公开(公告)号：US11624013B2

公开(公告)日：2023-04-11

申请号：US16771748

申请日：2018-12-18

Applicant: SIKA TECHNOLOGY AG

Inventor： Urs Rheinegger ,  Elyes Jendoubi ,  Dominique Gallo ,  Christian Krüger

IPC: C09J163/00 ,  C08G18/12 ,  C08G18/28 ,  C08G18/48 ,  C08G18/69 ,  C08G18/75 ,  C08G59/40

Abstract: Methods in which toughness improvers based on terminally blocked polyurethane prepolymers are used to increase the maximum linear expansion of single component heat-curing epoxy resin compositions, in particular for joining substrates having different thermal expansion coefficients, in particular in the framework of transport agents or white goods.

公开(公告)号：US11624011B2

公开(公告)日：2023-04-11

申请号：US15768050

申请日：2016-12-13

Applicant: DEXERIALS CORPORATION

Inventor： Daichi Mori ,  Tomoyuki Ishimatsu

IPC: B32B9/04 ,  C09J163/00 ,  C09J7/10 ,  H01L23/00 ,  C09J11/04 ,  C09J11/06 ,  C09J11/08 ,  H01L21/304 ,  C09J7/30 ,  B32B27/06 ,  H01L21/683 ,  C08K3/013

Abstract: A thermosetting adhesive sheet capable of reducing semiconductor wafer warping and chipping and a method for manufacturing a semiconductor device includes a thermosetting adhesive layer formed from a resin composition containing a resin component and a filler, the resin component containing an epoxy compound and a curing agent, a total value obtained by multiplying the reciprocal of epoxy equivalent of the epoxy compound by content of the epoxy compound in the resin component being 1.15E−04 or more, and blending amount of the filler being 50 pts. mass or more with respect to 100 pts. mass of the resin component; the thermosetting adhesive sheet is applied to a ground surface of a semiconductor and cured before dicing.

公开(公告)号：US11622168B2

公开(公告)日：2023-04-04

申请号：US17446316

申请日：2021-08-30

Applicant: MAGNA ELECTRONICS INC.

Inventor： Brian J. Winden ,  Robert A. Devota ,  Matthew C. Sesti ,  Joseph A. Stemmer ,  Steven V. Byrne ,  John R. Garcia ,  David F. Olson

IPC: H04N5/00 ,  H04N23/55 ,  C09J163/00 ,  H04N23/51 ,  H04N23/54 ,  C09J5/00

Abstract: A vehicular camera includes an imager printed circuit board and a lens having a plurality of optical elements. The lens is held in optical alignment with an imager at the imager printed circuit board via a dual cure one-part, filled adhesive that in its uncured state has an epoxy resin. The adhesive is both UV-curable and thermal-curable. A flexible electrical ribbon cable electrically connects circuitry of the imager printed circuit board with additional circuitry of the vehicular camera. Image data captured by the imager is provided to the additional circuitry of the vehicular camera via the flexible electrical ribbon cable. The additional circuitry includes at least a processor for processing image data captured by the imager and provided to the additional circuitry via the flexible electrical ribbon cable. The vehicular camera, when installed and used in a vehicle, captures image data for use by a vision system of the vehicle.

公开(公告)号：US11608435B2

公开(公告)日：2023-03-21

申请号：US16610992

申请日：2018-05-30

Applicant: NAGASE CHEMTEX CORPORATION

Inventor： Yasuhito Fujii ,  Katsushi Kan ,  Yosuke Oi

IPC: H01L21/56 ,  H01L23/29 ,  C08L63/00 ,  C09J163/00 ,  C08K3/36 ,  C08K7/26 ,  C08L63/04 ,  B29C43/00 ,  B29K63/00 ,  C08G59/42 ,  C08K5/18

Abstract: To provide an epoxy resin composition capable of forming a polished surface with high flatness when polished after curing, and a method for producing an electronic component mounting structure having a polished surface with high flatness, the polished surface obtained by polishing the surface of an encapsulation body. Disclosed are an epoxy resin composition, an electronic component mounting structure including the epoxy resin composition, and a method for producing the electronic component mounting structure, wherein: the epoxy resin composition includes a fused silica possibly containing hollow particles, and a curing agent; on a polished surface obtained by polishing a cured product of the epoxy resin composition, the number of pores having a diameter of more than 5 μm observed within a 25-mm2 area is one or less, the pores derived from cross sections of the hollow particles; and the polished surface is coated with a coating material.

公开(公告)号：US11591502B2

公开(公告)日：2023-02-28

申请号：US16334498

申请日：2017-09-19

Applicant: Zephyros, Inc.

Inventor： Sarah Fezzey ,  David Kosal

IPC: C09J163/00 ,  C08K5/17 ,  C08L33/08

Abstract: A polymeric material comprising from about 5% to about 60% of a Diels-Alder additive, wherein the additive crosslinks at a temperature below 100° C., an adhesive or sealant component, wherein the viscosity of the adhesive or sealant is reduced by at least about 5%, at least about 30%, at least about 80%, or even at least about 100% when combined with the Diels-Alder additive.

公开(公告)号：US11591499B2

公开(公告)日：2023-02-28

申请号：US15541881

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Yasushi Akutsu ,  Ryousuke Odaka ,  Yusuke Tanaka

IPC: C09J9/02 ,  C09J7/10 ,  H05K3/32 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/146 ,  H01R4/04 ,  H04N5/225 ,  H05K1/18 ,  C08K3/08 ,  G03B17/02 ,  H05K1/03 ,  C08K3/10 ,  C08K3/36 ,  C08K9/02 ,  H05K1/02

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

公开(公告)号：US20230059945A1

公开(公告)日：2023-02-23

申请号：US17890240

申请日：2022-08-17

Applicant: GATES CORPORATION

Inventor： Min Gao ,  GuoGong Chen ,  Kelechi C. Anyaogu ,  Carol Weber

IPC: D06M11/73 ,  D06M11/76 ,  D06M15/55 ,  D06M15/693 ,  C09J163/00 ,  C09J133/08 ,  C09J109/00 ,  C09J175/04 ,  F16G1/10 ,  F16G1/28

Abstract: Textile reinforced elastomeric composites having a textile reinforcement embedded in an elastomeric matrix. The textile reinforcement includes fibers or yarns and an adhesive treatment applied to the fibers wherein the adhesive treatment comprises graphene or graphene oxide. The textile reinforcement may be a fabric or a tensile cord. The fibers may be polyester, aramid, carbon fiber, glass fiber, PBO, PEN, or polyamide. The adhesive treatment may be an epoxy treatment, an epoxy-latex treatment, an acrylic polymer treatment, a latex treatment, a polyurethane treatment, an RFL treatment, a rubber cement, or combinations thereof. The composite may be in the form of a toothed belt wherein the textile reinforcement is a tooth cover or a helically wound tensile cord embedded in the belt.

公开(公告)号：US20230058263A1

公开(公告)日：2023-02-23

申请号：US17967249

申请日：2022-10-17

Applicant: Henkel AG & Co. KGaA

Inventor： Zhenfeng Cao ,  Hao Wu ,  Xueyu Qiu

IPC: C08L63/00 ,  C09J163/00

Abstract: The present invention provides a two-part thermal conductive epoxy adhesive composition with high bonding strength and low modulus. The present invention also provides a preparing method and use thereof.

公开(公告)号：US11578237B2

公开(公告)日：2023-02-14

申请号：US15765438

申请日：2016-10-07

Applicant: DAI NIPPON PRINTING CO., LTD.

Inventor： Kentaro Hoshi ,  Anri Takarabe ,  Tomoyuki Tachikawa

IPC: C09J163/00 ,  C09J5/04 ,  C09J7/10 ,  C09J11/06 ,  C09J7/30 ,  E04F13/00 ,  C09J7/21 ,  E04F13/08

Abstract: An adhesive sheet set including a pair of adhesive sheets respectively including an adhesive layer capable of being cured and adhered by being in contact with each other, and a method for producing a product using the same. An adhesive sheet set including a first adhesive sheet and a second adhesive sheet, wherein the first adhesive sheet includes a first separator and a first adhesive layer provided on one surface of the first separator, the second adhesive sheet includes a second separator and a second adhesive layer provided on one surface of the second separator, and the first adhesive sheet and the second adhesive sheet are configured to be cured and adhered by the first adhesive layer and the second adhesive layer being in contact with each other.

公开(公告)号：US20230029583A1

公开(公告)日：2023-02-02

申请号：US17769698

申请日：2020-10-13

Applicant: 3M INNOVATIVE PROPERTIES COMPANY

Inventor： Kyosung Hwang ,  Yongsuk Yang ,  Ki-Sun Kim ,  Gyu Jin Jung

IPC: C09J7/29 ,  C09J163/00 ,  C09J7/35 ,  C09J11/06 ,  C09J183/04 ,  C09J11/04

Abstract: The present invention relates to an adhesive film comprising an adhesive layer; a photothermal conversion layer containing a light absorber and a thermally decomposable resin; and an adhesive base film layer disposed between the adhesive layer and the photothermal conversion layer, wherein the adhesive base film layer contains a multifunctional epoxy resin, a binder resin, a curing agent, and a curing catalyst. The adhesive film according to the present invention may be able to simplify a processing process of a substrate, and prevent damage to the substrate and circuits or elements formed on the substrate.