Abstract:
An ultrasound transducer includes: an acoustic matching layer bending with a predetermined curvature; a plurality of piezoelectric elements disposed on an inner face on a side of a curvature center of the acoustic matching layer in such a manner that the plurality of piezoelectric elements bend; a plurality of wirings including respective one ends electrically connected to the plurality of piezoelectric elements, respectively; a substrate to which respective other ends of the plurality of wirings are electrically connected; and a holding member provided on the plurality of wirings at a position partway of the plurality of wirings between the plurality of piezoelectric elements and the substrate, the holding member being configured to hold a pitch of the plurality of wirings so as to be a pitch that is equal to or smaller than a predetermined arrangement pitch of the plurality of piezoelectric elements.
Abstract:
Flex circuits and methods for ultrasound transducers are provided herein. In at least one embodiment, an ultrasound device includes a plurality of transducer elements and a flex circuit. The flex circuit includes an insulating layer having a first surface and a second surface opposite the first surface. A plurality of first conductive pads is included on the first surface of the insulating layer, and each of the first conductive pads is electrically coupled to a respective transducer element. A plurality of second conductive pads are included on the second surface of the insulating layer, and each of the second conductive pads is electrically coupled to a respective first conductive pad and the respective transducer element.
Abstract:
An ultrasound transducer used in an ultrasound system and a manufacturing method thereof includes: a backing block; a piezoelectric layer placed on the backing block; a matching layer placed on the piezoelectric layer; and a ground layer placed between the piezoelectric layer and the matching layer. The backing layer includes a connector that connects a transmitting unit and a receiving unit of an ultrasound system, and a wiring area that connects the piezoelectric layer and the connector. The wiring area is formed by etching and filling with metal material.
Abstract:
An electronic device including an array of ultrasonic transducers, a temperature sensor for determining a temperature of the array of ultrasonic transducers, and a control module communicatively coupled to the array of ultrasonic devices and the temperature sensor. The control module is for receiving the temperature and for controlling operation of the array of ultrasonic transducers based at least in part on the temperature.
Abstract:
An array of piezoelectric ultrasonic transducer elements includes a plurality of superpixel regions. Each superpixel region includes at least two pixel sets, a first pixel set of the at least two pixel sets being disposed in a central portion of the superpixel region, and at least a second pixel set being disposed in an outer portion of the superpixel region. An electrical coupling may be provided between the array and transceiver electronics. The transceiver electronics may be configured to operate the array in a selectable one of a first mode and a second mode. In the first mode, the array generates a substantially plane ultrasonic wave having a first acoustic pressure. In the second mode, the array generates, from each superpixel region, a focused beam having a second acoustic pressure that is substantially higher than the first acoustic pressure.
Abstract:
An ultrasound machine for generating push-pulses to excite shear wave stimulation employs separated angled beams that converge at the target region to generate the push-pulses. In one embodiment, the beams are modulated by a set of apodization functions to reduce side lobes caused by the narrowing of the apertures of the beam as well as transducer heating by reducing the average energy deposited in each transducer element
Abstract:
An ultrasonic probe includes a plurality of ultrasonic transducers. The ultrasonic probe is connected to a reception system circuit including at least one first delay adder circuit in which a predetermined number among the plurality of ultrasonic transducers is configured as one subarray and delaying and adding are performed in subarray units with respect to an ultrasonic wave reception signal that is acquired from the ultrasonic transducers included in the subarray, and a second delay adder circuit in which delaying and adding are performed with respect to the ultrasonic wave reception signal that is acquired from the ultrasonic transducers. The plurality of ultrasonic transducers include a first group which transmits the reception signal to the second delay adder circuit passing through the first delay adder circuit and a second group which transmits the reception signal directly to the second delay adder circuit without passing through the first delay adder circuit.
Abstract:
A sensor assembly including one or more capacitive micromachined ultrasonic transducer (CMUT) microarray modules which are provided with a number of individual transducers. The microarray modules are arranged to simulate or orient individual transducers in a hyperbolic paraboloid geometry. The transducers/sensor are arranged in a rectangular or square matrix and are activatable individually, selectively or collectively to emit and received reflected beam signals at a frequency of between about 100 to 170 kHz.
Abstract:
The present invention relates to a driver device (40) for driving a load (52) having a plurality of separate capacitive load elements (52), in particular an ultrasound transducer having a plurality of transducer elements (52), comprising: input terminals (44, 46) for connecting the driver device (40) to power supply (48); a plurality of output terminals (50) each for connecting the driver device (40) to one of load elements (52), a first controllable switch (54) connected to a first of the input terminals (44), and a plurality of driving elements (42) each having a second controllable switch (60) and a resistor (58) connected in series to each other, wherein each of the driving elements (42) is connected in series with the first controllable switch (54) and to a second of the input terminals (46), and wherein each of the output terminals (50) is connected to one of the driving elements (42) for powering the load elements (52).
Abstract:
Sub-performing elements of an ultrasound transducer array are detected. The power, such as current, used by or provided to the transmit driver is measured. By driving each element or group of elements separately, defective elements or groups of elements are detected from the amount of power used.