公开(公告)号：US07224105B2

公开(公告)日：2007-05-29

申请号：US10990435

申请日：2004-11-18

申请人： Keiji Onishi ,  Hiroyuki Nakamura ,  Hiroshi Nakatsuka

发明人： Keiji Onishi ,  Hiroyuki Nakamura ,  Hiroshi Nakatsuka

IPC分类号： H01L41/047

CPC分类号： H03H9/175 ,  H03H9/02094 ,  H03H9/02118 ,  H03H9/173 ,  H03H9/174 ,  H03H9/587 ,  H03H9/588 ,  H03H9/589

摘要： A piezoelectric element of the present invention includes a substrate, a lower electrode layer, a piezoelectric layer, an upper electrode layer, a cavity portion formed below a piezoelectric vibrating portion, and at least two bridging portions. The at least two bridging portions are formed so as not to be line-symmetric with respect to any line segment traversing the piezoelectric vibrating portion and/or so as not to be point-symmetric with respect to any point in the piezoelectric vibrating portion in a projection of the piezoelectric vibrating portion in the laminating direction.

摘要翻译： 本发明的压电元件包括​​基板，下电极层，压电层，上电极层，形成在压电振动部下方的空腔部，以及至少两个桥接部。 所述至少两个桥接部形成为相对于穿过所述压电振动部的任何线段并且/或者相对于所述压电振动部中的任何点而言不对称对称 压电振动部在层叠方向上的突出。

公开(公告)号：US07220617B2

公开(公告)日：2007-05-22

申请号：US11349219

申请日：2006-02-08

申请人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L21/44 ,  H01L21/48

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals. In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals being exposed. Mounting surfaces of the metal plate terminals and a third part of the metal cap are bonded to electrodes on a mounting board.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅电极和源电极，并且栅极电极和源极电极与金属板端子接合。 此外，半导体芯片被树脂密封体密封，金属板端子的安装表面露出。 金属板端子和金属盖的第三部分的安装表面与安装板上的电极接合。

公开(公告)号：US20070109073A1

公开(公告)日：2007-05-17

申请号：US11582425

申请日：2006-10-18

申请人： Takehiko Yamakawa ,  Hiroshi Yamaguchi ,  Hiroshi Nakatsuka ,  Hiroyuki Nakamura ,  Keiji Onishi ,  Toshio Ishizaki

发明人： Takehiko Yamakawa ,  Hiroshi Yamaguchi ,  Hiroshi Nakatsuka ,  Hiroyuki Nakamura ,  Keiji Onishi ,  Toshio Ishizaki

IPC分类号： H03H9/70 ,  H03H9/58

CPC分类号： H03H9/605 ,  H03H9/25 ,  H03H9/542 ,  H03H9/6483 ,  H03H9/6493

摘要： A series piezoelectric resonator 11 is connected in series between an input terminal 15a and an output terminal 15b. A first electrode of a parallel piezoelectric resonator 12a is connected to a connection point between the input terminal 15a and the series piezoelectric resonator 11, and a second electrode of the parallel piezoelectric resonator 12a is connected to a first terminal of an inductor 13a. A first electrode of a parallel piezoelectric resonator 12b is connected to a connection point between the series piezoelectric resonator 11 and the output terminal 15b, and a second electrode of the parallel piezoelectric resonator 12b is connected to a first terminal of an inductor 13b. Second terminals of the inductors 13a and 13b are grounded. An additional piezoelectric resonator 14 is connected between the second electrode of the parallel piezoelectric resonator 12a and the second electrode of the parallel piezoelectric resonator 12b.

摘要翻译： 串联压电谐振器11串联连接在输入端子15a和输出端子15b之间。 平行压电谐振器12a的第一电极连接到输入端子15a和串联压电谐振器11之间的连接点，并联压电谐振器的第二电极连接到电感器13的第一端子 一个。 平行压电谐振器12b的第一电极连接到串联压电谐振器11和输出端子15b之间的连接点，并联压电谐振器12b的第二电极连接到电感器13的第一端子 b。 电感器13a和13b的第二端接地。 并联压电谐振器12a的第二电极和并联压电谐振器12b的第二电极之间连接有一个附加的压电谐振器14。

公开(公告)号：US20070001781A1

公开(公告)日：2007-01-04

申请号：US11488148

申请日：2006-07-18

申请人： Hiroshi Nakatsuka ,  Keiji Onishi ,  Hiroyuki Nakamura ,  Takehiko Yamakawa ,  Hiroshi Yamaguchi

发明人： Hiroshi Nakatsuka ,  Keiji Onishi ,  Hiroyuki Nakamura ,  Takehiko Yamakawa ,  Hiroshi Yamaguchi

IPC分类号： H03H9/70 ,  H03H9/54

CPC分类号： H03H3/04 ,  H03H9/0211 ,  H03H9/173 ,  Y10T29/42

摘要： A piezoeletric resonator includes: a substrate; a lower electrode formed on or above the substrate; a piezoeletric body formed on or above the lower electrode; an upper electrode formed on or above the piezoeletric body; and a cavity under a vibrating portion formed by the lower electrode, the piezoeletric body, and the upper electrode. Where a resonant frequency of vibration with a thickness of the vibrating portion being a half of a wavelength is taken as fr, an average of ultrasonic velocity in a material forming the cavity is taken as Vc, and a value determined based on the resonant frequency fr and the average of ultrasonic velocity Vc is taken as λc (=Vc/fr), a depth of the cavity is set so as to be equal to or larger than n×λc/2−λc/8 and equal to or smaller than n×λc/2+λc/8.

摘要翻译： 压电谐振器包括：基板; 形成在基板上或上方的下电极; 形成在下电极上或上的压电体; 形成在压电体上或上的上电极; 以及由下电极，压电体和上电极形成的振动部下的空腔。 其中振动部分的厚度为波长的一半的振动的共振频率为fr，将形成空腔的材料中的超声速度的平均值作为Vc，并且基于谐振频率fr确定的值 超声波速度Vc的平均值为lambdac（= Vc / fr），空腔的深度设定为等于或大于n×lambdac / 2-lambdac / 8且等于或小于nxlambdac / 2 + lambdac / 8。

公开(公告)号：US20060220763A1

公开(公告)日：2006-10-05

申请号：US10552582

申请日：2005-03-31

申请人： Tomohiro Iwasaki ,  Hiroshi Nakatsuka ,  Keiji Onishi ,  Hiroyuki Nakamura

发明人： Tomohiro Iwasaki ,  Hiroshi Nakatsuka ,  Keiji Onishi ,  Hiroyuki Nakamura

IPC分类号： H03H9/00

CPC分类号： H03H9/175 ,  H03H9/02157

摘要： A thin film bulk acoustic resonator (507b) comprises a substrate (101b), an acoustic mirror layer (508b) provided on the substrate (101b), including a plurality of impedance layers (502b, 503b) alternatively having a high acoustic impedance and a low acoustic impedance, and a piezoelectric thin film vibrator (509b) provided on the acoustic mirror layer (508b), including a lower electrode (504b), a piezoelectric thin film (105b) and an upper electrode (506b). The sum of a thickness of the lower electrode (504b) and a thickness of the upper electrode (506b) is 5% or more and 60% or less of a whole thickness of the piezoelectric thin film vibrator (509b), and the thickness of the lower electrode (504b) is larger than the thickness of the upper electrode (506b).

摘要翻译： 薄膜体声波谐振器（507b）包括衬底（101b），设置在衬底（101b）上的声镜层（508b）），包括多个阻抗层（502b，503b），交替地具有 高声阻抗和低声阻抗，以及设置在声镜层（508b）上的压电薄膜振子（509b），包括下电极（504b），压电薄膜（105b）和 上电极（506b）。 下部电极（504b）的厚度与上部电极（506b）的厚度之和为压电薄膜振子（509b）的整体厚度的5％以上且60％以下， 下电极（504b）的厚度大于上电极（506b）的厚度。

公开(公告)号：US20060175700A1

公开(公告)日：2006-08-10

申请号：US11349219

申请日：2006-02-08

申请人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

发明人： Hidemasa Kagii ,  Akira Muto ,  Ichio Shimizu ,  Katsuo Arai ,  Hiroshi Sato ,  Hiroyuki Nakamura ,  Masahiko Osaka ,  Takuya Nakajo ,  Keiichi Okawa ,  Hiroi Oka

IPC分类号： H01L23/34

CPC分类号： H01L23/24 ,  H01L21/52 ,  H01L23/488 ,  H01L23/49562 ,  H01L24/36 ,  H01L24/40 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73253 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/00 ,  H01L2924/00014

摘要： A semiconductor chip is sealed by resin without covering an outer terminal of a semiconductor device having a power transistor. A semiconductor chip having a power transistor is housed within a recess of a metal cap while a drain electrode on a first surface of the semiconductor chip is bonded to a bottom of the recess via a connection material. A gate electrode and a source electrode are formed on a second surface opposite to the first surface of the semiconductor chip, and the gate electrode and the source electrode are bonded with metal plate terminals In addition, the semiconductor chip is sealed by a resin sealing body with mounting-surfaces of the metal plate terminals being exposed. Mounting surfaces of the metal plate terminals and a third part of the metal cap are bonded to electrodes on a mounting board.

摘要翻译： 半导体芯片由树脂密封而不覆盖具有功率晶体管的半导体器件的外部端子。 具有功率晶体管的半导体芯片容纳在金属盖的凹部内，而半导体芯片的第一表面上的漏电极经由连接材料接合到凹部的底部。 在与半导体芯片的第一表面相对的第二表面上形成栅极电极和源极电极，并且栅极电极和源极电极与金属板端子接合。此外，半导体芯片由树脂密封体 金属板端子的安装表面露出。 金属板端子和金属盖的第三部分的安装表面与安装板上的电极接合。

公开(公告)号：US07084718B2

公开(公告)日：2006-08-01

申请号：US10657944

申请日：2003-09-09

申请人： Hiroyuki Nakamura ,  Shun-Ichi Seki ,  Keiji Onishi

发明人： Hiroyuki Nakamura ,  Shun-Ichi Seki ,  Keiji Onishi

IPC分类号： H03H9/70 ,  H03H9/72 ,  H03H9/54 ,  H03H9/64

CPC分类号： H03H9/6409 ,  H03H9/02118 ,  H03H9/0542 ,  H03H9/0557 ,  H03H9/542 ,  H03H9/547 ,  H03H9/564 ,  H03H9/6483

摘要： A band elimination filter includes an input terminal and an output terminal. A capacitor is coupled between a first terminal connected to the input terminal and a second terminal connected to the output terminal. The first terminal is grounded only via a first grounding point. The second terminal is grounded only via a second grounding point. A first acoustic resonator is connected between the first terminal and the first grounding point and a second acoustic resonator is connected between the second terminal and the second grounding point.

摘要翻译： 带除滤波器包括输入端子和输出端子。 电容器耦合在连接到输入端子的第一端子和连接到输出端子的第二端子之间。 第一个端子仅通过第一个接地点接地。 第二个端子仅通过第二个接地点接地。 第一声​​谐振器连接在第一端子和第一接地点之间，第二声谐振器连接在第二端子和第二接地点之间。

公开(公告)号：US20060164184A1

公开(公告)日：2006-07-27

申请号：US11388297

申请日：2006-03-24

申请人： Hiroyuki Nakamura ,  Keiji Onishi ,  Takashi Inoue

发明人： Hiroyuki Nakamura ,  Keiji Onishi ,  Takashi Inoue

IPC分类号： H03H9/72 ,  H03H9/64

CPC分类号： H03H9/0038 ,  H03H9/0042 ,  H03H9/02574 ,  H03H9/02952

摘要： A surface acoustic wave filter including a piezoelectric substrate, IDT electrodes which are formed on the piezoelectric substrate and are connected to balanced type terminals. Further, IDT electrodes are formed on the piezoelectric substrate and are connected to an unbalanced type terminal, connection electrodes of connecting the IDT electrodes, the IDT electrodes IDT electrodes to the balanced type terminals or the unbalanced type terminal, and a dielectric thin film formed between the piezoelectric substrate and the IDT electrodes, the IDT electrodes, the connection electrodes.

摘要翻译： 一种表面声波滤波器，包括压电基片，形成在压电基片上并与平衡型端子连接的IDT电极。 此外，IDT电极形成在压电基板上，并且连接到不平衡型端子，将IDT电极，IDT电极IDT电极连接到平衡型端子或不平衡型端子的连接电极以及形成在 压电基板和IDT电极，IDT电极，连接电极。

公开(公告)号：US07055707B2

公开(公告)日：2006-06-06

申请号：US10432873

申请日：2002-10-30

申请人： Masashi Yoneyama ,  Hiroyuki Nakamura ,  Masato Seguchi ,  Takayuki Goto

发明人： Masashi Yoneyama ,  Hiroyuki Nakamura ,  Masato Seguchi ,  Takayuki Goto

IPC分类号： B65D23/02 ,  A47J41/02

CPC分类号： B65D83/0055 ,  B29B2911/1442 ,  B29B2911/1444 ,  B29C49/0073 ,  B29C49/04 ,  B29C49/22 ,  B29K2023/06 ,  B29K2023/083 ,  B29K2023/12 ,  B29K2067/00 ,  B29K2077/00 ,  B29K2995/0077 ,  B29L2009/001 ,  B29L2031/703 ,  B29L2031/7158 ,  B65D1/0215 ,  B65D83/0061 ,  Y10S215/902 ,  Y10S220/913

摘要： A blow-molded container includes an outer layer of a synthetic resin, which forms the outer shell of a finite shape; an inner layer of a flexible synthetic resin, which is peelably laminated with the outer layer and forms an inner bag; and a pair of adhered zones of a vertical strip type, which is formed axisymmetrically on the central axis of container to adhere and fix the outer layer and the inner layer over the entire height and is located so as to avoid the positions of air introduction ports that have been provided in the outer layer to introduce air into the void between the outer layer and the inner layer. A pair of adhered zones is disposed at positions opposite to each other and is separated by a parting line. The lower ends of both adhered zones are disposed at the partly or wholly end-to-end position facing each other on the bottom seal formed when the bottom portion is pressed flat with the pinch-off of a blow mold. Because of this end-to-end facing position of the lower ends, the bottom seal has a full mechanical strength. Thus, there is provided a container of the delaminated type capable of molding by means of an ordinary mold and having high manufacturing efficiency.

摘要翻译： 吹塑容器包括合成树脂的外层，其形成有限形状的外壳; 柔性合成树脂的内层，其与外层可剥离地层压并形成内袋; 以及一对垂直带状的粘合区域，其在容器的中心轴线上轴对称地形成，以将外层和内层粘附并固定在整个高度上，并且被定位成避免空气引入口的位置 其被设置在外层中以将空气引入外层和内层之间的空隙中。 一对粘附区域设置在彼此相对的位置处并且由分型线分开。 两个粘合区域的下端设置在底部密封件上形成的部分或全部端对端位置，当底部被吹塑模具夹紧时被压扁。 由于下端的这种端对端的位置，底部密封具有完全的机械强度。 因此，提供了能够通过普通模具成型并具有高制造效率的分层型容器。

公开(公告)号：US20060022773A1

公开(公告)日：2006-02-02

申请号：US11204185

申请日：2005-08-15

申请人： Tomohiro Iwasaki ,  Hiroyuki Nakamura ,  Toshio Ishizaki ,  Kazuhide Uriu

发明人： Tomohiro Iwasaki ,  Hiroyuki Nakamura ,  Toshio Ishizaki ,  Kazuhide Uriu

IPC分类号： H01P1/203

CPC分类号： H01P1/20345

摘要： A filter having an unbalanced terminal, a first stripline resonator of which one end is connected to the unbalanced terminal, a second stripline resonator placed to be electromagnetically coupled to the first stripline resonator, and balanced terminals of which both ends are connected to the second stripline resonator, wherein the first stripline resonator and the second stripline resonator are connected by at least one impedance element, and the second stripline resonator is a ½ wavelength resonator substantially having ½ the length of a wavelength of a resonance frequency.

摘要翻译： 具有不平衡端子的滤波器，其一端连接到不平衡端子的第一带状线谐振器，与第一带状线谐振器电磁耦合的第二带状线谐振器，其两端连接到第二带状线 谐振器，其中所述第一带状线谐振器和所述第二带状线谐振器通过至少一个阻抗元件连接，并且所述第二带状线谐振器是基本上具有谐振频率的波长长度的1/2的1/2波长谐振器。