Polymers, resist compositions and patterning method
    71.
    发明授权
    Polymers, resist compositions and patterning method 有权
    聚合物,抗蚀剂组合物和图案化方法

    公开(公告)号:US06242151B1

    公开(公告)日:2001-06-05

    申请号:US09372035

    申请日:1999-08-11

    IPC分类号: G03F7023

    摘要: The invention provides a novel polymer in the form of a novolac resin in which some of the hydrogen atoms of the hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups and some of the hydrogen atoms of the remaining hydroxyl groups are replaced by substituted carbonyl or sulfonyl groups. The polymer has a weight average molecular weight calculated as polystyrene of 1,000-30,000. The polymer is formulated into a resist composition having improved uniformity, sensitivity, resolution and pattern geometry in microfabrication.

    摘要翻译: 本发明提供一种酚醛清漆树脂形式的新型聚合物,其中羟基的一些氢原子被1,2-萘醌二叠氮磺酰酯基团取代,其余羟基的一些氢原子被取代的羰基 或磺酰基。 该聚合物的重均分子量为聚苯乙烯计算为1000-3,000。 将聚合物配制成具有改进的微细加工中的均匀性,灵敏度,分辨率和图案几何形状的抗蚀剂组合物。

    Photosensitive resin composition and making process
    72.
    发明授权
    Photosensitive resin composition and making process 有权
    感光树脂组合物和制备方法

    公开(公告)号:US06218069B1

    公开(公告)日:2001-04-17

    申请号:US09480627

    申请日:2000-01-10

    IPC分类号: G03F7023

    CPC分类号: G03F7/023

    摘要: A photosensitive resin composition contains a photosensitive resin comprising recurring units of formula (1) and having a Mw of 1,300-11,000 and 20-5,000 ppm of a tertiary amine compound of formula (2). R is hydrogen or a 1,2-naphthoquinonediazido-5-sulfonic acid residue, the content of 1,2-naphthoquinonediazido-5-sulfonic acid residue in R is 3-27 mol %, and m is a number from 0 to 3, X is a C6-20 alkyl, aryl or aralkyl group, Y and Z each are a C1-20 alkyl group. The composition is improved in sensitivity stability and adhesion to substrates and eliminates the risk of causing corrosion of metal substrates.

    摘要翻译: 感光性树脂组合物含有包含式(1)的重复单元,Mw为1,300〜11,000和20〜500ppm的式(2)的叔胺化合物的感光性树脂,R为氢或1,2-萘醌二叠氮 -5-磺酸残基,R中1,2-萘醌二叠氮基-5-磺酸残基的含量为3-27mol%,m为0-3的数,X为C6-20烷基,芳基或 芳烷基,Y和Z各自为C 1-20烷基。 该组合物的灵敏度稳定性和与基材的粘附性得到改善,并且消除了引起金属基材腐蚀的风险。

    Curable resin, process for making and electronic part protective coating
    73.
    发明授权
    Curable resin, process for making and electronic part protective coating 失效
    可固化树脂,制造工艺和电子部件保护涂层

    公开(公告)号:US5346979A

    公开(公告)日:1994-09-13

    申请号:US3398

    申请日:1993-01-12

    摘要: A novel curable polyimide resin of structural formula (1) or (2) is provided wherein R.sup.1 and R.sup.2 are independently substituted or unsubstituted monovalent C.sub.1-10 hydrocarbon groups, R.sup.3 is a divalent C.sub.1-10 organic group, X is a tetravalent organic group containing an aromatic or aliphatic ring, Y is a divalent organic group, Z is a divalent organic group containing an aromatic ring, W is a trivalent organic group containing an aromatic ring, m is an integer of 1 to 3, and n is an integer of at least 1. It can be prepared by reacting a polyimide with a silicon compound. The curable resin forms with a solvent a solution having a low viscosity and shelf stability and cures at relatively low temperatures below 300.degree. C. into coatings having heat resistance, mechanical strength, electrical properties, solvent resistance and substrate adherence. ##STR1##

    摘要翻译: 提供了结构式(1)或(2)的新型可固化聚酰亚胺树脂,其中R1和R2独立地是取代或未取代的一价C1-10烃基,R3是二价C1-10有机基团,X是含四价有机基团 芳香族或脂肪族环,Y为二价有机基团,Z为含有芳香环的二价有机基团,W为含有芳环的三价有机基团,m为1〜3的整数,n为 可以通过使聚酰亚胺与硅化合物反应来制备。 固化树脂与溶剂形成具有低粘度和储存稳定性的溶液,并且在低于300℃的相对低的温度下固化成具有耐热性,机械强度,电性能,耐溶剂性和基材粘附性的涂层。

    Novel organosilicon compound
    74.
    发明授权
    Novel organosilicon compound 失效
    新型有机硅化合物

    公开(公告)号:US4652663A

    公开(公告)日:1987-03-24

    申请号:US862676

    申请日:1986-05-13

    CPC分类号: C07F7/025 C07F7/1836

    摘要: A class of novel organosilane compounds are disclosed as represented by the general formulaRSi(OCH.sub.2 CF.sub.3).sub.3,in which R is an atom or group selected from the class consisting of a hydrogen atom, unsaturated monovalent aliphatic hydrocarbon groups having from 2 to 20 carbon atoms, monovalent aryl groups and monovalent organic groups having from 3 to 20 carbon atoms and containing at least one hetero atom, i.e. an atom other than carbon and hydrogen atoms, such as oxygen, halogens, sulfur and nitrogen, the said hetero atom-containing organic group being bonded to the silicon atom through a carbon-to-silicon linkage. Several particular compounds belonging to the class were synthesized and identified.

    摘要翻译: 公开了一类由通式RSi(OCH2CF3)3表示的新型有机硅烷化合物,其中R是选自氢原子,具有2至20个碳原子的不饱和一价脂族烃基的原子或基团 具有3至20个碳原子并含有至少一个杂原子的单价芳基和一价有机基团,即除碳和氢原子之外的原子,如氧,卤素,硫和氮,所述含杂原子的有机物 基团通过碳 - 硅键连接到硅原子上。 合成并鉴定了属于该类的几种特定化合物。

    Temporary adhesive composition, and method of producing thin wafer
    75.
    发明授权
    Temporary adhesive composition, and method of producing thin wafer 有权
    临时粘合剂组合物和薄晶片的制造方法

    公开(公告)号:US08785585B2

    公开(公告)日:2014-07-22

    申请号:US13343930

    申请日:2012-01-05

    IPC分类号: C08G77/08

    摘要: A temporary adhesive for which temporary adhesion and subsequent detachment are simple. The temporary adhesive composition includes: (A) an organopolysiloxane having a weight-average molecular weight of at least 15,000, obtained by a hydrosilylation reaction between (A1) and (A2) described below, and (B) an organic solvent having a boiling point of not more than 220° C., wherein (A1) is an alkenyl group-containing organopolysiloxane having a weight-average molecular weight exceeding 2,000, comprising 35 to 99 mol % of T siloxane units and 1 to 25 mol % of M siloxane units, and in which alkenyl groups bonded to silicon atoms represent at least 2 mol % of all the organic groups bonded to silicon atoms, and (A2) is a specific organohydrogenpolysiloxane having at least two silicon atom-bonded hydrogen atoms or a specific hydrosilyl group-containing compound.

    摘要翻译: 一种临时粘合剂,其临时粘合和随后的分离是简单的。 临时粘合剂组合物包括:(A)通过下述(A1)和(A2)之间的氢化硅烷化反应获得的重均分子量为至少15,000的有机聚硅氧烷和(B)具有沸点 不超过220℃,其中(A1)是重均分子量超过2,000的含烯基的有机聚硅氧烷,包含35-99摩尔%的T硅氧烷单元和1至25摩尔%的M硅氧烷单元 并且其中与硅原子键合的烯基表示与硅原子键合的所有有机基团的至少2摩尔%,(A2)是具有至少两个硅原子键合的氢原子的特定有机氢聚硅氧烷或特定的氢化硅烷基 - 含有化合物。

    Method for manufacturing micro-structure
    76.
    发明授权
    Method for manufacturing micro-structure 有权
    微结构制造方法

    公开(公告)号:US08785114B2

    公开(公告)日:2014-07-22

    申请号:US13157460

    申请日:2011-06-10

    摘要: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

    摘要翻译: 通过图案化牺牲膜来制造微结构,在图案上形成无机材料膜,为无机材料膜提供孔,并通过孔蚀刻掉牺牲膜图案,以限定具有图案轮廓的空间 。 图案化阶段包括以下步骤:(A)使用包含甲酚酚醛清漆树脂和交联剂的组合物形成牺牲膜,(B)将膜图案化为第一高能辐射,(C)显影,和(D)曝光 牺牲膜图案到第二高能量辐射和热处理,从而在甲酚酚醛清漆树脂内形成交联。

    METHOD FOR MANUFACTURING MICRO-STRUCTURE
    80.
    发明申请
    METHOD FOR MANUFACTURING MICRO-STRUCTURE 有权
    制造微结构的方法

    公开(公告)号:US20110305990A1

    公开(公告)日:2011-12-15

    申请号:US13157460

    申请日:2011-06-10

    IPC分类号: G03F7/20 G03F7/004

    摘要: A micro-structure is manufactured by patterning a sacrificial film, forming an inorganic material film on the pattern, providing the inorganic material film with an aperture, and etching away the sacrificial film pattern through the aperture to define a space having the contour of the pattern. The patterning stage includes the steps of (A) forming a sacrificial film using a composition comprising a cresol novolac resin and a crosslinker, (B) exposing patternwise the film to first high-energy radiation, (C) developing, and (D) exposing the sacrificial film pattern to second high-energy radiation and heat treating for thereby forming crosslinks within the cresol novolac resin.

    摘要翻译: 通过图案化牺牲膜来制造微结构,在图案上形成无机材料膜,为无机材料膜提供孔,并通过孔蚀刻掉牺牲膜图案,以限定具有图案轮廓的空间 。 图案化阶段包括以下步骤:(A)使用包含甲酚酚醛清漆树脂和交联剂的组合物形成牺牲膜,(B)将膜图案化为第一高能辐射,(C)显影,和(D)曝光 牺牲膜图案到第二高能量辐射和热处理,从而在甲酚酚醛清漆树脂内形成交联。