-
公开(公告)号：US11169440B2
公开(公告)日：2021-11-09
申请号：US16490694
申请日：2018-01-31
申请人： ZEON CORPORATION
发明人： Makoto Fujimura
摘要： A radiation-sensitive resin composition capable of forming a resin film for which development residue formation is sufficiently inhibited and that has excellent extensibility. The radiation-sensitive resin composition contains: a cycloolefin polymer (A-1) including a protonic polar group; a cycloolefin polymer (A-2) including a protonic polar group; a difunctional epoxy compound (B); and a radiation-sensitive compound (C). The cycloolefin polymer (A-1) has a weight-average molecular weight of not less than 1,000 and less than 10,000, and the cycloolefin polymer (A-2) has a weight-average molecular weight of not less than 10,000 and not more than 100,000. Content of the cycloolefin polymer (A-2) is not less than 5 mass % and not more than 55 mass % of total content of the cycloolefin polymer (A-1) and the cycloolefin polymer (A-2).
-
公开(公告)号：US11137682B2
公开(公告)日：2021-10-05
申请号：US16160024
申请日：2018-10-15
发明人： Kahee Shin , Jong Han Yang , Geun Huh
摘要： The present invention relates to a photosensitive resin composition that is excellent in adhesiveness and sensitivity. Specifically, the photosensitive resin composition is capable of providing a cured film that is excellent in transparency, sensitivity, chemical resistance, and adhesiveness upon immersion in a stripper. Thus, the cured film can be effectively used in a liquid crystal display, an organic EL display, and the like.
-
公开(公告)号：US11092890B2
公开(公告)日：2021-08-17
申请号：US16712701
申请日：2019-12-12
发明人： Kyung Soo Moon , Jaehyun Kim , Yoong Hee Na , Ran Namgung , Hwansung Cheon , Seungyong Chae
IPC分类号： H01L33/00 , G03F7/004 , H01L21/02 , G03F7/09 , C07F7/22 , G03F7/075 , H01L21/467 , H01L21/475 , H01L21/47 , G03F1/22
摘要： A semiconductor resist composition includes an organometallic compound represented by Chemical Formula 1 and a solvent: wherein, in Chemical Formula I, R1 is an aliphatic hydrocarbon group, an aromatic hydrocarbon group, or an —alkylene-O-alkyl group, and R2 to R4 are each independently selected from —ORa and —OC(═O)Rb, where Ra is not hydrogen.
-
公开(公告)号：US20210247690A1
公开(公告)日：2021-08-12
申请号：US16972639
申请日：2019-06-04
摘要： Disclosed is a sol-gel imprinting ink composition comprising a sol and an additive for promoting gelation of the composition during imprinting at an imprinting temperature. The composition has a pH of 4-7 when mixed with an equal volume of deionized water and measured at 20° C. and 1 atm. The additive is the reversible reaction product of a protic acid and a proton-accepting base. The vapour pressure of the acid is higher than that of the base at the imprinting temperature such that the concentration of the base in the composition increases relative to the concentration of the acid in the composition during imprinting, resulting in basification of the composition. Further disclosed is a method of forming a patterned layer with such a sol-gel imprinting ink composition, and an optical element and an etch mask respectively including the patterned layer.
-
公开(公告)号：US20210171718A1
公开(公告)日：2021-06-10
申请号：US16768658
申请日：2018-11-29
申请人： Merck Patent GmbH
发明人： Naofumi YOSHIDA , Megumi TAKAHASHI , Seishi SHIBAYAMA , Katsuto TANIGUCHI , Masanobu HAYASHI , Toshiaki NONAKA
摘要： [Problem] To provide a polysiloxanecapable of forming a cured film of a thick film with high heat resistance, a composition comprising the polysiloxane, and a method of manufacturing a cured film using the composition. [Means for Solution] To provide a polysiloxane comprising a repeating unit represented by the following formula (Ib), wherein R2 is each independently hydrogen, alkyl, aryl, alkenyl, and the like, a composition comprising the polysiloxane, and a method of manufacturing a cured film using the composition.
-
66.发明授权公开(公告)号：US11022884B2
公开(公告)日：2021-06-01
申请号：US15325769
申请日：2015-07-09
发明人： Wataru Shibayama , Kenji Takase , Makoto Nakajima , Satoshi Takeda , Hiroyuki Wakayama , Rikimaru Sakamoto
IPC分类号： G03F7/11 , C08G77/24 , G03F7/075 , G03F7/09 , C08G77/28 , C09D183/08 , G03F7/16 , G03F7/20 , G03F7/32 , G03F7/38 , H01L21/306 , H01L21/308
摘要： A resist underlayer film allows an excellent resist pattern shape to be formed when an upper resist layer is exposed to light and developed using an alkaline developing solution or organic solvent; and composition for forming the resist underlayer film. A resist underlayer film-forming composition for lithography, the composition including, as a silane, hydrolyzable silane, hydrolysis product thereof, hydrolysis-condensation product thereof, or combination, wherein the hydrolyzable silane includes hydrolyzable silane of Formula (1): R1aR2bSi(R3)4−(a+b) Formula (1) [where R1 is an organic group of Formula (2): —R4—R5—R6 Formula (2) (where R4 is optionally substituted C1-10 alkylene group; R5 is a sulfonyl group or sulfonamide group; and R6 is a halogen-containing organic group)]. In Formula (2), R6 may be a fluorine-containing organic group like trifluoromethyl group. A resist underlayer film obtained by applying the resist underlayer film-forming composition onto a semiconductor substrate, followed by baking. The underlayer film-forming composition may include acid as a hydrolysis catalyst, or water.
-
公开(公告)号：US11018015B2
公开(公告)日：2021-05-25
申请号：US16225347
申请日：2018-12-19
发明人： Tsutomu Ogihara , Daisuke Kori , Seiichiro Tachibana , Yusuke Biyajima , Naoki Kobayashi , Kazumi Noda
IPC分类号： G03F7/075 , H01L21/308 , G03F7/09 , G03F7/38 , G03F7/004 , G03F7/039 , G03F7/40 , C08K5/00 , C08G16/02
摘要： The invention provides: a composition for forming an organic film, the composition having high filterability and enabling formation of an organic film which has high pattern-curving resistance, and which prevents a high-aspect line pattern particularly finer than 40 nm from line collapse and twisting after dry etching; a method for forming an organic film and a patterning process which use the composition; and a substrate for manufacturing a semiconductor device, including the organic film formed on the substrate. The composition for forming an organic film includes a condensate (A), which is a condensation product of dihydroxynaphthalene shown by the following formula (1) and a condensation agent, or a derivative of the condensate (A). A sulfur content among constituent elements contained in the condensate (A) or the derivative of the condensate (A) is 100 ppm or less in terms of mass.
-
公开(公告)号：US20210138459A1
公开(公告)日：2021-05-13
申请号：US16766536
申请日：2018-12-07
申请人： eNuvio Inc.
发明人： Hugo MCGUIRE
IPC分类号： B01L3/00 , G01N27/327 , G01N27/406 , G01N33/487 , G03F7/00 , G03F7/075 , G03F7/20 , C12M3/06
摘要： There is a described a patch-clamp chip for making electrical measurements on a biological sample. The patch-clamp chip comprising a plurality of layers comprising poly-dimethylsiloxane (PDMS) forming a stack. It comprises at least a chip surface layer comprising an aperture formed therethrough and which upwardly opens on the surface, where the biological sample is provided. A microfluidic channel layer comprising PDMS extends below the plane of the chip surface layer and comprises a microfluidic channel formed therein. The aperture of the chip surface layer downwardly opens on the microfluidic channel. Electrophysiological measurements are made between an internal solution in the microfluidic channel and the external solution on the chip surface. The measurements can be performed via a bottom electrode. A plurality of apertures and corresponding microfluidic channels can be provided to perform simultaneous measurements on a plurality of samples, independently.
-
69.发明授权公开(公告)号：US10990011B2
公开(公告)日：2021-04-27
申请号：US16261884
申请日：2019-01-30
申请人： FUJIFILM Corporation
发明人： Yuichiro Goto
IPC分类号： G03F7/00 , C08F220/20 , G03F7/031 , G03F7/075 , C08F2/50 , G03F7/027 , H01L21/027 , B29C59/02 , C08F222/10 , C07F7/18 , C07F9/53
摘要： Provided are a curable composition for imprinting and a cured product, a pattern forming method, and a lithography method in which the curable composition for imprinting is used, the curable composition having excellent resolution ability, filling properties into a mold, and releasability from a mold in a case where a fine pattern having a size of 20 nm or less is prepared. The curable composition for imprinting includes: a monofunctional polymerizable compound; a bifunctional polymerizable compound; and a photopolymerization initiator, in which a content of the monofunctional polymerizable compound is 5 to 30 mass % with respect to a content of all the polymerizable compounds, a content of the bifunctional polymerizable compound is 70 mass % or higher with respect to a content of all the polymerizable compounds, at least one bifunctional polymerizable compound is a bifunctional polymerizable compound in which the number of atoms linking two polymerizable groups to each other is 2 or less, and a content of a bifunctional polymerizable compound that does not include an alicyclic structure and an aromatic ring structure and in which the number of atoms linking two polymerizable groups to each other is 3 or more is 30 mass % or lower with respect to the content of all the polymerizable compounds.
-
公开(公告)号：US20210080829A1
公开(公告)日：2021-03-18
申请号：US16613472
申请日：2018-05-16
摘要： A negative photosensitive resin composition is provided which contains (A) a siloxane resin having a radically polymerizable group and a carboxyl group and/or a dicarboxylic acid anhydride group, (B) a reactive monomer, (C) a radical photopolymerization initiator, (D) silica particles and (E) a siloxane compound having an oxetanyl group. The present invention provides a negative photosensitive resin composition which is capable of forming a cured film that has high glass surface strength, while exhibiting excellent adhesion to an inorganic film or to an organic film.
-
-
-
-
-
-
-
-
-
搜索结果
1964 条记录 (耗时 0.032 秒)
