公开(公告)号：US20230194989A1

公开(公告)日：2023-06-22

申请号：US18113089

申请日：2023-02-23

申请人： Merck Patent GmbH

发明人： Shigemasa NAKASUGI ,  Yusuke Hama ,  Hiroshi Yanagita ,  Takashi Sekito ,  Yuriko Matsuura

IPC分类号： G03F7/09 ,  C08G8/02 ,  C08G8/30 ,  C09D161/16 ,  G03F7/11

CPC分类号： G03F7/094 ,  C08G8/02 ,  C08G8/30 ,  C09D161/16 ,  G03F7/11

摘要： [Problem to be Solved] An object is to provide a compound with good heat resistance. And another object is to provide a coating made exhibits less film shrinkage, good gap filling property and good planarization. [Solution] The present invention provides an ethynyl derived composite and a composition comprising thereof. And the present invention provides a method for manufacturing a coating by it, and a method for manufacturing a device.

公开(公告)号：US10081585B2

公开(公告)日：2018-09-25

申请号：US14897864

申请日：2014-02-21

申请人： DIC Corporation

发明人： Yutaka Satou ,  Ayumi Takahashi

IPC分类号： C07C39/14 ,  C07C37/14 ,  H01L23/29 ,  C08G61/02 ,  C08G8/02 ,  C08L61/16 ,  C08K3/04 ,  C08K7/18 ,  H05K1/03 ,  H05K1/09 ,  C08G59/62 ,  C08L63/00 ,  C08L91/06 ,  C07C37/00 ,  C08L65/00

CPC分类号： C07C39/14 ,  C07C37/14 ,  C08G8/02 ,  C08G59/621 ,  C08G61/02 ,  C08K3/04 ,  C08L61/16 ,  C08L63/00 ,  C08L65/00 ,  C08L91/06 ,  H01L23/293 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K1/09 ,  H01L2924/00

摘要： There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); wherein, in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein r is 1 or 2.

公开(公告)号：US20180044270A1

公开(公告)日：2018-02-15

申请号：US15556121

申请日：2016-03-02

申请人： Mitsubishi Gas Chemical Company, Inc.

发明人： Junya HORIUCHI ,  Masatoshi ECHIGO ,  Takashi MAKINOSHIMA

IPC分类号： C07C37/20 ,  C07C39/15 ,  H01L21/308 ,  C08G8/02 ,  G03F7/11 ,  C07C37/72 ,  C08G8/20

CPC分类号： C07C37/20 ,  C07C37/72 ,  C07C39/15 ,  C08G8/02 ,  C08G8/04 ,  C08G8/20 ,  G03F7/11 ,  H01L21/3081

摘要： A compound represented by the following formula (1). (in formula (1), each R1 independently represents a divalent group having 1 to 30 carbon atoms, each of R2 to R7 independently represents a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms, an aryl group having 6 to 10 carbon atoms, an alkenyl group having 2 to 10 carbon atoms, a thiol group or a hydroxyl group, in which at least one R5 represents a hydroxyl group or a thiol group, each of m2, m3 and m6 is independently an integer of 0 to 9, each of m4 and m7 is independently an integer of 0 to 8, m5 is an integer of 1 to 9, n is an integer of 1 to 4, and each of p2 to p7 is independently an integer of 0 to 2.)

公开(公告)号：US09765176B2

公开(公告)日：2017-09-19

申请号：US14653645

申请日：2013-12-19

申请人： SOLVAY SPECIALTY POLYMERS USA, LLC

发明人： Narmandakh Taylor ,  DeeDee Smith ,  David Blake Roller

IPC分类号： C08G10/00 ,  C08G8/02 ,  C08G65/34 ,  C08G65/40

CPC分类号： C08G10/00 ,  C08G8/02 ,  C08G65/34 ,  C08G65/4012

摘要： A poly(ether ketone) polymer comprising recurring units derived from the reaction of at least one aromatic dihalo-compound comprising at least one —C(O)— group and at least one diol having a general formula HO-Dol-OH wherein Dol is an aliphatic group comprising from 4 to 20 carbon atoms which comprises at least one cycloaliphatic moiety.

公开(公告)号：US09765173B2

公开(公告)日：2017-09-19

申请号：US14900296

申请日：2014-02-27

申请人： DIC Corporation

发明人： Yutaka Satou ,  Ayumi Takahashi

IPC分类号： C08G8/00 ,  C07D307/92 ,  H01L23/29 ,  H05K1/03 ,  C08G8/02 ,  C07D307/77 ,  C08L63/04 ,  H05K1/09 ,  C08L61/04

CPC分类号： C08G8/02 ,  C07D307/77 ,  C07D307/92 ,  C08L61/04 ,  C08L63/04 ,  H01L23/293 ,  H01L23/295 ,  H05K1/0326 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K3/022

摘要： There are provided a compound containing a phenolic hydroxyl group which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product, a phenolic resin including the same, a curable composition and a cured product thereof, and a semiconductor sealing material. The compound containing a phenolic hydroxyl group has a dinaphthofuran skeleton, in which each of the two naphthylene skeletons has a hydroxyl group on an aromatic nucleus thereof.

公开(公告)号：US09587107B2

公开(公告)日：2017-03-07

申请号：US13879478

申请日：2011-09-27

申请人： Christopher A. Bertelo ,  Manuel A. Garcia-Leiner ,  Anthony Decarmine ,  Scott F. Defelice

发明人： Christopher A. Bertelo ,  Manuel A. Garcia-Leiner ,  Anthony Decarmine ,  Scott F. Defelice

IPC分类号： C08G8/04 ,  B05D3/02 ,  C08L61/16 ,  C08L71/00 ,  B29C39/08 ,  B29C67/00 ,  C08G8/02

CPC分类号： C08L61/16 ,  B29B15/00 ,  B29C39/08 ,  B29C64/153 ,  B29K2071/00 ,  B29K2995/004 ,  B33Y10/00 ,  B33Y70/00 ,  C08G8/02 ,  C08G2650/40 ,  C08L71/00 ,  C08L2205/025

摘要： The invention relates to heat treatment of polymorphic semicrystalline or crystallizable polymers to increase the content of the highest melting crystalline form. Such heat treatment results in a polymer powder that has a consistent, uniform melting range, improved flow and improved durability of the powder particle size for applications that require powder flow at elevated temperatures. In addition to improved powder properties, the articles produced from the powders also exhibit better physical properties in both appearance and in mechanical properties. Thus the invention also includes polymer powders and articles produced by the described processes.

摘要翻译： 本发明涉及多晶型半结晶或可结晶聚合物的热处理，以增加最高熔点晶体形式的含量。 这种热处理产生聚合物粉末，其具有在需要高温下粉末流动的应用中具有一致的，均匀的熔融范围，改善的流动性和改善的粉末粒度的耐久性。 除了改进的粉末性质之外，由粉末制造的制品在外观和机械性能方面也表现出更好的物理性能。 因此，本发明还包括通过所述方法制备的聚合物粉末和制品。

公开(公告)号：US20170018436A1

公开(公告)日：2017-01-19

申请号：US15198369

申请日：2016-06-30

申请人： SHIN-ETSU CHEMICAL CO., LTD.

发明人： Jun HATAKEYAMA ,  Daisuke KORI ,  Tsutomu OGIHARA

IPC分类号： H01L21/308 ,  H01L21/311 ,  H01L21/3213 ,  C08G8/10 ,  C07C49/665 ,  G03F7/20 ,  G03F7/32 ,  C07C39/17 ,  C07D493/10 ,  H01L21/027 ,  G03F7/11

CPC分类号： G03F7/11 ,  C07C39/17 ,  C07C49/665 ,  C07C2603/52 ,  C07D493/10 ,  C08G8/02 ,  C08G8/10 ,  C08G8/20 ,  C08G8/36 ,  C08L61/06 ,  C08L61/12 ,  G03F7/0752 ,  G03F7/091 ,  G03F7/094 ,  H01L21/0332 ,  H01L21/31116 ,  H01L21/31138 ,  C08L63/00

摘要： The present invention provides a resist underlayer film composition for lithography, containing a compound having an indenofluorene structure. This resist underlayer film composition is excellent in filling property, generates little outgas, and has high heat resistance.

摘要翻译： 本发明提供了含有具有茚并芴结构的化合物的光刻用抗蚀剂下层膜组合物。 该抗蚀剂下层膜组合物的填充性优异，少量排气，耐热性高。

公开(公告)号：US20160311979A1

公开(公告)日：2016-10-27

申请号：US15202133

申请日：2016-07-05

申请人： NISSAN CHEMICAL INDUSTRIES, LTD.

发明人： Mamoru TAMURA ,  Hiroshi OGINO ,  Tomoyuki ENOMOTO

IPC分类号： C08G75/20 ,  H01L23/29 ,  H01L23/48 ,  C09D181/06 ,  H01L21/02 ,  H01L21/768 ,  C08G8/02 ,  C09D161/16 ,  H01L23/31 ,  H01L21/56

CPC分类号： C08G75/20 ,  C08G8/02 ,  C08G65/40 ,  C08G65/48 ,  C09D161/16 ,  C09D171/12 ,  C09D181/06 ,  H01L21/02118 ,  H01L21/02318 ,  H01L21/56 ,  H01L21/76898 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/481 ,  H01L29/06 ,  H01L2924/0002 ,  H01L2924/00

摘要： There is provided a composition for forming a passivation film that satisfies electric insulation, heat-tolerance, solvent-tolerance, and a dry etch back property at the same time. A composition for forming a passivation film, including: a polymer containing a unit structure of Formula (i): T0-O  Formula (i) (where T0 is a sulfonyl group, a fluoroalkylene group, a cycloalkylene group, or an arylene group having a substituent, or is a combination of an arylene group optionally having a substituent and a fluoroalkylene group or a cycloalkylene group), wherein the polymer has at least one of a group having a structure of Formula (2-A), a group having a structure of Formula (2-B), or a group having both of the structures, at an end, in a side chain, or in a main chain of the polymer: The polymer may contain a unit structure of Formula (1): L1-O-T1-O  Formula (1)

公开(公告)号：US20160145385A1

公开(公告)日：2016-05-26

申请号：US14860990

申请日：2015-09-22

申请人： Solvay Advanced Polymers, L.L.C.

发明人： Chantal Louis

IPC分类号： C08G65/40 ,  C01D7/00

CPC分类号： C08G65/4012 ,  C01D7/00 ,  C07C45/78 ,  C07C315/06 ,  C08G8/02 ,  C08G65/4087 ,  C08G65/4093 ,  C08G75/23 ,  C08G2261/3444

摘要： A method for the preparation of a poly(ether ether ketone) (PEEK) includes: preparing the PEEK by aromatic nucleophilic substitution in the presence of: a) particulate sodium carbonate (Na2CO3), wherein said particulate sodium carbonate has a particle size distribution as follows: D90≧45 μm and D90≦250 μm and D99.5≦710 μm, wherein said particle size distribution is measured by mechanical sieving in accordance with ASTM E 359-00 (reapproved 2005), wherein said measurement is based on the mechanical separation of various fractions on a series of superimposed sieves which are superimposed by descending order of opening mesh of 1000 μm, 500 μm, 250 μm, 180 μm, 125 μm, 90 μm, 63 μm, and 45 μm; and b) potassium carbonate (K2CO3) in an amount ranging from 0.001 to about 0.05 mol K/mol Na.

摘要翻译： 制备聚（醚醚酮）（PEEK）的方法包括：在以下存在下，通过芳族亲核取代制备PEEK：a）碳酸钠（Na 2 CO 3），其中所述颗粒状碳酸钠的粒度分布为 如下：D90≥45μm和D90＆NlE;250μm和D99.5＆amp;710μm，其中所述粒度分布通过根据ASTM E 359-00（重新批准的2005年）的机械筛分来测量，其中所述测量基于机械 在1000μm，500μm，250μm，180μm，125μm，90μm，63μm和45μm的开口网格的高度依次叠加的一系列叠加筛上分离各种级分; 和b）0.001至约0.05mol K / mol Na的量的碳酸钾（K 2 CO 3）。

公开(公告)号：US20160137770A1

公开(公告)日：2016-05-19

申请号：US14897850

申请日：2014-02-21

申请人： DIC CORPORATION

发明人： Yutaka Satou ,  Ayumi Takahashi

IPC分类号： C08G8/02 ,  H05K1/03 ,  H05K1/09 ,  C07C39/15

CPC分类号： C08G8/02 ,  C07C39/15 ,  C08G59/621 ,  C08G61/02 ,  C08L61/16 ,  C08L65/00 ,  H01L23/295 ,  H01L2924/0002 ,  H05K1/0373 ,  H05K1/09 ,  H01L2924/00

摘要： There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The compound containing a phenolic hydroxyl group has a molecular structure represented by the following General Formula (I): wherein X is a structural site represented by the following Structural Formula (x1) or (x2); in Formula (x1) or (x2), k is an integer of 1 to 3, m is 1 or 2, Ar is a structural site represented by the following Structural Formula (Ar1), and in a case where when k or m is 2 or greater, a plurality of Ar's may be the same as or different from each other; wherein p is 1 or 2.

摘要翻译： 提供了含有酚羟基的化合物，其固化产物具有优异的耐热性和优异的阻燃性，包含该酚羟基的酚醛树脂，固化性组合物及其固化产物，半导体密封材料和 印刷电路板。 含有酚羟基的化合物具有由以下通式（I）表示的分子结构：其中X是由以下结构式（x1）或（x2）表示的结构位点。 在式（x1）或（x2）中，k为1〜3的整数，m为1或2，Ar为下述结构式（Ar1）表示的结构部位，在k或m为 2以上时，多个Ar可以相同或不同; 其中p为1或2。