公开(公告)号：US11591499B2

公开(公告)日：2023-02-28

申请号：US15541881

申请日：2016-01-13

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Yasushi Akutsu ,  Ryousuke Odaka ,  Yusuke Tanaka

IPC: C09J9/02 ,  C09J7/10 ,  H05K3/32 ,  H01B1/22 ,  C09J11/04 ,  C09J163/00 ,  H01L27/146 ,  H01R4/04 ,  H04N5/225 ,  H05K1/18 ,  C08K3/08 ,  G03B17/02 ,  H05K1/03 ,  C08K3/10 ,  C08K3/36 ,  C08K9/02 ,  H05K1/02

Abstract: An anisotropic conductive film, capable of connecting a terminal formed on a substrate having a wavy surface such as a ceramic module substrate with conduction characteristics stably maintained, includes an insulating adhesive layer, and conductive particles regularly arranged in the insulating adhesive layer as viewed in a plan view. The conductive particle diameter is 10 μm or more, and the thickness of the film is 1 or more times and 3.5 or less times the conductive particle diameter. The variation range of the conductive particles in the film thickness direction is less than 10% of the conductive particle diameter.

公开(公告)号：US20140318709A1

公开(公告)日：2014-10-30

申请号：US14363894

申请日：2012-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Ryosuke Odaka

IPC: C09J9/02 ,  C09J4/00 ,  C09J133/14 ,  H01B13/00

CPC classification number: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/14 ,  C09J2433/00 ,  H01B1/22 ,  H01B13/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0425

Abstract: There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used includes a polymerizable acrylic compound, an organic peroxide, and the solder particles, the organic peroxide having a one minute half-life temperature lower than the solidus temperature of the solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.

Abstract translation: 提供了一种导电粘合剂，其能够提供对已经施加了前处理的基底的良好的电连续性，以及用于连接电子部件的方法。 所使用的导电性粘合剂包括可聚合丙烯酸类化合物，有机过氧化物和焊料颗粒，有机过氧化物的半衰期比钎料的固相线温度低1分钟。 在热压接时，焊料颗粒被粉碎并除去氧化物膜，并且通过熔化和流动也可以消除凸起表面上的预过流层，从而确保电连续性，然后将粘合剂组分 完全治愈

公开(公告)号：US20140352888A1

公开(公告)日：2014-12-04

申请号：US14364026

申请日：2012-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Ryosuke Odaka ,  Daisuke Sato

IPC: C09J4/00

CPC classification number: C09J4/00 ,  C08F220/32 ,  C09J4/06 ,  C09J163/10 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0221

Abstract: Provided are an adhesive agent capable of providing sufficient electrical continuity to a substrate to which a preflux treatment has been applied and a method for connecting electronic components. There is used an adhesive agent including a (meth)acrylate having an epoxy group in one molecule and a radical polymerization initiator having a one minute half-life temperature of 110 degrees C. or more. A surplus adhesive agent component between terminals flows, whereby an imidazole component in a preflux, the component binding to an epoxy group of an epoxy group-containing acrylate, is drawn out thereby to be removed from a surface of the terminal.

Abstract translation: 提供一种能够对已经施加了前路处理的基板提供足够的电连续性的粘合剂和用于连接电子部件的方法。 使用包含一分子中具有环氧基的（甲基）丙烯酸酯和1分钟半衰期为110℃以上的自由基聚合引发剂的粘合剂。 端子之间的多余的粘合剂成分流动，由此从外表面除去预流中的咪唑成分，与环氧基丙烯酸酯的环氧基结合的成分。

公开(公告)号：US09426896B2

公开(公告)日：2016-08-23

申请号：US14278810

申请日：2014-05-15

Applicant: Dexerials Corporation

Inventor： Daisuke Sato ,  Junichi Nishimura ,  Ryosuke Odaka

IPC: H05K3/30 ,  C09J7/02 ,  C09J163/00 ,  H01L23/00 ,  C08K3/00

CPC classification number: H05K3/30 ,  C08K3/01 ,  C09J7/35 ,  C09J163/00 ,  C09J2201/134 ,  C09J2205/102 ,  C09J2463/00 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29366 ,  H01L2224/29386 ,  H01L2224/83101 ,  H01L2224/83194 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01033 ,  H01L2924/01045 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/15788 ,  H05K3/305 ,  H05K2201/0195 ,  H05K2201/0209 ,  Y02P70/613 ,  Y10T428/28 ,  Y10T428/2848 ,  H01L2924/00 ,  H01L2924/05442 ,  H01L2924/00014 ,  H01L2924/05432 ,  H01L2924/05042 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

Abstract: To provide an insulating resin film, which contains: a first adhesive layer; and a second adhesive layer, wherein the insulating resin film is configured to bond a substrate and an electronic part together, and the first adhesive layer is provided at a side of the substrate and the second adhesive layer is provided at a side of the electronic part, wherein the first adhesive layer and the second adhesive layer each contain inorganic filler, wherein the second adhesive layer has a DSC exothermic peak temperature that is higher than a DSC exothermic peak temperature of the first adhesive layer, and wherein a thickness of the first adhesive layer is 50% to 90% of a total thickness of the insulating resin film.

Abstract translation: 提供绝缘树脂膜，其包含：第一粘合剂层; 和第二粘合剂层，其中所述绝缘树脂膜被构造成将基板和电子部件结合在一起，并且所述第一粘合层设置在所述基板的一侧，并且所述第二粘合层设置在所述电子部件的一侧 其中，所述第一粘合剂层和所述第二粘合剂层各自含有无机填料，其中所述第二粘合剂层具有比所述第一粘合剂层的DSC放热峰值温度高的DSC放热峰值温度，并且其中所述第一粘合剂的厚度 层是绝缘树脂膜的总厚度的50％至90％。

公开(公告)号：US09752058B2

公开(公告)日：2017-09-05

申请号：US14363894

申请日：2012-12-10

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Ryosuke Odaka

IPC: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H05K3/32 ,  H05K3/36 ,  C09J133/14 ,  H01B13/00 ,  C09J7/02

CPC classification number: C09J4/00 ,  C09J4/06 ,  C09J5/06 ,  C09J7/22 ,  C09J7/35 ,  C09J9/02 ,  C09J11/04 ,  C09J133/14 ,  C09J2433/00 ,  H01B1/22 ,  H01B13/00 ,  H05K3/323 ,  H05K3/361 ,  H05K2203/0425

Abstract: There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used includes a polymerizable acrylic compound, an organic peroxide, and the solder particles, the organic peroxide having a one minute half-life temperature lower than the solidus temperature of the solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.

公开(公告)号：US09524949B2

公开(公告)日：2016-12-20

申请号：US15155228

申请日：2016-05-16

Applicant: Dexerials Corporation

Inventor： Kazunori Hamazaki ,  Takashi Matsumura ,  Daisuke Sato ,  Yasuhiro Suga

IPC: H01L21/00 ,  H01L23/00 ,  H01L21/56

CPC classification number: H01L24/92 ,  H01L21/563 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/1134 ,  H01L2224/13017 ,  H01L2224/13144 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1623 ,  H01L2224/16238 ,  H01L2224/27334 ,  H01L2224/29007 ,  H01L2224/2919 ,  H01L2224/32012 ,  H01L2224/32225 ,  H01L2224/3224 ,  H01L2224/73103 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81444 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2224/83203 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/364 ,  H01L2924/381 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012

Abstract: A semiconductor device includes a semiconductor chip provided with a plurality of bumps arranged in a peripheral alignment, a substrate provided with a plurality of electrodes, and an insulating resin adhesive film. The semiconductor chip is affixed to the substrate via the insulating resin adhesive film such that the electrodes are in positions corresponding to the positions of the bumps. The insulating resin adhesive film has a minimum melt viscosity of 8×103 to 1×105 Pa·s, covers 70 to 90% the area of the region enclosed with the plurality of bumps, and heat cured. The bumps and the electrodes corresponding thereto are arranged so that they are opposed to each other and establish metallic contact therebetween. A periphery of the insulating resin adhesive film is defined between the plurality of bumps and the outer edge of the semiconductor chip, exclusive.

Abstract translation: 半导体器件包括设置有周向排列的多个凸块的半导体芯片，设置有多个电极的基板和绝缘树脂粘合膜。 半导体芯片通过绝缘树脂粘合膜固定到基板上，使得电极处于与凸块的位置对应的位置。 绝缘树脂粘合膜的最小熔融粘度为8×10 3〜1×10 5 Pa·s，覆盖多个凸起所包围的区域的面积为70〜90％，并进行热固化。 凸起和对应的电极被布置成使得它们彼此相对并且在它们之间建立金属接触。 绝缘树脂粘合膜的周边被限定在多个凸块和半导体芯片的外边缘之间。

公开(公告)号：US10602619B2

公开(公告)日：2020-03-24

申请号：US16077785

申请日：2017-03-27

Applicant: DEXERIALS CORPORATION

Inventor： Daisuke Sato ,  Akifumi Higuchi

IPC: H05K3/32 ,  H05K3/36 ,  H01L23/00 ,  H01B5/16

Abstract: An anisotropic conductive connection structure body includes: a first electrode terminal on a surface of which a protruding portion is formed; a second electrode terminal; and an anisotropic conductive adhesive layer containing electrically conductive particles that provide conduction between the first electrode terminal and the second electrode terminal. A ratio of a height of the protruding portion to a before-compression particle size of the electrically conductive particle is less than 60%, an opening area ratio of the first electrode terminal is more than or equal to 55%, and a height of the second electrode terminal is more than or equal to 6 μm.