公开(公告)号：US20130122788A1

公开(公告)日：2013-05-16

申请号：US13459079

申请日：2012-04-28

申请人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rohdum

发明人： Shou-Sung Chang ,  Hung Chen ,  Lakshmanan Karuppiah ,  Paul D. Butterfield ,  Erik S. Rohdum

IPC分类号： B24B49/10 ,  B24B1/00 ,  B24B41/02

CPC分类号： B24B37/013 ,  B24B49/16

摘要： Methods, apparatus, and systems for polishing a substrate are provided. The invention includes an upper platen; a torque/strain measurement instrument coupled to the upper platen; and a lower platen coupled to the torque/strain measurement instrument and adapted to drive the upper platen to rotate through the torque/strain measurement instrument. In other embodiments, the invention includes an upper carriage; a side force measurement instrument coupled to the upper carriage; and a lower carriage coupled to the side force measurement instrument and adapted to support a polishing head. Numerous additional aspects are disclosed.

公开(公告)号：US20120323355A1

公开(公告)日：2012-12-20

申请号：US13599766

申请日：2012-08-30

申请人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： G05B19/18

CPC分类号： G05B15/02 ,  B24B37/013 ,  B24B49/12

摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

摘要翻译： 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

公开(公告)号：US08260446B2

公开(公告)日：2012-09-04

申请号：US12699014

申请日：2010-02-02

申请人： Jeffrey Drue David ,  Dominic Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey Drue David ,  Dominic Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： G06F19/00 ,  B24B49/00 ,  G01B11/28

CPC分类号： G05B15/02 ,  B24B37/013 ,  B24B49/12

摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

摘要翻译： 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

公开(公告)号：US07952708B2

公开(公告)日：2011-05-31

申请号：US12059464

申请日：2008-03-31

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

IPC分类号： G01J3/40

CPC分类号： G01N21/31 ,  G01N21/253 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67766

摘要： A substrate processing system includes a processing module to process a substrate, a factory interface module configured to accommodate at least one cassette for holding the substrate, a spectrographic monitoring system positioned in or adjoining the factory interface module, and a substrate handler to transfer the substrate between the at least one cassette, the spectrographic monitoring system and the processing module.

摘要翻译： 衬底处理系统包括处理衬底的处理模块，被配置为容纳用于保持衬底的至少一个盒的工厂接口模块，位于工厂接口模块中或邻接工厂接口模块的光谱监测系统，以及衬底处理器，用于传送衬底 在所述至少一个盒，所述光谱监视系统和所述处理模块之间。

公开(公告)号：US20110094537A1

公开(公告)日：2011-04-28

申请号：US12603771

申请日：2009-10-22

申请人： Sen-Hou Ko ,  Lakshmanan Karuppiah

发明人： Sen-Hou Ko ,  Lakshmanan Karuppiah

IPC分类号： A46B13/00 ,  B08B7/00

CPC分类号： B24B1/00 ,  A46B13/001 ,  A46B2200/3093 ,  B08B1/002 ,  B08B1/007 ,  B08B1/04 ,  B08B3/041 ,  B08B15/04 ,  B24B37/08 ,  B24B37/20 ,  B24B53/017 ,  B24D13/12 ,  H01L21/67028 ,  H01L21/67046

摘要： A method and apparatus for conditioning a processing surface of a cylindrical roller disposed in a brush box is described. In one embodiment, a brush box is described. The brush box includes a tank having an interior volume and a pair of cylindrical rollers at least partially disposed in the interior volume, each of the cylindrical rollers being rotatable about a respective axis, an actuator assembly coupled to each of the cylindrical rollers to move the respective cylindrical roller between a first position where the cylindrical rollers are in proximity and a second position where the cylindrical rollers are spaced away from each other, and a conditioning device for each of the cylindrical rollers, each conditioning device including a conditioner disposed in the interior volume, the conditioner contacting an outer surface of each of the cylindrical rollers when the rollers are in the second position.

摘要翻译： 描述了一种用于调节设置在刷盒中的圆柱形辊的处理表面的方法和装置。 在一个实施例中，描述了刷盒。 所述刷盒包括具有至少部分地设置在所述内部容积中的内部容积的容器和一对圆柱形的滚子，每个所述圆柱滚子可围绕相应的轴线旋转，所述致动器组件联接到每个所述圆柱滚子以使 在圆柱滚子接近的第一位置和圆柱滚子彼此分开的第二位置之间的相应的圆柱滚子，以及用于每个圆柱滚子的调节装置，每个调节装置包括设置在内部的调节器 当辊处于第二位置时，调节器接触每个圆柱滚子的外表面。

公开(公告)号：US20100217430A1

公开(公告)日：2010-08-26

申请号：US12699014

申请日：2010-02-02

申请人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： G06F19/00 ,  H01L21/00 ,  B24B49/00

CPC分类号： G05B15/02 ,  B24B37/013 ,  B24B49/12

摘要： Methods, systems, and apparatus for spectrographic monitoring of a substrate during chemical mechanical polishing are described. In one aspect, a computer-implemented method includes storing a library having a plurality of reference spectra, each reference spectrum of the plurality of reference spectra having a stored associated index value, measuring a sequence of spectra in-situ during polishing to obtain measured spectra, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum to generate a sequence of best matching reference spectra, determining the associated index value for each best matching spectrum from the sequence of best matching reference spectra to generate a sequence of index values, fitting a linear function to the sequence of index values, and halting the polishing either when the linear function matches or exceeds a target index or when the associated index value from the determining step matches or exceeds the target index.

摘要翻译： 描述了在化学机械抛光期间用于光谱监测基底的方法，系统和装置。 一方面，计算机实现的方法包括存储具有多个参考光谱的库，多个参考光谱的每个参考光谱具有存储的相关联的索引值，在抛光期间原位测量光谱序列以获得测量的光谱 ，对于光谱序列的每个测量光谱，找到最佳匹配参考光谱以产生最佳匹配参考光谱序列，从最佳匹配参考光谱序列确定每个最佳匹配光谱的相关索引值，以产生序列 索引值，将线性函数拟合到索引值序列，以及当线性函数匹配或超过目标索引时或者当来自确定步骤的相关索引值匹配或超过目标索引时停止抛光。

公开(公告)号：US20100112903A1

公开(公告)日：2010-05-06

申请号：US12263237

申请日：2008-10-31

申请人： WEN-CHIANG TU ,  You Wang ,  Yuchun Wang ,  Lakshmanan Karuppiah

发明人： WEN-CHIANG TU ,  You Wang ,  Yuchun Wang ,  Lakshmanan Karuppiah

IPC分类号： B24B49/04 ,  B24B7/22 ,  B24B57/02

CPC分类号： B24B37/04 ,  B24B57/02

摘要： A method and apparatus for polishing or planarzing a substrate by a chemical mechanical polishing process. In one embodiment a method of processing a semiconductor substrate is provided. The method comprises positioning a substrate on a polishing apparatus comprising a polishing pad assembly, delivering a polishing slurry to a surface of the polishing pad assembly, polishing the substrate with the surface of the polishing pad assembly, monitoring the removal rate of material from a plurality of regions on the surface of the substrate, determining whether the plurality of regions on the surface of the substrate are polishing uniformly, and selectively delivering a polishing slurry additive to at least one region of the plurality of regions to obtain a uniform removal rate of material from the plurality of regions on the surface of the substrate, wherein the removal rate of material from the at least one region is different than at least one other region of the plurality of regions.

摘要翻译： 一种用于通过化学机械抛光工艺抛光或平面化基板的方法和装置。 在一个实施例中，提供了一种处理半导体衬底的方法。 该方法包括将衬底定位在包括抛光垫组件的抛光设备上，将抛光浆料输送到抛光垫组件的表面，用抛光垫组件的表面抛光衬底，监测来自多个部件的材料的去除速率 在基板表面上确定基板表面上的多个区域是否均匀抛光，并且将抛光浆料添加剂选择性地输送到多个区域中的至少一个区域以获得均匀的材料去除速率 从所述衬底表面上的多个区域中去除所述至少一个区域的材料的去除速率不同于所述多个区域中的至少一个其它区域。

公开(公告)号：US20090149115A1

公开(公告)日：2009-06-11

申请号：US12203726

申请日：2008-09-03

申请人： Ignacio Palou-Rivera ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Ignacio Palou-Rivera ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/00 ,  B24B49/10

CPC分类号： B24B37/042 ,  B24B49/02 ,  B24B49/12

摘要： Systems and methods for performing one or more measurements of a substrate at one or more radii along the substrate are described. Thickness measurements taken at various radii along the substrate can be averaged together to obtain an average value that reflects an overall substrate thickness. A more accurate measurement of the overall substrate thickness can be obtained by performing multiple measurements and averaging the measurements together. Using the average value, polishing can be adjusted to ensure that the substrate achieves a desired planarized thickness profile.

摘要翻译： 描述了用于在沿着衬底的一个或多个半径处进行衬底的一个或多个测量的系统和方法。 可以将沿着衬底的不同半径处的厚度测量值一起平均，以获得反映整个衬底厚度的平均值。 通过执行多次测量并将测量值平均化可以获得整个基板厚度的更准确的测量。 使用平均值，可以调整抛光以确保基板达到期望的平坦化厚度分布。

公开(公告)号：US20090036026A1

公开(公告)日：2009-02-05

申请号：US12185719

申请日：2008-08-04

申请人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

发明人： Jeffrey Drue David ,  Dominic J. Benvegnu ,  Harry Q. Lee ,  Boguslaw A. Swedek ,  Lakshmanan Karuppiah

IPC分类号： B24B49/04 ,  B24B49/12

CPC分类号： B24B49/12 ,  B24B37/013 ,  B24B37/205 ,  B24B49/08 ,  B24D7/14 ,  H01L21/31053 ,  H01L21/3212 ,  H01L22/26

摘要： A computer program product that determines a polishing endpoint includes obtaining spectra from different zones on a substrate during different times in a polishing sequence, matches the spectra with indexes in a library and uses the indexes to determining a polishing rate for each of the different zones from the indexes. An adjusted polishing rate can be determined for one of the zones, which causes the substrate to have a desired profile when the polishing end time is reached.

摘要翻译： 确定抛光终点的计算机程序产品包括在抛光序列的不同时间内从基板上的不同区域获得光谱，将光谱与库中的索引匹配，并使用该指标来确定每个不同区域的抛光速率 指标。 可以为一个区域确定调整的抛光速率，这导致当达到抛光结束时间时，基板具有期望的轮廓。

公开(公告)号：US20080243433A1

公开(公告)日：2008-10-02

申请号：US12059435

申请日：2008-03-31

申请人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

发明人： Abraham Ravid ,  Boguslaw A. Swedek ,  Dominic J. Benvegnu ,  Jeffrey Drue David ,  Jun Qian ,  Sidney P. Huey ,  Ingemar Carlsson ,  Lakshmanan Karuppiah ,  Harry Q. Lee

IPC分类号： G01B5/06

CPC分类号： G01N21/31 ,  G01N21/253 ,  H01L21/67161 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67766

摘要： A method of generating a library from a reference substrate for use in processing product wafers is described. The method includes measuring substrate characteristics at a plurality of well-defined points of a reference substrate, measuring spectra at plurality of measurement points of the reference substrate, there being more measurement points than well-defined points, and associating measured spectra with measured substrate characteristics.

摘要翻译： 描述了从用于处理产品晶片的参考基板产生库的方法。 该方法包括在参考基板的多个明确定义的点处测量衬底特性，测量参考衬底的多个测量点处的光谱，存在比明确定义的点多的测量点，以及将测量的光谱与测量的衬底特性相关联 。