利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

14 条记录 (耗时 0.034 秒)

    Wafer-Scale Emitter Package Including Thermal Vias
    1.
    发明申请
    Wafer-Scale Emitter Package Including Thermal Vias 审中-公开
    包括散热片的晶圆发射器封装

    公开(公告)号：US20120199857A1

    公开(公告)日：2012-08-09

    申请号：US13500889

    申请日：2010-10-07

    申请人： Giles Humpston ,  Moshe Kriman ,  Marc Himel

    发明人： Giles Humpston ,  Moshe Kriman ,  Marc Himel

    IPC分类号： H01L27/15 ,  H01L33/64

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Improved packages for light emitters may be fabricated at the wafer level. The package can be a single device or an array of die. The package includes a thermal via that extends through the thickness of the package substrate. The thermal via may be made of a material possessing a high thermal conductivity. The thermal via may be wider at the package exterior than at the interior to provide heat spreading between the device and its heat sink. The taper angle of the thermal via may be around 45 degrees to match the natural spread of heat in a solid. The thermal via may extend above the package interior, so its height is sufficient to position an emitter placed thereon at one foci of a parabola, where the vertex of the parabola is at the surface of the package substrate from which the thermal via extends.

    摘要翻译： 可以在晶片级制造用于发光体的改进的封装。 该封装可以是单个器件或一个管芯阵列。 该封装包括延伸穿过封装衬底的厚度的热通孔。 热通孔可以由具有高导热性的材料制成。 热通孔在封装外部比在内部可以更宽，以在器件和其散热器之间提供散热。 热通孔的锥角可以是大约45度，以匹配固体中的热量的自然扩散。 热通孔可以在封装内部延伸，因此其高度足以将放置在其上的发射器放置在抛物线的一个焦点处，其中抛物线的顶点位于热通孔延伸的封装衬底的表面处。

    Stacked microelectronic assemblies having vias extending through bond pads
    2.
    发明授权
    Stacked microelectronic assemblies having vias extending through bond pads 有权
    堆叠的微电子组件具有延伸穿过接合焊盘的通孔

    公开(公告)号：US08466542B2

    公开(公告)日：2013-06-18

    申请号：US12723039

    申请日：2010-03-12

    申请人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    发明人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    IPC分类号： H01L23/48 ,  H01L23/02 ,  H01L29/40

    CPC分类号： H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

    摘要翻译： 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。

    REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS
    3.
    发明申请
    REAR-FACE ILLUMINATED SOLID STATE IMAGE SENSORS 有权
    后照明固体状态图像传感器

    公开(公告)号：US20120112301A1

    公开(公告)日：2012-05-10

    申请号：US12940326

    申请日：2010-11-05

    申请人： Giles Humpston ,  Moshe Kriman

    发明人： Giles Humpston ,  Moshe Kriman

    IPC分类号： H01L31/02 ,  H01L31/18

    CPC分类号： H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

    摘要： A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

    摘要翻译： 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

    STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS
    4.
    发明申请
    STACKED MICROELECTRONIC ASSEMBLIES HAVING VIAS EXTENDING THROUGH BOND PADS 有权
    堆叠式微电脑组件，具有通过焊盘延伸的VIAS

    公开(公告)号：US20100230795A1

    公开(公告)日：2010-09-16

    申请号：US12723039

    申请日：2010-03-12

    申请人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    发明人： Moshe Kriman ,  Osher Avsian ,  Belgacem Haba ,  Giles Humpston ,  Dmitri Burshtyn

    IPC分类号： H01L25/065 ,  H01L21/77 ,  H01L23/538

    CPC分类号： H01L25/0657 ,  H01L21/76805 ,  H01L23/481 ,  H01L25/50 ,  H01L2224/02371 ,  H01L2224/0401 ,  H01L2224/13024 ,  H01L2224/24145 ,  H01L2225/06524 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2924/1461 ,  H01L2924/00

    摘要： A stacked microelectronic assembly is provided which includes first and second stacked microelectronic elements. Each of the first and second microelectronic elements can include a conductive layer extending along a face of such microelectronic element. At least one of the first and second microelectronic elements can include a recess extending from the rear surface towards the front surface, and a conductive via extending from the recess through the bond pad and electrically connected to the bond pad, with a conductive layer connected to the via and extending along a rear face of the microelectronic element towards an edge of the microelectronic element. A plurality of leads can extend from the conductive layers of the first and second microelectronic elements and a plurality of terminals of the assembly can be electrically connected with the leads.

    摘要翻译： 提供堆叠的微电子组件，其包括第一和第二堆叠的微电子元件。 第一和第二微电子元件中的每一个可以包括沿着这种微电子元件的表面延伸的导电层。 第一和第二微电子元件中的至少一个可以包括从后表面朝向前表面延伸的凹部，以及从凹槽穿过接合焊盘延伸并电连接到接合焊盘的导电通孔，导电层连接到 所述通孔沿着所述微电子元件的后表面朝向所述微电子元件的边缘延伸。 多个引线可以从第一和第二微电子元件的导电层延伸，并且组件的多个端子可以与引线电连接。

    Rear-face illuminated solid state image sensors
    6.
    发明授权
    Rear-face illuminated solid state image sensors 有权
    背面照明固态图像传感器

    公开(公告)号：US08624342B2

    公开(公告)日：2014-01-07

    申请号：US12940326

    申请日：2010-11-05

    申请人： Giles Humpston ,  Moshe Kriman

    发明人： Giles Humpston ,  Moshe Kriman

    IPC分类号： H01L31/02

    CPC分类号： H01L27/14636 ,  H01L21/76898 ,  H01L27/14618 ,  H01L27/14632 ,  H01L27/14638 ,  H01L27/1464 ,  H01L27/14687 ,  H01L27/14806 ,  H01L2224/13024

    摘要： A microelectronic unit includes a semiconductor element having a front surface to which a packaging layer is attached, and a rear surface remote from the front surface. The element includes a light detector including a plurality of light detector element arranged in an array disposed adjacent to the front surface and arranged to receive light through the rear surface. The semiconductor element also includes an electrically conductive contact at the front surface connected to the light detector. The conductive contact includes a thin region and a thicker region which is thicker than the thin region. A conductive interconnect extends through the packaging layer to the thin region of the conductive contact, and a portion of the conductive interconnect is exposed at a surface of the microelectronic unit.

    摘要翻译： 微电子单元包括具有附接有包装层的前表面和远离前表面的后表面的半导体元件。 元件包括光检测器，其包括布置成邻近前表面设置的阵列的多个光检测器元件，并布置成通过后表面接收光。 半导体元件还包括在连接到光检测器的前表面处的导电接触。 导电接触包括薄区域和比薄区域更厚的较厚区域。 导电互连件穿过包装层延伸到导电接触件的薄区域，并且导电互连件的一部分在微电子单元的表面处露出。

    Multi-State Electrostatic Actuator and Digital Camera Therewith
    7.
    发明申请
    Multi-State Electrostatic Actuator and Digital Camera Therewith 审中-公开
    多状态静电执行器和数码相机

    公开(公告)号：US20130314587A1

    公开(公告)日：2013-11-28

    申请号：US13984275

    申请日：2012-02-06

    申请人： Moshe Kriman ,  Ephraim Goldenberg ,  Uri Kinrot ,  Gal Shabtay ,  Jamil Nasser ,  Dalit Bahar ,  Giles Humpston

    发明人： Moshe Kriman ,  Ephraim Goldenberg ,  Uri Kinrot ,  Gal Shabtay ,  Jamil Nasser ,  Dalit Bahar ,  Giles Humpston

    IPC分类号： H02N1/00 ,  H04N5/232

    CPC分类号： H02N1/006 ,  H04N5/232

    摘要： An actuator that operates by electrostatic attraction and repulsion and can have fixed and moving electrodes is disclosed for one or more embodiments. The fixed and moving electrodes can be inclined relative to each other at an acute angle. The actuator can be radially symmetric and mirrored about the moving electrode. The moving electrode can have a central aperture over which is placed an optical element such as a lens. The optical element can be part of an optical train that permits the focus of an electronic camera to be modified by changing the displacement of the lens along the optical axis of the camera.

    摘要翻译： 对于一个或多个实施例公开了一种通过静电吸引和排斥操作并且可以具有固定和移动的电极的致动器。 固定和移动的电极可以相对于彼此以锐角倾斜。 致动器可以围绕移动电极径向对称和镜像。 移动电极可以具有中心孔，在其上放置诸如透镜的光学元件。 光学元件可以是允许通过改变透镜沿着照相机的光轴的位移来修改电子照相机的焦点的光学系列的一部分。

    Wafer level edge stacking
    10.
    发明申请
    Wafer level edge stacking 有权
    晶圆级边缘堆叠

    公开(公告)号：US20090316378A1

    公开(公告)日：2009-12-24

    申请号：US12456349

    申请日：2009-06-15

    申请人： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

    发明人： Belgacem Haba ,  Ilyas Mohammed ,  Laura Mirkarimi ,  Moshe Kriman

    IPC分类号： H05K7/02 ,  H05K3/34

    CPC分类号： H01L25/105 ,  H01L23/3114 ,  H01L25/50 ,  H01L2224/24145 ,  H01L2225/06551 ,  H01L2225/1035 ,  H01L2225/1064 ,  H01L2924/01067 ,  H01L2924/01322 ,  Y10T29/49144

    摘要： A microelectronic assembly can include a first microelectronic device and a second microelectronic device. Each microelectronic device has a die structure including at least one semiconductor die and each of the microelectronic devices has a first surface, a second surface remote from the first surface and at least one edge surface extending at angles other than a right angle away from the first and second surfaces. At least one electrically conductive element extends along the first surface onto at least one of the edge surfaces and onto the second surface. At least one conductive element of the first microelectronic device can be conductively bonded to the at least one conductive element of the second microelectronic device to provide an electrically conductive path therebetween.

    摘要翻译： 微电子组件可以包括第一微电子器件和第二微电子器件。 每个微电子器件具有包括至少一个半导体管芯的管芯结构，并且每个微电子器件具有第一表面，远离第一表面的第二表面和至少一个边缘表面，该边缘表面以远离第一表面的直角延伸 和第二表面。 至少一个导电元件沿着第一表面延伸到至少一个边缘表面上并且延伸到第二表面上。 第一微电子器件的至少一个导电元件可以导电地结合到第二微电子器件的至少一个导电元件，以在它们之间提供导电路径。