公开(公告)号：US4812199A

公开(公告)日：1989-03-14

申请号：US135204

申请日：1987-12-21

Applicant: Edward N. Sickafus

Inventor： Edward N. Sickafus

IPC: G01L1/14 ,  G01P15/08 ,  G01P15/125 ,  H01L21/306

CPC classification number: G01L1/148 ,  G01P15/0802 ,  G01P15/125 ,  Y10T29/43

Abstract: A suspended element etched in a silicon substrate whcih is deflected in linear proportion to an applied force. A pair of flexing member symmetrically positioned around the suspended element provides rectilinear movement of the suspended element in response to the applied force. In one embodiment of the invention, the flexing member is formed in a single etchant step by concurrently etching nearly identical recesses into opposing planar surfaces of the silicon substrate. In this embodiment, the portions of silicon remaining between the recesses and planar surfaces define the flexing member.

公开(公告)号：US11852547B1

公开(公告)日：2023-12-26

申请号：US18106586

申请日：2023-02-07

Applicant: The United States of America, as represented by the Secretary of the Navy

Inventor： Zachary A. Sechrist ,  Ronald J. Tonucci

IPC: G01L1/14 ,  B60R11/00

CPC classification number: G01L1/146 ,  B60R11/00 ,  G01L1/148 ,  B60R2011/004 ,  B60R2011/0063

Abstract: A sensor configured to sense when a force is applied to a surface includes a capacitive structure having a first conductive layer, a dielectric layer, and a second conductive layer. The dielectric layer is overlain on the first conductive layer and the second conductive layer is overlain on the dielectric layer. A glass superstrate has a first side and a second side, with the first side overlain on the second conductive layer. The force is applied to the second side of the glass superstrate. The force results from an object attached to the second side of the glass superstrate. The force causes capacitance changes between the first and second conductive layers. The force can be compressive or tensile, depending on whether the object is attached by magnet or adhesive.

公开(公告)号：US11796405B2

公开(公告)日：2023-10-24

申请号：US17205860

申请日：2021-03-18

Applicant: New Degree Technology, LLC

Inventor： Hao Li ,  Zhiyun Chen

IPC: G01L1/22 ,  H01L29/8605 ,  H01L49/02 ,  G01L1/14 ,  G01L1/18 ,  G06F3/041

CPC classification number: G01L1/2293 ,  G01L1/148 ,  G01L1/2262 ,  G01L1/2281 ,  H01L28/20 ,  H01L29/8605 ,  G01L1/18 ,  G06F3/041 ,  G06F2203/04105

Abstract: A hybrid strain sensing system and the method of making such a system provides a thin semiconductor film with strain sensors and signal processing circuits integrated deposited thereon. The semiconductor film may be further processed and then mounted onto a substrate to be used for strain, force, or other related measurements. The system combines the high sensitivity of a semiconductor strain gauge with the high level of integration of semiconductor integrated circuits (IC)s. Both are highly desirable features for applications where miniaturization and/or flexibility are important requirements.

公开(公告)号：US20230288270A1

公开(公告)日：2023-09-14

申请号：US17823929

申请日：2022-08-31

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yoshihiko KURUI ,  Hiroaki YAMAZAKI ,  Fumitaka ISHIBASHI

IPC: G01L1/14 ,  G01L9/00 ,  B81B3/00

CPC classification number: G01L1/148 ,  G01L9/0073 ,  B81B3/0051 ,  B81B2201/0264

Abstract: According to one embodiment, a sensor includes an element part. The element part includes a base body, a first detection support part fixed to the base body, a first detection connection part including a first connection resistance layer and supported by the first detection support part, a first support part fixed to the base body, a first structure body, a first connection part, and a film part. The first structure body includes a first end part and a first other end part. The first end part is supported by the first support part. The first connection part is supported by the first other end part. The film part includes a first detection part and a first part. The first detection part is supported by the first detection connection part. The first part is supported by the first connection part. The film part includes a film part resistance layer.

公开(公告)号：US20180134010A1

公开(公告)日：2018-05-17

申请号：US15567253

申请日：2016-04-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Margot A. BRANIGAN ,  Michael Benton FREE ,  David T. AMOS ,  Robert F. KAMRATH ,  Stephen A. JOHNSON ,  John D. LE

IPC: B32B27/06 ,  B32B5/18 ,  B32B27/36 ,  B32B37/18 ,  G01L1/14

CPC classification number: B32B27/065 ,  B32B5/18 ,  B32B7/06 ,  B32B7/12 ,  B32B25/045 ,  B32B25/14 ,  B32B25/20 ,  B32B27/283 ,  B32B27/302 ,  B32B27/308 ,  B32B27/36 ,  B32B37/182 ,  B32B2255/10 ,  B32B2266/0292 ,  B32B2274/00 ,  B32B2307/4023 ,  B32B2307/732 ,  B32B2307/748 ,  B32B2457/16 ,  B32B2457/208 ,  G01L1/146 ,  G01L1/148 ,  G06F3/044 ,  G06F2203/04105

Abstract: The present disclosure relates to compressible, multilayer articles useful in force sensing capacitors. The compressible multilayer articles include a silicone polymer layer having a first major surface and a second major surface and a first primer layer having a first major surface and a second major surface, wherein the thickness of the first primer layer is from about 100 nanometers to about 100 microns and at least a portion of the first major surface of the first primer layer is adhered to and in contact with the first major surface of the silicone polymer. The multilayer articles may include at least one of a first electrode and second primer layer. Methods of making the compressible, multilayer articles are also disclosed.

公开(公告)号：US20180101251A1

公开(公告)日：2018-04-12

申请号：US15840855

申请日：2017-12-13

Applicant: Wacom Co., Ltd.

Inventor： Hiroyuki Fujitsuka ,  Takenori Kaneda ,  Takayuki Arai ,  Kenichi Ninomiya ,  Kohei Tanaka

IPC: G06F3/0354 ,  G06F3/038 ,  G01L1/14

CPC classification number: G06F3/03545 ,  G01L1/14 ,  G01L1/148 ,  G06F3/0383 ,  G06F3/046

Abstract: A pen pressure detection device includes: a pressure sensor including electrodes that output electrical information corresponding to an applied pressure; and a holder configured to electrically connect the pressure sensor to a circuit board having a circuit that detects the applied pressure based on the electrical information output from the pressure sensor. The holder includes a first portion that retains the pressure sensor and a second portion that engages with the circuit board, and the holder has a surface on which wiring is formed, the wiring extending from the first portion to the second portion, and the electrodes of the pressure sensor being electrically connected to the circuit board via the wiring when the holder and the circuit board are engaged with each other. The pen pressure detection device can be easily assembled and maintain a connection to the circuit board when the applied pressure is high.

公开(公告)号：US09778117B2

公开(公告)日：2017-10-03

申请号：US14780819

申请日：2014-03-27

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Alberto Pagani

IPC: G01L1/14 ,  G01L25/00 ,  G01L1/26

CPC classification number: G01L1/142 ,  G01L1/144 ,  G01L1/148 ,  G01L1/26 ,  G01L25/00

Abstract: The integrated electronic device detects the pressure related to a force applied in a predetermined direction within a solid structure. The device includes an integrated element that is substantially orthogonal to the direction of application of the force. First and second conductive elements are configured to face an operating surface. A measure module includes first and second measurement terminals which are electrically connected to the first and second conductive elements, respectively. A detecting element is arranged in the predetermined direction such that the operating surface is sandwiched between the first and second conductive elements and this detecting element. An insulating layer galvanically insulates the first and second conductive elements. A layer of dielectric material is sandwiched between the detecting element and the insulating layer, and is elastically deformable following the application of the force to change an electromagnetic coupling between the detecting element and the first and second conductive elements.

公开(公告)号：US20170265978A1

公开(公告)日：2017-09-21

申请号：US15310110

申请日：2015-05-22

Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)

Inventor： Marco Borotto ,  Marco Letizia

IPC: A61C19/05 ,  A61B5/00 ,  G01L1/14 ,  A61B5/22

CPC classification number: A61C19/05 ,  A61B5/228 ,  A61B5/4542 ,  A61B5/4547 ,  A61B5/682 ,  A61B2562/0247 ,  A61B2562/046 ,  G01L1/146 ,  G01L1/148

Abstract: The invention relates to devices, systems and methods exploiting capacitive means for monitoring and analysing teeth-related parameters in a subject, such as the dental occlusion profile and/or the load/force applied upon clenching. The device comprises a body such as a bite fork or bite splint, capacitive sensor(s) incorporated within a soft substrate reversibly deformable once bitten by a subject and a micro-controller unit. The teeth contact points and forces applied upon occlusion are measured via the sensors, delivered to and re-elaborated by the micro-controller unit and possibly sent and visualized in a graphical/numerical fashion on e.g. a display screen.

公开(公告)号：US09660169B2

公开(公告)日：2017-05-23

申请号：US14345410

申请日：2011-09-22

Applicant: Viorel G. Dumitru ,  Ion Georgescu ,  Stefan D. Costea ,  Mihai Brezeanu

Inventor： Viorel G. Dumitru ,  Ion Georgescu ,  Stefan D. Costea ,  Mihai Brezeanu

IPC: H01L29/82 ,  H01L41/02 ,  G01L9/00 ,  G01B7/16 ,  G01L1/14 ,  G01L1/16 ,  G01L1/18 ,  G01L1/20 ,  G01L1/22 ,  H01L49/02 ,  H01L29/20 ,  H01L29/778 ,  H01L33/00

CPC classification number: H01L41/02 ,  G01B7/18 ,  G01B7/22 ,  G01L1/146 ,  G01L1/148 ,  G01L1/16 ,  G01L1/18 ,  G01L1/205 ,  G01L1/2293 ,  G01L9/0052 ,  G01L9/0072 ,  G01L9/008 ,  G01L9/0098 ,  H01L28/10 ,  H01L29/2003 ,  H01L29/778 ,  H01L33/00

Abstract: Sensors and methods of operating sensors are described herein. One sensor includes a number of III-nitride strain sensitive devices and a number of passive electrical components that connects each of them to one of the III-nitride strain sensitive devices.

公开(公告)号：US20170108986A1

公开(公告)日：2017-04-20

申请号：US15130476

申请日：2016-04-15

Applicant: National Tsing Hua University

Inventor： Wei-Cheng LAI ,  Wei-Leun FANG

IPC: G06F3/041 ,  G06F3/046 ,  G06F3/044

CPC classification number: G01L1/148 ,  H03K17/975 ,  H03K2217/94015

Abstract: A tunable sensing device includes a substrate, a deformable dielectric unit and a tunable member. The dielectric unit is disposed on the substrate and is formed with a receiving space. The tunable member is received in the receiving space and has a stiffness tunable by an external electric field or an external magnetic field.