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公开(公告)号：US20190177869A1
公开(公告)日：2019-06-13
申请号：US15838009
申请日：2017-12-11
Applicant: Applied Materials, Inc.
Inventor： Paul McHugh , Gregory J. Wilson , Daniel Woodruff , Marvin Bernt
IPC: C25D17/00 , C25D7/12 , C25D17/12 , C25D21/12 , C25D5/04 , C25D17/06 , H01L21/288 , H01L21/687
Abstract: Embodiments of the present technology may include an electroplating system. The electroplating system may include a vessel. The system may also include a wafer holder configured for holding a wafer in the vessel. The system may further include an anode in the vessel. In addition, the method may include a plurality of thief electrodes. For each thief electrode of the plurality of thief electrodes, a thief current channel may be defined by a channel wall. The channel wall for each thief electrode may define an aperture adjacent to the wafer holder. The thief current channel may extend from each thief electrode to the aperture. The system may include a current control system in electrical communication with the plurality of thief electrodes. The current control system may be configured such that an amount of current delivered to each thief electrode can be adjusted independently.
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公开(公告)号：US10191379B2
公开(公告)日：2019-01-29
申请号：US15606883
申请日：2017-05-26
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Kyle Moran Hanson , John L. Klocke , Eric J. Bergman , Stuart Crane , Gregory J. Wilson
Abstract: In systems and methods for removing a photoresist film off of a wafer, the wafer is moved into a bath of a process liquid in a process tank. The process liquid removes the photoresist film from the wafer. The process liquid is pumped from the process tank to a filter assembly and moved through filter media to filter out solids from the process liquid, and the filtered process liquid is returned to the process tank. A scraper scrapes the filter media to prevent clogging of the filter media by accumulated solids.
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公开(公告)号：US20180340259A1
公开(公告)日：2018-11-29
申请号：US15986197
申请日：2018-05-22
Applicant: Applied Materials, Inc.
Inventor： Gregory J. Wilson , Paul McHugh , Karthik Ramanathan
IPC: C23C16/52 , C23C16/455 , C23C16/46 , H01L21/66 , H01L21/02
Abstract: Apparatus and methods to deposit a film using a batch processing chamber with a plurality of heating zones are described. The film is deposited on one or more substrates and the uniformity of the deposition thickness is determined at a plurality of points. The heating zones set points are applied to a sensitivity matrix and new temperature or power set points for the heating zones are determined and set. One or more substrates are processed using the new set points and the thickness uniformity is determined and may be adjusted again to increase the uniformity.
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公开(公告)号：US10113245B2
公开(公告)日：2018-10-30
申请号：US15447458
申请日：2017-03-02
Applicant: APPLIED Materials, Inc.
Inventor： Gregory J. Wilson
Abstract: A contact ring for an electroprocessor has redundant contact fingers, i.e., more contact fingers than needed for contacting a very narrow edge exclusion zone on a substrate such as a semiconductor wafer. The contact fingers have slightly different lengths so that they extend to different radial positions. By providing redundant contact fingers, and by slightly varying the lengths of the contact fingers, a sufficient number of contact fingers make contact with the electrically conductive surface in the edge exclusion zone to provide good electroplating results.
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公开(公告)号：US10087543B2
公开(公告)日：2018-10-02
申请号：US15423298
申请日：2017-02-02
Applicant: APPLIED Materials, Inc.
Inventor： Nolan L. Zimmerman , George Mattinger , Gregory J. Wilson , Eric A. Englhardt , Balamurugan Ramasamy
IPC: F16J9/00 , C25D17/00 , F16J15/3236 , F16J15/3204 , F16J15/16 , F16J15/00 , F16J15/02
Abstract: A seal ring for an electrochemical processor does not slip or deflect laterally when pressed against a wafer surface. The seal ring may be on a rotor of the processor, with the seal ring having an outer wall joined to a tip arc through an end. The outer wall may be a straight wall. A relatively rigid support ring may be attached to the seal ring, to provide a more precise sealing dimension. Knife edge seal rings that slip or deflect laterally on the wafer surface may also be used. In these designs, the slipping is substantially uniform and consistent, resulting in improved performance.
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Patent Agency Ranking
公开(公告)号：US10047453B2
公开(公告)日：2018-08-14
申请号：US14721693
申请日：2015-05-26
Applicant: APPLIED Materials, Inc.
Inventor： Daniel J. Woodruff , Gregory J. Wilson , Paul R. McHugh
Abstract: An electroplating processor includes a base having a vessel body. A membrane assembly including a membrane housing is attached to a membrane plate. A membrane is provided on a membrane support attached to the membrane housing. An anode assembly includes an anode cup and one or more anodes in the anode cup. An anode plate is attached to the anode cup. Two or more posts on a first side of the anode plate are engageable with post fittings on the membrane plate. Latches on a second side of the anode plate are engageable with and releasable from a latch fitting on the membrane plate. The anode assembly is quickly and easily removable from the processor for maintenance, without disturbing or removing other components of the processor.
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公开(公告)号：US20170357158A1
公开(公告)日：2017-12-14
申请号：US15606883
申请日：2017-05-26
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Kyle Moran Hanson , John L. Klocke , Eric J. Bergman , Stuart Crane , Gregory J. Wilson
IPC: G03F7/42
CPC classification number: G03F7/422 , G03F7/3092 , G03F7/40 , H01L21/02087
Abstract: In systems and methods for removing a photoresist film off of a wafer, the wafer is moved into a bath of a process liquid in a process tank. The process liquid removes the photoresist film from the wafer. The process liquid is pumped from the process tank to a filter assembly and moved through filter media to filter out solids from the process liquid, and the filtered process liquid is returned to the process tank. A scraper scrapes the filter media to prevent clogging of the filter media by accumulated solids.
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公开(公告)号：US20170275776A1
公开(公告)日：2017-09-28
申请号：US15447458
申请日：2017-03-02
Applicant: APPLIED Materials, Inc.
Inventor： Gregory J. Wilson
CPC classification number: C25D17/005 , C25D5/022 , C25D5/56 , C25D7/123 , C25D17/001 , H01L21/2885 , H01R4/48 , H01R39/18 , H01R39/64
Abstract: A contact ring for an electroprocessor has redundant contact fingers, i.e., more contact fingers than needed for contacting a very narrow edge exclusion zone on a substrate such as a semiconductor wafer. The contact fingers have slightly different lengths so that they extend to different radial positions. By providing redundant contact fingers, and by slightly varying the lengths of the contact fingers, a sufficient number of contact fingers make contact with the electrically conductive surface in the edge exclusion zone to provide good electroplating results.
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公开(公告)号：US20170016137A1
公开(公告)日：2017-01-19
申请号：US14802859
申请日：2015-07-17
Applicant: APPLIED Materials, Inc.
Inventor： Gregory J. Wilson , Paul R. McHugh , John L. Klocke
CPC classification number: C25D21/18 , C25D3/38 , C25D7/123 , C25D17/001 , C25D17/002 , C25D17/06 , C25D17/10 , Y02E60/366
Abstract: An electroplating processor has a vessel holding an electrolyte. An inert anode in the vessel has an anode wire within an anode membrane tube. A head for holds a wafer in contact with the electrolyte in the vessel. The wafer is connected to a cathode. A catholyte replenisher is connected to the vessel. The catholyte replenisher adds metal ions into the catholyte by moving ions of a bulk metal through a catholyte membrane in the catholyte replenisher.
Abstract translation: 电镀处理器具有容纳电解质的容器。 容器中的惰性阳极在阳极膜管内具有阳极线。 用于保持与容器中的电解质接触的晶片的头部。 晶片连接到阴极。 阴极电解液补充器连接到容器。 阴极电解液补充剂通过将大块金属的离子移动通过阴极电解液补充液中的阴极电解液膜，将金属离子添加到阴极电解液中。
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公开(公告)号：US20170009368A1
公开(公告)日：2017-01-12
申请号：US15270937
申请日：2016-09-20
Applicant: APPLIED Materials, Inc.
Inventor： Paul R. McHugh , Gregory J. Wilson , Roey Shaviv
CPC classification number: C25D17/008 , C25D5/00 , C25D17/001 , C25D17/007 , C25D17/12
Abstract: An electroplating apparatus has one or more membrane tube rings which act as electric field shields, to provide advantageous plating characteristics at the perimeter of a work piece. The membrane tube rings may be filled with fluids having different conductivity, to change the shielding effect as desired for electroplating different types of substrates. The membrane tube rings may optionally be provided in or on a diffuser plate in the vessel of the apparatus.
Abstract translation: 电镀设备具有一个或多个膜管环，其作为电场屏蔽，以在工件的周边提供有利的电镀特性。 膜管环可以填充具有不同导电性的流体，以根据需要改变电镀不同类型的基底的屏蔽效果。 膜管环可以可选地设置在装置的容器中的扩散器板中或其上。
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