Lin ,  Su-Hwa Tsai ,  Shih-Yin Hsiao

IPC: H01L29/78 ,  H01L27/088 ,  H01L29/06 ,  H01L29/10

CPC classification number: H01L29/7816 ,  H01L21/823425 ,  H01L21/823481 ,  H01L21/823493 ,  H01L27/088 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/0886 ,  H01L29/1083 ,  H01L29/1095

Abstract: A semiconductor structure is provided. The semiconductor structure comprises a substrate, a deep well formed in the substrate, a first well and a second well formed in the deep well, a gate electrode formed on the substrate and disposed between the first well and the second well, a first isolation, and a second isolation. The second well is spaced apart from the first well. The first isolation extends down from the surface of the substrate and is disposed between the gate electrode and the second well. The second isolation extends down from the surface of the substrate and is adjacent to the first well. A ratio of a depth of the first isolation to a depth of the second isolation is smaller than 1.

Abstract translation: 提供半导体结构。 半导体结构包括衬底，在衬底中形成的深阱，在深阱中形成的第一阱和第二阱，形成在衬底上并设置在第一阱和第二阱之间的栅电极，第一隔离， 和第二个隔离。 第二口井与第一口井隔开。 第一隔离件从衬底的表面向下延伸并且设置在栅电极和第二阱之间。 第二隔离件从衬底的表面向下延伸并与第一阱相邻。 第一隔离深度与第二隔离深度之比小于1。

公开(公告)号：US20150137228A1

公开(公告)日：2015-05-21

申请号：US14085939

申请日：2013-11-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chiu-Te Lee ,  Ming-Shun Hsu ,  Ke-Feng Lin ,  Chih-Chung Wang ,  Hsuan-Po Liao ,  Shih-Teng Huang ,  Shu-Wen Lin ,  Su-Hwa Tsai ,  Shih-Yin Hsiao

IPC: H01L29/78 ,  H01L29/06 ,  H01L29/10 ,  H01L27/088

CPC classification number: H01L29/7816 ,  H01L21/823425 ,  H01L21/823481 ,  H01L21/823493 ,  H01L27/088 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/0886 ,  H01L29/1083 ,  H01L29/1095

Abstract: A semiconductor structure is provided. The semiconductor structure comprises a substrate, a deep well formed in the substrate, a first well and a second well formed in the deep well, a gate electrode formed on the substrate and disposed between the first well and the second well, a first isolation, and a second isolation. The second well is spaced apart from the first well. The first isolation extends down from the surface of the substrate and is disposed between the gate electrode and the second well. The second isolation extends down from the surface of the substrate and is adjacent to the first well. A ratio of a depth of the first isolation to a depth of the second isolation is smaller than 1.

Abstract translation: 提供半导体结构。 半导体结构包括衬底，在衬底中形成的深阱，在深阱中形成的第一阱和第二阱，形成在衬底上并设置在第一阱和第二阱之间的栅电极，第一隔离， 和第二个隔离。 第二口井与第一口井隔开。 第一隔离件从衬底的表面向下延伸并且设置在栅电极和第二阱之间。 第二隔离件从衬底的表面向下延伸并与第一阱相邻。 第一隔离深度与第二隔离深度之比小于1。

公开(公告)号：US08994103B2

公开(公告)日：2015-03-31

申请号：US13938252

申请日：2013-07-10

Applicant: United Microelectronics Corp.

Inventor： Wei-Lin Chen ,  Tseng-Hsun Liu ,  Kuan-Yu Chen ,  Chiu-Ling Lee ,  Chiu-Te Lee ,  Chih-Chung Wang

IPC: H01L29/66 ,  H01L29/78

CPC classification number: H01L29/7816 ,  H01L29/0653 ,  H01L29/0878 ,  H01L29/42368 ,  H01L29/66704 ,  H01L29/7825

Abstract: A lateral double-diffused metal-oxide-semiconductor transistor device includes a substrate having at least a shallow trench isolation formed therein, an epitaxial layer encompassing the STI in the substrate, a gate, and a drain region and a source region formed in the substrate at respective two sides of the gate. The epitaxial layer, the source region and the drain region include a first conductivity type. The gate includes a first portion formed on the substrate and a second portion extending into the STI.

Abstract translation: 横向双扩散金属氧化物半导体晶体管器件包括其中形成有至少浅沟槽隔离的衬底，包围衬底中的STI的外延层，栅极和漏极区以及形成在衬底中的源极区 在门的相应两侧。 外延层，源极区和漏极区包括第一导电型。 栅极包括形成在基板上的第一部分和延伸到STI中的第二部分。

公开(公告)号：US08937352B2

公开(公告)日：2015-01-20

申请号：US14181733

申请日：2014-02-17

Applicant: United Microelectronics Corp.

Inventor： Ming-Tsung Lee ,  Cheng-Hua Yang ,  Wen-Fang Lee ,  Chih-Chung Wang ,  Chih-Wei Hsu ,  Po-Ching Chuang

IPC: H01L29/78 ,  H01L29/06 ,  H01L29/40 ,  H01L29/423

CPC classification number: H01L29/7816 ,  H01L29/0634 ,  H01L29/0696 ,  H01L29/402 ,  H01L29/404 ,  H01L29/42368

Abstract: A layout pattern of an implant layer includes at least a linear region and at least a non-linear region. The linear region includes a plurality of first patterns to accommodate first dopants and the non-linear region includes a plurality of second patterns to accommodate the first dopants. The linear region abuts the non-linear region. Furthermore, a pattern density of the first patterns in the linear region is smaller than a pattern density of the second patterns in the non-linear region.

Abstract translation: 植入层的布局图案至少包括线性区域和至少非线性区域。 线性区域包括容纳第一掺杂剂的多个第一图案，并且非线性区域包括多个第二图案以容纳第一掺杂剂。 线性区域邻接非线性区域。 此外，线性区域中的第一图案的图案密度小于非线性区域中的第二图案的图案密度。

公开(公告)号：US08829611B2

公开(公告)日：2014-09-09

申请号：US13629608

申请日：2012-09-28

Applicant: United Microelectronics Corp.

Inventor： Ming-Shun Hsu ,  Ke-Feng Lin ,  Chiu-Te Lee ,  Chih-Chung Wang

IPC: H01L29/78

CPC classification number: H01L29/0878 ,  H01L29/063 ,  H01L29/0653 ,  H01L29/0692 ,  H01L29/7816

Abstract: A high voltage metal-oxide-semiconductor transistor device includes a substrate having an insulating region formed therein, a gate covering a portion of the insulating region and formed on the substrate, a source region and a drain region formed at respective sides of the gate in the substrate, a body region formed in the substrate and partially overlapped by the gate, and a first implant region formed in the substrate underneath the gate and adjacent to the body region. The substrate and body region include a first conductivity type. The source region, the drain region, and the first implant region include a second conductivity type. The first conductivity type and the second conductivity type are complementary to each other.

Abstract translation: 高电压金属氧化物半导体晶体管器件包括其中形成有绝缘区域的衬底，覆盖绝缘区域的一部分并形成在衬底上的栅极，形成在栅极各侧的源极区域和漏极区域 基板，形成在基板中并与栅极部分重叠的主体区域，以及形成在栅极下方并与主体区域相邻的基板中的第一注入区域。 衬底和体区包括第一导电类型。 源极区域，漏极区域和第一注入区域包括第二导电类型。 第一导电类型和第二导电类型彼此互补。