METHOD OF FABRICATING A DEEP TRENCH DEVICE
    71.
    发明申请
    METHOD OF FABRICATING A DEEP TRENCH DEVICE 审中-公开
    制造深层TRENCH装置的方法

    公开(公告)号:US20120302030A1

    公开(公告)日:2012-11-29

    申请号:US13118451

    申请日:2011-05-29

    IPC分类号: H01L21/02 H01L21/28

    CPC分类号: H01L29/66181 H01L29/945

    摘要: A method of fabricating a deep trench capacitor includes the steps as follows. Firstly, a substrate having a trench therein is provided. Then, a bottom electrode is formed in the substrate around the trench. Later, a capacitor dielectric layer is formed to surround an inner sidewall of the trench. After that, a first conductive layer is form to fill up the trench. Subsequently, a material layer is formed on the substrate. Later, a hole is formed in the material layer, wherein the hole is directly above the trench. Finally, a second conductive layer is form to fill in the hole.

    摘要翻译: 制造深沟槽电容器的方法包括以下步骤。 首先,提供其中具有沟槽的衬底。 然后,在沟槽周围的衬底中形成底部电极。 之后,形成电容器电介质层以包围沟槽的内侧壁。 之后,形成填充沟槽的第一导电层。 接着,在基板上形成材料层。 之后,在该材料层中形成一个孔,其中孔直接在沟槽的上方。 最后,第二导电层是填充孔的形式。

    METHOD OF REDUCING MICROLOADING EFFECT
    72.
    发明申请
    METHOD OF REDUCING MICROLOADING EFFECT 有权
    减少微波效应的方法

    公开(公告)号:US20120301833A1

    公开(公告)日:2012-11-29

    申请号:US13118447

    申请日:2011-05-29

    IPC分类号: G03F7/20

    CPC分类号: H01L21/3083

    摘要: The present invention provides a method of reducing microloading effect by using a photoresist layer as a buffer. The method includes: providing a substrate defined with a dense region and an isolated region. Then, a dense feature pattern and an isolated feature pattern are formed on the dense region and the isolated region respectively. After that, a photoresist layer is formed to cover the isolated region. Finally, the substrate and the photoresist layer are etched by taking the dense feature pattern and the isolated feature pattern as a mask.

    摘要翻译: 本发明提供一种通过使用光致抗蚀剂层作为缓冲液来减少微载物效应的方法。 该方法包括:提供限定有致密区域和隔离区域的衬底。 然后,分别在密集区域和孤立区域上形成致密特征图案和隔离特征图案。 之后,形成光致抗蚀剂层以覆盖隔离区域。 最后,通过将密集特征图案和孤立的特征图案作为掩模来蚀刻基底和光致抗蚀剂层。

    Method for obtaining a layout design for an existing integrated circuit
    73.
    发明申请
    Method for obtaining a layout design for an existing integrated circuit 有权
    获得现有集成电路布局设计的方法

    公开(公告)号:US20120289048A1

    公开(公告)日:2012-11-15

    申请号:US13104986

    申请日:2011-05-11

    IPC分类号: H01L21/306 H01L21/304

    摘要: A method for obtaining a layout design for an existing integrated circuit, in which, an integrated circuit die is polished with a tilt angle to form an inclined polished surface and one or more images of the inclined polished surface are obtained. The images may be overlapped directly, or the image or the images may be utilized to provide information to obtain a layout design comprising at least one repeating unit structure of the layout structure.

    摘要翻译: 一种用于获得现有集成电路的布局设计的方法,其中集成电路管芯以倾斜角抛光以形成倾斜的抛光表面,并且获得倾斜抛光表面的一个或多个图像。 图像可以直接重叠,或者图像或图像可以用于提供信息以获得包括布局结构的至少一个重复单元结构的布局设计。

    MOS TEST STRUCTURE, METHOD FOR FORMING MOS TEST STRUCTURE AND METHOD FOR PERFORMING WAFER ACCEPTANCE TEST
    74.
    发明申请
    MOS TEST STRUCTURE, METHOD FOR FORMING MOS TEST STRUCTURE AND METHOD FOR PERFORMING WAFER ACCEPTANCE TEST 有权
    MOS测试结构,形成MOS测试结构的方法和执行波形接受测试的方法

    公开(公告)号:US20120286819A1

    公开(公告)日:2012-11-15

    申请号:US13105913

    申请日:2011-05-12

    IPC分类号: G01R31/26 H01L21/28 H01L23/48

    摘要: A MOS test structure is disclosed. A scribe line region is disposed on a substrate which has a first side and a second side opposite to the first side. An epitaxial layer is disposed on the first side, the doping well is disposed on the epitaxial layer and the doping region is disposed on the doping well. A trench gate of a first depth is disposed in the doping region, in the doping well and in the scribe line region. A conductive material fills the test via which has a second depth and an isolation covering the inner wall of the test via and is disposed in the doping region, in the doping well, in the epitaxial layer and in the scribe line region, to electrically connect to the epitaxial layer so that the test via is capable of testing the epitaxial layer and the substrate together.

    摘要翻译: 公开了MOS测试结构。 划线区域设置在具有与第一侧相对的第一侧和第二侧的基板上。 外延层设置在第一侧上,掺杂阱设置在外延层上,并且掺杂区域设置在掺杂阱上。 第一深度的沟槽栅极设置在掺杂区域,掺杂阱和划线区域中。 导电材料填充测试,通过该测试具有覆盖测试通孔的内壁的第二深度和隔离,并且设置在掺杂区域,掺杂阱,外延层和划线区域中,以电连接 到外延层,使得测试通孔能够一起测试外延层和衬底。

    POLISHING PAD WEAR DETECTING APPARATUS
    75.
    发明申请
    POLISHING PAD WEAR DETECTING APPARATUS 审中-公开
    抛光垫磨损检测装置

    公开(公告)号:US20120270474A1

    公开(公告)日:2012-10-25

    申请号:US13090284

    申请日:2011-04-20

    IPC分类号: B24B49/00

    CPC分类号: B24B37/34 B24B49/00

    摘要: A polishing pad wear detecting apparatus suitable for a chemical mechanical polishing (CMP) apparatus is provided. The polishing pad wear detecting apparatus includes an arm and a height detector. One end of the arm is fastened on the CMP apparatus. The height detector is disposed on the arm for detecting height variation of a polishing pad.

    摘要翻译: 提供了适用于化学机械抛光(CMP)装置的抛光垫磨损检测装置。 抛光垫磨损检测装置包括臂和高度检测器。 臂的一端固定在CMP装置上。 高度检测器设置在臂上用于检测抛光垫的高度变化。

    MANUFACTURING METHOD OF GATE DIELECTRIC LAYER
    76.
    发明申请
    MANUFACTURING METHOD OF GATE DIELECTRIC LAYER 审中-公开
    门电介质层的制造方法

    公开(公告)号:US20120270411A1

    公开(公告)日:2012-10-25

    申请号:US13092994

    申请日:2011-04-25

    IPC分类号: H01L21/316

    CPC分类号: H01L21/28229 H01L29/518

    摘要: A manufacturing method of a gate dielectric layer is provided. An oxidation treatment is performed to form an oxide layer on a substrate. A nitridation treatment is performed to form a nitride layer on the oxide layer. An annealing treatment is performed in a mixing gas of N2 and O2, where the temperature of the annealing treatment is 900° C. to 950° C., the pressure of the annealing treatment is 5 Torr to 10 Torr, and the content ratio of the N2 to O2 is 0.5 to 0.8.

    摘要翻译: 提供了栅介质层的制造方法。 进行氧化处理以在基板上形成氧化物层。 进行氮化处理以在氧化物层上形成氮化物层。 在N2和O2的混合气体中进行退火处理,其中退火处理的温度为900℃至950℃,退火处理的压力为5托至10托,并且含量比 N 2至O 2为0.5至0.8。

    TRANSISTOR WITH BURIED FINS
    77.
    发明申请
    TRANSISTOR WITH BURIED FINS 有权
    带有隐形金属的晶体管

    公开(公告)号:US20120256257A1

    公开(公告)日:2012-10-11

    申请号:US13081509

    申请日:2011-04-07

    IPC分类号: H01L29/772

    摘要: The present invention disclosed a recessed gate transistor with buried fins. The recessed gate transistor with buried fins is disposed in an active region on a semiconductor substrate. Two isolation regions disposed in the semiconductor substrate, and sandwich the active region. A gate structure is disposed in the semiconductor substrate, wherein the gate structure includes: an upper part and a lower part. The upper part is disposed in the active region and a lower part having a front fin disposed in one of the two isolation regions, at least one middle fin disposed in the active region, and a last fin disposed in the other one of the two isolation regions, wherein the front fin are both elliptic cylindrical.

    摘要翻译: 本发明公开了一种具有埋地鳍片的凹陷式栅极晶体管。 具有埋入散热片的嵌入式栅极晶体管设置在半导体衬底上的有源区中。 两个隔离区域设置在半导体衬底中并夹持有源区。 栅极结构设置在半导体衬底中,其中栅极结构包括:上部和下部。 上部设置在有源区域中,下部具有设置在两个隔离区域之一中的前翅片,设置在有源区域中的至少一个中间翅片,以及设置在两个隔离物中的另一个中的最后一个翅片 区域,其中前鳍都是椭圆柱形。

    RECESSED TRENCH GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
    78.
    发明申请
    RECESSED TRENCH GATE STRUCTURE AND METHOD OF FABRICATING THE SAME 审中-公开
    阻塞式闸门结构及其制造方法

    公开(公告)号:US20120256255A1

    公开(公告)日:2012-10-11

    申请号:US13081498

    申请日:2011-04-07

    IPC分类号: H01L29/78 H01L21/336

    摘要: A recessed trench gate structure is provided. The recessed trench gate structure includes a substrate with a recessed trench, a gate dielectric layer disposed around an inner surface of the recessed trench, a lower gate conductor disposed at a lower portion of the recessed trench and on the gate dielectric layer. Specially, the lower gate conductor has a convex top surface. A spacer is disposed along an inner side wall of a upper portion of the recessed trench and a upper gate conductor is disposed on the lower gate conductor. The convex top surface can prevent the electric field from distributing not uniformly, so that the GIDL can be prevented.

    摘要翻译: 提供凹槽沟槽栅结构。 所述凹槽沟槽栅极结构包括具有凹槽的衬底,设置在所述凹槽的内表面周围的栅极电介质层,设置在所述凹槽的下部和所述栅介质层上的下栅极导体。 特别地,下栅极导体具有凸起的顶表面。 间隔件沿着凹槽的上部的内侧壁设置,并且上栅极导体设置在下栅极导体上。 凸顶表面可以防止电场不均匀分布,从而可以防止GIDL。

    POWER DEVICE WITH TRENCHED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME
    79.
    发明申请
    POWER DEVICE WITH TRENCHED GATE STRUCTURE AND METHOD OF FABRICATING THE SAME 有权
    具有开关门结构的电力装置及其制造方法

    公开(公告)号:US20120256230A1

    公开(公告)日:2012-10-11

    申请号:US13081500

    申请日:2011-04-07

    IPC分类号: H01L29/739 H01L21/331

    摘要: A power device with trenched gate structure, includes: a substrate having a first face and a second face opposing to the first face, a body region of a first conductivity type disposed in the substrate, a base region of a second conductivity type disposed in the body region, a cathode region of the first conductivity type disposed in the base region, an anode region of the second conductivity type disposed in the substrate at the second face a trench disposed in the substrate and extending from the first face into the body region, and the cathode region encompassing the trench, wherein the trench has a wavelike sidewall, a gate structure disposed in the trench and an accumulation region disposed in the body region and along the wavelike sidewall. The wavelike sidewall can increase the base current of the bipolar transistor and increase the performance of the IGBT.

    摘要翻译: 具有沟槽栅极结构的功率器件包括:具有第一面和与第一面相对的第二面的衬底,设置在衬底中的第一导电类型的主体区域,设置在第二导电类型的基极区域 设置在所述基底区域中的所述第一导电类型的阴极区域,所述第二导电类型的阳极区域设置在所述基板的所述第二面处,所述沟槽设置在所述基板中并且从所述第一面延伸到所述主体区域中, 以及包围所述沟槽的阴极区域,其中所述沟槽具有波状侧壁,设置在所述沟槽中的栅极结构以及设置在所述体区中并沿着所述波浪形侧壁的堆积区域。 波形侧壁可以增加双极晶体管的基极电流并增加IGBT的性能。

    Antifuse element for integrated circuit device
    80.
    发明授权
    Antifuse element for integrated circuit device 有权
    集成电路器件用防尘元件

    公开(公告)号:US08278732B1

    公开(公告)日:2012-10-02

    申请号:US13096995

    申请日:2011-04-28

    IPC分类号: H01L23/52

    摘要: An antifuse element for an integrated circuit is provided, including a conductive region formed in a semiconductor substrate, extending along a first direction; a dielectric layer formed on a portion of the conductive region; a first conductive plug formed on the dielectric layer; a second conductive plug formed on another portion of the conductive region; and a first conductive member formed over the first and second conductive plugs, extending along a second direction perpendicular to the first direction; and a second conductive member formed over the second conductive plug extending along the second direction, wherein the first conductive member intersects with the conductive region, having a first overlapping area therebetween, and the dielectric layer and the conductive region have a second overlapping area therebetween, and a ratio between the first overlapping area and the second overlapping area is about 1.5:1 to 3:1.

    摘要翻译: 提供了一种用于集成电路的反熔丝元件,包括形成在半导体衬底中的导电区域,沿着第一方向延伸; 形成在所述导电区域的一部分上的电介质层; 形成在所述电介质层上的第一导电插塞; 形成在所述导电区域的另一部分上的第二导电插塞; 以及第一导电构件,形成在所述第一和第二导电插塞上,沿着垂直于所述第一方向的第二方向延伸; 以及形成在所述第二导电插塞上的第二导电构件,所述第二导电插塞沿着所述第二方向延伸,其中所述第一导电构件与所述导电区域相交,所述导电区域之间具有第一重叠区域,并且所述介电层和所述导电区域之间具有第二重叠区域 并且第一重叠区域和第二重叠区域之间的比率为约1.5:1至3:1。