公开(公告)号：US12237310B2

公开(公告)日：2025-02-25

申请号：US17526874

申请日：2021-11-15

Applicant: X-Celeprint Limited

Inventor： William Edward Batchelor ,  Ronald S. Cok

IPC: H01L25/16 ,  H01L23/48 ,  H01L25/07

Abstract: A multi-component transistor structure includes components each comprising an individual, discrete, and separate component substrate and a component transistor. The component transistor includes a transistor element having a transistor element resistance. A component connection is disposed external to the transistor element and has a connection resistance. The component connection electrically connects the transistor elements in the components in parallel. The connection resistance is less than the transistor element resistance of at least one corresponding transistor element, less than an average of the transistor element resistances of all of the corresponding transistor elements, or less than the sum of all of the transistor element resistances of all of the corresponding transistor elements. The component transistors are functionally similar and at least one of the components is disposed on another different one of the components in a component stack.

公开(公告)号：US20250054800A1

公开(公告)日：2025-02-13

申请号：US18748763

申请日：2024-06-20

Applicant: X-Celeprint Limited

Inventor： Ruggero Loi

IPC: H01L21/683

Abstract: A micro-device structure comprises a source substrate comprising sacrificial portions laterally spaced apart by anchors. At least a portion of each of the sacrificial portions is exposed through an opening. A micro-device is disposed on (e.g., exclusively in direct contact with) each of the sacrificial portions and laterally attached to one of the anchors by a hybrid tether. The hybrid tether comprises an organic tether layer and an inorganic tether layer.

公开(公告)号：US20250042719A1

公开(公告)日：2025-02-06

申请号：US18771086

申请日：2024-07-12

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  Raja Fazan Gul ,  António Trindade ,  João Ricardo da Silva Barbosa

IPC: B81B3/00

Abstract: An example of a cavity structure comprises a cavity substrate comprising a substrate surface, a cavity extending into the cavity substrate, the cavity having a cavity bottom and cavity walls, and a cap disposed on a side of the cavity opposite the cavity bottom. The cavity substrate, the cap, and the one or more cavity walls form a cavity enclosing a volume. A component can be disposed in the cavity and can extend above the substrate surface. The component can be a piezoelectric or a MEMS device. The cap can have a tophat configuration. The cavity structure can be micro-transfer printed from a source wafer to a destination substrate.

公开(公告)号：US12136620B2

公开(公告)日：2024-11-05

申请号：US17690952

申请日：2022-03-09

Applicant: The Board of Trustees of the University of Illinois ,  X-CELEPRINT LIMITED

Inventor： John A. Rogers ,  Ralph Nuzzo ,  Matthew Meitl ,  Etienne Menard ,  Alfred Baca ,  Michael Motala ,  Jong-Hyun Ahn ,  Sang-Il Park ,  Chang-Jae Yu ,  Heung Cho Ko ,  Mark Stoykovich ,  Jongseung Yoon

IPC: H01L25/00 ,  H01L21/00 ,  H01L25/04 ,  H01L25/075 ,  H01L25/16 ,  H01L27/12 ,  H01L27/146 ,  H01L31/02 ,  H01L31/0216 ,  H01L31/0232 ,  H01L31/0288 ,  H01L31/0304 ,  H01L31/043 ,  H01L31/0525 ,  H01L31/054 ,  H01L31/0693 ,  H01L31/0725 ,  H01L31/167 ,  H01L31/18 ,  H01L33/00 ,  H01L33/06 ,  H01L33/30 ,  H01L33/48 ,  H01L33/52 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/62 ,  H01S5/02 ,  H01S5/02251 ,  H01S5/183 ,  H01S5/30 ,  H01S5/343 ,  H01S5/42 ,  B82Y10/00 ,  H01L29/786

Abstract: Provided are optical devices and systems fabricated, at least in part, via printing-based assembly and integration of device components. In specific embodiments the present invention provides light emitting systems, light collecting systems, light sensing systems and photovoltaic systems comprising printable semiconductor elements, including large area, high performance macroelectronic devices. Optical systems of the present invention comprise semiconductor elements assembled, organized and/or integrated with other device components via printing techniques that exhibit performance characteristics and functionality comparable to single crystalline semiconductor based devices fabricated using conventional high temperature processing methods. Optical systems of the present invention have device geometries and configurations, such as form factors, component densities, and component positions, accessed by printing that provide a range of useful device functionalities. Optical systems of the present invention include devices and device arrays exhibiting a range of useful physical and mechanical properties including flexibility, shapeability, conformability and stretchablity.

公开(公告)号：US20240347367A1

公开(公告)日：2024-10-17

申请号：US18294754

申请日：2021-08-09

Applicant: X-Celeprint Limited ,  LEONHARD KURZ Stiftung & Co. KG

Inventor： Ronald S. Cok ,  António José Marques Trindade ,  MIchael Scharfenberg ,  Christian Schulz ,  Gabriele Roithmeier

IPC: H01L21/683 ,  H01L23/00

CPC classification number: H01L21/6835 ,  H01L24/27 ,  H01L24/83 ,  H01L24/98 ,  H01L2224/27515 ,  H01L2224/27848 ,  H01L2224/8312 ,  H01L2224/98 ,  H01L2924/15156

Abstract: A module collection and deposition system comprises a container, a module source wafer comprising modules released from the module source wafer, a module collection device operable to remove the modules from the module source wafer and dispose the modules as a disordered and dry collection into the container, and a module deposition device for removing the modules from the container and randomly disposing the modules on a receiving surface. Each module comprises an electronically active unpackaged component.

公开(公告)号：US20240295692A1

公开(公告)日：2024-09-05

申请号：US18593039

申请日：2024-03-01

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok ,  David Gomez

IPC: G02B6/122 ,  G02B6/12 ,  G02B6/136

CPC classification number: G02B6/122 ,  G02B6/12004 ,  G02B6/136

Abstract: A micro-optical structure includes a structure substrate comprising a cavity and a micro-optical component disposed entirely and directly over or in the cavity. The micro-optical component includes a micro-optical element and a component tether physically attached to an anchor portion of the structure substrate and in contact with the micro-optical element. The structure substrate and the micro-optical component can be monolithic, for example unitary and comprise a same material or are the same material. The micro-optical component can be disposed on a sacrificial portion disposed on a micro-optical component source wafer differentially etchable form the sacrificial portion. The micro-optical component can be disposed on a micro-optical component source wafer patterned with an encapsulation layer where the micro-optical component is differentially etchable from the encapsulation layer and the micro-optical component.

公开(公告)号：US20240231017A1

公开(公告)日：2024-07-11

申请号：US18405572

申请日：2024-01-05

Applicant: X-Celeprint Limited

Inventor： Ronald S. Cok

IPC: G02B6/42

CPC classification number: G02B6/4214 ,  G02B6/4206 ,  G02B6/423

Abstract: A micro-optical component includes a micro-substrate, a micro-optical element disposed on the micro-substrate, and a stand-off (a mechanical spacer) disposed on the micro-substrate or micro-optical component in a separate plane from the micro-substrate that at least partially encloses the micro-optical element. The micro-optical components can be stacked on a system substrate using micro-transfer printing to form a three-dimensional micro-optical structure. One more light beams can travel or pass through various combinations of multiple micro-optical components and micro-optical elements.

公开(公告)号：US20230336150A1

公开(公告)日：2023-10-19

申请号：US17721766

申请日：2022-04-15

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Ronald S. Cok ,  Raja Fazan Gul

IPC: H03H9/05 ,  H03H3/02 ,  H03H9/02 ,  H03H9/10 ,  H03H9/17 ,  B41F16/00

CPC classification number: H03H9/0595 ,  H03H3/02 ,  H03H9/02031 ,  H03H9/105 ,  H03H9/176 ,  B41F16/00

Abstract: According to embodiments of the present disclosure, a micro-system comprises a frame, a component attached to and supported by the frame, and an electrically functional micro-device disposed on or in the frame and electrically connected to the component. The component can be exclusively supported by the frame. The frame can comprise the micro-device and can comprise the same materials and layer structure as the component. The component, frame, and micro-device can comprise a piezoelectric material. The component can be an acoustic resonator and the micro-device can be a capacitor.

公开(公告)号：US11670603B2

公开(公告)日：2023-06-06

申请号：US17366842

申请日：2021-07-02

Applicant: X-Celeprint Limited

Inventor： António José Marques Trindade ,  Ronald S. Cok

IPC: H01L23/58 ,  H01L23/544

CPC classification number: H01L23/58 ,  H01L23/544 ,  H01L2223/54426

Abstract: A micro-component comprises a component substrate having a first side and an opposing second side. Fenders project from the first and second sides of the component substrate and include first-side fenders extending from the first side and a second-side fender extending from the second side of the component substrate. At least two of the first-side fenders have a non-conductive surface and are disposed closer to a corner of the component substrate than to a center of the component substrate.

公开(公告)号：US20230131998A1

公开(公告)日：2023-04-27

申请号：US17968418

申请日：2022-10-18

Applicant: X-Celeprint Limited

Inventor： David Gomez ,  Ronald S. Cok

IPC: H01L21/027 ,  H01L21/768 ,  H01L21/311

Abstract: A printed structure includes a substrate comprising a substrate surface, a substrate circuit disposed in or on in a circuit area of the substrate surface, a substrate post protruding from the substrate surface exterior to the circuit area, and a component having a component top side and a component bottom side opposite the component top side. The component bottom side can be disposed on the substrate post and adhered to the substrate surface forming an air gap between the component bottom side and the substrate circuit. The substrate post can comprise a substrate post material that is a cured adhesive. Some embodiments comprise a substrate electrode and the component comprises an electrically conductive connection post extending from the component bottom side toward the substrate in electrical contact with the substrate electrode.