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108 条记录 (耗时 0.045 秒)

    Rear-face illuminated solid state image sensors
    73.
    发明授权
    Rear-face illuminated solid state image sensors 有权
    背面照明固态图像传感器

    公开(公告)号：US08624342B2

    公开(公告)日：2014-01-07

    申请号：US12940326

    申请日：2010-11-05

    申请人： Giles Humpston ,  Moshe Kriman

    发明人： Giles Humpston ,  Moshe Kriman

    IPC分类号： H01L31/02

    CPC分类号： H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

    摘要： A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

    摘要翻译： 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

    Multi-State Electrostatic Actuator and Digital Camera Therewith
    74.
    发明申请
    Multi-State Electrostatic Actuator and Digital Camera Therewith 审中-公开
    多状态静电执行器和数码相机

    公开(公告)号：US20130314587A1

    公开(公告)日：2013-11-28

    申请号：US13984275

    申请日：2012-02-06

    申请人： Moshe Kriman ,  Ephraim Goldenberg ,  Uri Kinrot ,  Gal Shabtay ,  Jamil Nasser ,  Dalit Bahar ,  Giles Humpston

    发明人： Moshe Kriman ,  Ephraim Goldenberg ,  Uri Kinrot ,  Gal Shabtay ,  Jamil Nasser ,  Dalit Bahar ,  Giles Humpston

    IPC分类号： H02N1/00 ,  H04N5/232

    CPC分类号： H02N1/006 ,  H04N5/232

    摘要： An actuator that operates by electrostatic attraction and repulsion and can have fixed and moving electrodes is disclosed for one or more embodiments. The fixed and moving electrodes can be inclined relative to each other at an acute angle. The actuator can be radially symmetric and mirrored about the moving electrode. The moving electrode can have a central aperture over which is placed an optical element such as a lens. The optical element can be part of an optical train that permits the focus of an electronic camera to be modified by changing the displacement of the lens along the optical axis of the camera.

    摘要翻译： 对于一个或多个实施例公开了一种通过静电吸引和排斥操作并且可以具有固定和移动的电极的致动器。 固定和移动的电极可以相对于彼此以锐角倾斜。 致动器可以围绕移动电极径向对称和镜像。 移动电极可以具有中心孔，在其上放置诸如透镜的光学元件。 光学元件可以是允许通过改变透镜沿着照相机的光轴的位移来修改电子照相机的焦点的光学系列的一部分。

    EMITTER WIRE WITH LAYERED CROSS-SECTION
    76.
    发明申请
    EMITTER WIRE WITH LAYERED CROSS-SECTION 审中-公开
    发射线与分层交叉部分

    公开(公告)号：US20130056241A1

    公开(公告)日：2013-03-07

    申请号：US13302811

    申请日：2011-11-22

    申请人： Guilian Gao ,  Nels Jewell-Larsen ,  Giles Humpston

    发明人： Guilian Gao ,  Nels Jewell-Larsen ,  Giles Humpston

    IPC分类号： H01B5/00 ,  F28F13/00 ,  F04B19/00 ,  B05D5/12

    CPC分类号： B03C3/60 ,  B03C3/41 ,  B03C2201/04 ,  B03C2201/14

    摘要： By selecting different materials for each layer, a multi-layered electrode structure can be made with superior performance characteristics. For example, a multilayered electrode can include a high tensile strength tungsten core, a conductive intermediate palladium, palladium-nickel, or other platinum group metal layer for generating a corona discharge, and a hardened layer comprising rhodium or other platinum group metal or alloy of the same to resist frictional abrasion during removal of silica dendrites that accumulate on the electrode surface during operation.

    摘要翻译： 通过为每层选择不同的材料，可以制造具有优异性能特性的多层电极结构。 例如，多层电极可以包括用于产生电晕放电的高拉伸强度钨芯，导电中间体钯，钯 - 镍或其它铂族金属层，以及包含铑或其它铂族金属或其它铂族金属的合金的硬化层 同样能够抵抗在操作期间积聚在电极表面上的二氧化硅枝晶的去除期间的摩擦磨损。

    Wafer-Scale Emitter Package Including Thermal Vias
    77.
    发明申请
    Wafer-Scale Emitter Package Including Thermal Vias 审中-公开
    包括散热片的晶圆发射器封装

    公开(公告)号：US20120199857A1

    公开(公告)日：2012-08-09

    申请号：US13500889

    申请日：2010-10-07

    申请人： Giles Humpston ,  Moshe Kriman ,  Marc Himel

    发明人： Giles Humpston ,  Moshe Kriman ,  Marc Himel

    IPC分类号： H01L27/15 ,  H01L33/64

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends.

    摘要翻译： 可以在晶片级制造用于发光体的改进的封装。 该封装可以是单个器件或一个管芯阵列。 该封装包括延伸穿过封装衬底的厚度的热通孔。 热通孔可以由具有高导热性的材料制成。 热通孔在封装外部比在内部可以更宽，以在器件和其散热器之间提供散热。 热通孔的锥角可以是大约45度，以匹配固体中的热量的自然扩散。 热通孔可以在封装内部延伸，因此其高度足以将放置在其上的发射器放置在抛物线的一个焦点处，其中抛物线的顶点位于热通孔延伸的封装衬底的表面处。