公开(公告)号：US07939901B2

公开(公告)日：2011-05-10

申请号：US12203429

申请日：2008-09-03

申请人： Masanori Minamio ,  Hiroyuki Ishida ,  Noriyuki Yoshikawa

发明人： Masanori Minamio ,  Hiroyuki Ishida ,  Noriyuki Yoshikawa

IPC分类号： H01L31/02

CPC分类号： H01L24/97 ,  B29C45/14418 ,  B29C45/14655 ,  B29C2045/14663 ,  H01L27/14618 ,  H01L27/14683 ,  H01L31/0203 ,  H01L31/18 ,  H01L33/52 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83

摘要： An optical element mounted on a wiring board is sealed by a sealing resin except an optical function region. Wires connecting the wiring board with the optical element are also sealed by the sealing resin. The optical function region is exposed as a bottom surface of a recess whose side surface is formed by the sealing resin. A boundary portion between the side surface of the recess and a top surface portion and a boundary portion between the side surface and bottom surface of the recess have a rounded shape.

摘要翻译： 安装在布线板上的光学元件由光学功能区域以外的密封树脂密封。 将布线板与光学元件连接的电线也由密封树脂密封。 光学功能区域作为其侧表面由密封树脂形成的凹部的底表面露出。 凹部的侧表面与顶表面部分之间的边界部分和凹部的侧表面和底表面之间的边界部分具有圆形。

公开(公告)号：US07719585B2

公开(公告)日：2010-05-18

申请号：US12510562

申请日：2009-07-28

申请人： Katsutoshi Shimizu ,  Masanori Minamio ,  Kouichi Yamauchi

发明人： Katsutoshi Shimizu ,  Masanori Minamio ,  Kouichi Yamauchi

IPC分类号： H04N3/14 ,  H04N5/225 ,  H01J40/14 ,  H01L21/00

CPC分类号： H01L27/14618 ,  H01L24/32 ,  H01L24/97 ,  H01L27/14683 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： A solid-state imaging-device includes a base, frame-shaped ribs provided on the base and forming an internal space, a plurality of wiring members for electrically leading the internal space of a housing formed by the base and the ribs to an external portion, an imaging element fixed to the base inside the internal space, a transparent plate fixed to an upper surface of the ribs, and connecting members electrically connecting electrodes of the imaging element to the wiring members, wherein a plurality of protrusions are provided in a region of the base that faces the imaging element, and the imaging element is fixed by adhesive to the base while being supported by the protrusions. The protrusions enable the imaging element to avoid distortion caused by following the surface of the base, thereby suppressing the effect on electrical properties of the imaging element.

摘要翻译： 固态成像装置包括基部，设置在基部上并形成内部空间的框状肋，多个布线构件，用于将由基部和肋形成的壳体的内部空间电引导到外部部分 ，固定在内部空间内的基座的成像元件，固定到肋的上表面的透明板，以及将成像元件的电极电连接到布线构件的连接构件，其中在区域中设置多个突起 面向成像元件的基部，并且成像元件通过粘合剂固定到基部，同时由突起支撑。 突起使得成像元件能够避免由于跟随基底的表面引起的变形，从而抑制对成像元件的电性能的影响。

公开(公告)号：US20090140405A1

公开(公告)日：2009-06-04

申请号：US12210490

申请日：2008-09-15

申请人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

发明人： Tetsumasa Maruo ,  Masanori Minamio ,  Kiyokazu Itoi

IPC分类号： H01L23/02

CPC分类号： H01L23/10 ,  H01L23/055 ,  H01L24/45 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/05554 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/01015 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12043 ,  H01L2924/15787 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A semiconductor device includes: a semiconductor element; a package body having the semiconductor element bonded inside thereof and electrically connected to the semiconductor element; a lid-like member covering the semiconductor element, and bonded to the package body to form a hollow structure; and a bonding member for bonding the package body and the lid-like member to each other. The bonding member is a resin adhesive containing an epoxy resin, a polymerization initiator, and a filling material, and a content of the filling material in the bonding member is 30 wt % to 60 wt %.

摘要翻译： 半导体器件包括：半导体元件; 封装体，其内部具有半导体元件，并与半导体元件电连接; 覆盖半导体元件的盖状构件，并且结合到封装主体以形成中空结构; 以及用于将封装体和盖状构件彼此接合的接合构件。 接合部件是含有环氧树脂，聚合引发剂和填充材料的树脂粘合剂，接合部件中的填充材料的含量为30重量％〜60重量％。

公开(公告)号：US07538416B2

公开(公告)日：2009-05-26

申请号：US10991864

申请日：2004-11-19

申请人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

发明人： Masanori Minamio ,  Satoru Konishi ,  Yoshihiko Morishita ,  Yuichiro Yamada ,  Fumito Itoh

IPC分类号： H01L23/495

CPC分类号： H01L23/49541 ,  H01L23/3107 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin molded type semiconductor device has: a semiconductor chip (12) which is mounted on a die pad portion (11) of a lead frame (9); thin metal wires (14) which connect terminals of the semiconductor chip (12) to inner lead portions (13) of the lead frame (9); and a sealing resin (15), and the lead frame (9) is subjected to an upsetting process so that a supporting portion (11) is located at a position higher than the inner lead portions (13). Since the sealing resin of a thickness corresponding to the step difference of the upsetting exists below the supporting portion, the adhesiveness between the lead frame and the sealing resin can be improved, and high reliability and thinning are realized. Since at least one groove portion is disposed in the surface of each of the inner lead portions (13), the anchoring effect to the sealing resin (15), stress acting on a lead portion of a product, and stress to the thin metal wires (14) can be relaxed, and leads and the thin metal wires can be prevented from peeling off.

摘要翻译： 树脂模制型半导体器件具有：半导体芯片（12），其安装在引线框架（9）的芯片焊盘部分（11）上; 将半导体芯片（12）的端子连接到引线框架（9）的内引线部分（13）的细金属线（14）; 和密封树脂（15），并且引线框架（9）经受镦锻处理，使得支撑部分（11）位于比内部引线部分（13）高的位置。 由于对应于镦粗阶梯差的厚度的密封树脂存在于支撑部分的下方，因此可以提高引线框架和密封树脂之间的粘合性，并且实现高可靠性和变薄。 由于至少一个槽部设置在每个内部引线部分（13）的表面中，所以对密封树脂（15）的锚定效应，作用在产品的引线部分上的应力和对金属细线的应力 （14）可以松弛，并且可以防止导线和细金属线剥离。

公开(公告)号：US07485848B2

公开(公告)日：2009-02-03

申请号：US10958296

申请日：2004-10-06

申请人： Masanori Minamio

发明人： Masanori Minamio

IPC分类号： H01J40/14

CPC分类号： H01L33/486 ,  H01L25/167 ,  H01L27/14618 ,  H01L27/14625 ,  H01L2224/48091 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15311 ,  H04N5/2257 ,  H01L2924/00014

摘要： An optical device includes a base and an optical element chip and translucent member attached to the base. A wiring is buried in the base. One end of the wiring is an internal terminal portion. The other end of the wiring is an external terminal portion. A semiconductor chip incorporating peripheral circuits, etc., and a metal wire for connecting a pad electrode of the semiconductor chip and the wiring are buried in the base. The semiconductor chip incorporating peripheral circuits, etc., and the metal wire are buried together with the wiring in the base by molding, whereby the optical device and the semiconductor chip incorporating peripheral circuits, etc., are integrated into a single package.

摘要翻译： 光学装置包括基座和附接到基座的光学元件芯片和半透明构件。 接线埋在基座上。 布线的一端是内部端子部分。 布线的另一端是外部端子部分。 包含外围电路等的半导体芯片和用于连接半导体芯片的焊盘电极和布线的金属线被埋在基座中。 包含外围电路等的半导体芯片和金属线通过模制而与布线一起埋在基座中，由此将包含外围电路等的光学器件和半导体芯片集成到单个封装中。

公开(公告)号：US07126209B2

公开(公告)日：2006-10-24

申请号：US11018541

申请日：2004-12-21

申请人： Masanori Minamio ,  Haruto Nagata ,  Tetsushi Nishio

发明人： Masanori Minamio ,  Haruto Nagata ,  Tetsushi Nishio

IPC分类号： H01L23/495

CPC分类号： H01L23/4951 ,  H01L21/56 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49575 ,  H01L24/45 ,  H01L24/48 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16145 ,  H01L2224/16245 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2224/81801 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06586 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2924/00

摘要： A resin-encapsulated semiconductor device includes: a semiconductor chip on a surface of which a group of electrodes is disposed; a plurality of inner leads arranged along a periphery of the semiconductor chip; connecting members for connecting the electrodes of the semiconductor chip with the respective inner leads, an encapsulating resin for encapsulating surfaces of the semiconductor chip and the connecting members; and external electrodes exposed from the encapsulating resin. Each of the inner leads extends across the periphery of the semiconductor chip from an internal side to an external side of the periphery, and includes a protruded portion provided on a surface of the inner lead on an external side relative to the periphery of the semiconductor chip, the protruded portion being protruded in a thickness direction. Conductive bumps as the connecting members on the electrodes of the semiconductor chip are connected with internal portions of the respective inner leads, the internal portions being positioned inward relative to the protruded portions. The external electrodes are formed on surfaces of the protruded portions, and tip ends of the external electrodes are protruded relative to a back face of the semiconductor chip.

摘要翻译： 树脂封装的半导体器件包括：在其表面上设置一组电极的半导体芯片; 沿着半导体芯片的周边布置的多个内引线; 用于将半导体芯片的电极与各个内部引线连接的连接构件，用于封装半导体芯片和连接构件的表面的封装树脂; 和从封装树脂露出的外部电极。 每个内引线从外周的内侧延伸到半导体芯片的周边，并且包括设置在内引线的相对于半导体芯片周边的外侧的表面上的突出部 突出部分沿厚度方向突出。 作为半导体芯片的电极上的连接构件的导电凸块与内部引线的内部部分连接，内部部分相对于突出部分位于内侧。 外部电极形成在突出部的表面上，外部电极的前端相对于半导体芯片的背面突出。

公开(公告)号：US20060092812A1

公开(公告)日：2006-05-04

申请号：US11253602

申请日：2005-10-20

申请人： Masaya Tateyanagi ,  Masanori Minamio ,  Shigeki Okamoto ,  Kiyoshi Fujihara

发明人： Masaya Tateyanagi ,  Masanori Minamio ,  Shigeki Okamoto ,  Kiyoshi Fujihara

IPC分类号： G11B7/00

CPC分类号： H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H05K1/147 ,  H05K1/189 ,  H01L2924/00014 ,  H01L2924/00

摘要： A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.

摘要翻译： 铜框架板（2）具有中央框架板（2a）和从中央框架板的两端弯曲的一对侧框架板（2c）。 柔性基板（3）具有覆盖中心框架​​板的中心基板（3a）和从中心基板弯曲的弯曲基板（3b），以覆盖侧框架板。 光学元件（4）安装在中央框架板上。 连接到光学元件的多个内部布线端子（9）设置在中心基板上并且沿着一对侧框板彼此相对的宽度方向（W）布置。 用于与外部设备连接的多个外部接线端子（11）设置在弯曲的基板上并且沿与宽度方向正交的长度方向（L）布置。

公开(公告)号：US06909168B2

公开(公告)日：2005-06-21

申请号：US10199109

申请日：2002-07-22

申请人： Masanori Minamio ,  Toru Nomura

发明人： Masanori Minamio ,  Toru Nomura

IPC分类号： H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01R9/00

CPC分类号： H01L23/3107 ,  H01L23/49503 ,  H01L23/49548 ,  H01L24/45 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32014 ,  H01L2224/32055 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01082 ,  H01L2924/181 ,  H01L2224/85 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A resin-encapsulation semiconductor device of this invention includes a die pad for mounting a semiconductor element; a plurality of supporting leads; a semiconductor element; a plurality of leads disposed to have tips thereof opposing the die pad; metal wires; and an encapsulation resin for encapsulating the die pad excluding a bottom thereof, the leads excluding bottoms and outside edges thereof, connecting regions with the metal wires, the supporting leads and the semiconductor element. The outside edges of the leads are disposed on substantially the same plane as the side face of the encapsulation resin, and the tip of each lead has a thin portion where the thickness is reduced in an upper face thereof.

摘要翻译： 本发明的树脂封装半导体器件包括用于安装半导体元件的管芯焊盘; 多个支撑引线; 半导体元件 多个引线，其设置成具有与所述管芯焊盘相对的尖端; 金属线; 以及用于封装除了底部之外的芯片焊盘的封装树脂，不包括底部和外部边缘的引线，与金属线，支撑引线和半导体元件的连接区域。 引线的外缘设置在与封装树脂的侧面基本相同的平面上，并且每个引线的尖端具有其上部厚度减小的薄部分。

公开(公告)号：US20050109926A1

公开(公告)日：2005-05-26

申请号：US10970533

申请日：2004-10-21

申请人： Masanori Minamio ,  Kouichi Yamauchi ,  Katsutoshi Shimizu

发明人： Masanori Minamio ,  Kouichi Yamauchi ,  Katsutoshi Shimizu

IPC分类号： H01L27/14 ,  H01L23/02 ,  H01L27/146 ,  H01L31/0203 ,  H04N5/335 ,  H01J40/14

CPC分类号： H01L27/14683 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： A solid-state imaging device includes a wiring board composed of an insulating resin, frame-shaped ribs arranged on the wiring board, a transparent plate arranged on an upper surface of the ribs, a plurality of wiring members that electrically lead from an internal space of a case formed by the wiring board and the ribs to the outside, an imaging element fixed on the wiring board within the internal space, and connecting members which connect electrodes of the imaging element and the wiring members. The ribs are formed by resin molding directly onto a face of the transparent plate, and a lower surface of the ribs is fixed to the wiring board with an adhesive. The package is configured without adhesive interposed between the ribs and the transparent sealing plate, thereby reducing the effect on incident light.

摘要翻译： 一种固态成像装置，包括由绝缘树脂构成的布线基板，配置在布线基板上的框状的肋，配置在肋的上表面的透明板，从内部空间 由布线板和肋构成的壳体的外部，固定在内部空间内的配线基板上的摄像元件和连接摄像元件的电极和配线构件的连接构件。 肋通过树脂成型直接形成在透明板的表面上，并且肋的下表面用粘合剂固定到布线板。 该封装被构造成没有粘合剂插入在肋和透明密封板之间，从而减少对入射光的影响。

公开(公告)号：US20050078207A1

公开(公告)日：2005-04-14

申请号：US10958500

申请日：2004-10-06

申请人： Masanori Minamio ,  Tetsushi Nishio ,  Kenji Tsuji

发明人： Masanori Minamio ,  Tetsushi Nishio ,  Kenji Tsuji

IPC分类号： G02B7/02 ,  G11B7/135 ,  G11B7/22 ,  H01L21/50 ,  H01L21/60 ,  H01L27/14 ,  H01L27/146 ,  H01L31/0203 ,  H01L31/18 ,  H04N5/225 ,  H04N5/335 ,  H05K1/18

CPC分类号： H01L27/14625 ,  H01L24/97 ,  H01L27/14618 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： A lead frame is buried in mold resin to form a mold structure. A wide blade is used to make an indentation having an alignment step in the mold structure. Then, a narrow blade is used to split the mold structure. At the outer perimeter portion of a base which is a separate part separated from the mold structure, an alignment step is formed. Due to the alignment step, an optical element, such as a mirror tube of an imaging optical system, or the like, is readily and quickly attached.

摘要翻译： 引线框架埋在模具树脂中以形成模具结构。 使用宽刀片来制造在模具结构中具有对准步骤的压痕。 然后，使用窄刀片分割模具结构。 在与模具结构分离的单独部分的基部的外周部分处，形成对准步骤。 由于对准步骤，容易且快速地附接诸如成像光学系统的镜管的光学元件等。