公开(公告)号：US20140048233A1

公开(公告)日：2014-02-20

申请号：US14064331

申请日：2013-10-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: G06F1/20

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20130104383A1

公开(公告)日：2013-05-02

申请号：US13684753

申请日：2012-11-26

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20263 ,  H05K7/20709 ,  H05K7/20754 ,  H05K7/20763 ,  H05K7/20781 ,  H05K7/20836

Abstract: A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

Abstract translation: 提供了包括第一和第二电子机架的多机架组件。 第一电子机架包括设置在第一电子机架内的一个或多个冷却单元，其联接成与第一电子机架的主冷却剂回路流体连通，至少部分地将冷却的冷却剂提供给主冷却剂回路，并且促进 冷却一个或多个第一机架电子部件。 第二电子机架包括与布置在第一电子机架内的冷却单元流体连通的二次冷却剂回路。 多机架组件还包括控制器，用于将冷却的冷却剂自动地提供给二次冷却剂回路，并且其中控制器控制冷却的冷却剂从冷却单元到第二冷却剂回路的流动，这至少部分地取决于冷却 第一电子机架的要求。

公开(公告)号：US20130097862A1

公开(公告)日：2013-04-25

申请号：US13692235

申请日：2012-12-03

Applicant: International Business Machines Corporation ,  Kevin P. Radigan

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: F28F9/00

CPC classification number: F28F9/00 ,  F25B1/00 ,  H05K7/20772 ,  H05K7/2079 ,  Y10T29/4935

Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

Abstract translation: 提供了一种制造冷却单元的方法，以便冷却通过冷却剂回路的冷却剂。 冷却单元包括一个或多个散热单元和升高的冷却剂箱。 散热单元将通过冷却剂回路的冷却剂的热量排除通过散热单元的空气。 散热单元包括联接到冷却剂回路的一个或多个热交换组件，用于至少一部分冷却剂通过一个或多个热交换组件。 在冷却剂回路的至少一部分上方升高的升高的冷却剂箱与散热单元的一个或多个热交换组件流体连通地联接，并且便于冷却剂返回到冷却剂回路 基本恒定的压力。

公开(公告)号：US20130091706A1

公开(公告)日：2013-04-18

申请号：US13692177

申请日：2012-12-03

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20627 ,  H05K7/20772 ,  H05K7/20836

Abstract: A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).

Abstract translation: 提供了一种用于促进一个或多个电子机架的供电和冷却的方法。 该方法包括：提供帧; 将至少一个体积动力组件与所述框架相关联，所述至少一个体积动力组件被配置为向所述电子机架提供动力，其中具有相关联的一个或多个体积动力组件的所述框架不同于所述电子机架 s）; 以及将一个或多个热交换组件与所述框架相关联，所述热交换组件被配置为冷却提供给所述电子机架的系统冷却剂。 在操作中，热量由热交换器组件从系统冷却剂传送到设备冷却剂，并且具有相关联的主体动力组件和相关联的热交换组件的框架提供功率和冷却​​功能 电子机架。

公开(公告)号：US20130091693A1

公开(公告)日：2013-04-18

申请号：US13692196

申请日：2012-12-03

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

IPC: H01L23/373 ,  H01L23/367

CPC classification number: H05K7/20 ,  H01L23/367 ,  H01L23/373 ,  H01L23/3736 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2023/4087 ,  H01L2224/16 ,  Y10T29/49002 ,  Y10T29/4935 ,  Y10T29/49353

Abstract: A heat sink and method of fabrication are provided for removing heat from an electronic component(s). The heat sink includes a heat sink base and frame. The base has a first coefficient of thermal expansion (CTE), and includes a base surface configured to couple to the electronic component to facilitate removal of heat. The frame has a second CTE, and is configured to constrain the base surface in opposing relation to the electronic component, wherein the first CTE is greater than the second CTE. At least one of the heat sink base or frame is configured so that heating of the heat sink base results in a compressive force at the base surface of the heat sink base towards the electronic component that facilitates heat transfer from the electronic component. A thermal interface material is disposed between the base surface and the electronic component.

公开(公告)号：US20130081258A1

公开(公告)日：2013-04-04

申请号：US13684724

申请日：2012-11-26

Applicant: International Business Machines Corporation ,  Kevin P. Radigan

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS ,  Prabjit SINGH

IPC: H05K13/00

CPC classification number: H05K13/00 ,  F28D15/02 ,  F28D2021/0028 ,  H01L23/427 ,  H01L23/473 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K7/20236 ,  H05K7/203 ,  H05K7/20745 ,  H05K7/20772 ,  H05K7/20809 ,  Y10T29/49002 ,  Y10T29/49353 ,  H01L2924/00

Abstract: Cooling apparatuses, cooled electronic modules and methods of fabrication are provided for fluid immersion-cooling of an electronic component(s). The method includes, for instance: securing a housing about an electronic component to be cooled, the housing at least partially surrounding and forming a compartment about the electronic component to be cooled; disposing a fluid within the compartment, wherein the electronic component to be cooled is at least partially immersed within the fluid, and wherein the fluid comprises water; and providing a deionizing structure within the compartment, the deionizing structure comprising deionizing material, the deionizing material ensuring deionization of the fluid within the compartment, wherein the deionizing structure is configured to accommodate boiling of the fluid within the compartment.

Abstract translation: 提供冷却装置，冷却的电子模块和制造方法用于电子部件的流体浸没冷却。 该方法包括例如：将壳体围绕待冷却的电子部件固定，壳体至少部分围绕并围绕待冷却的电子部件形成隔室; 在所述隔室内设置流体，其中待冷却的所述电子部件至少部分地浸入所述流体内，并且其中所述流体包括水; 以及在所述隔间内提供去离子结构，所述去离子结构包括去离子材料，所述去离子材料确保所述隔室内的所述流体的去离子，其中所述去离子结构被构造成适应所述隔室内的流体的沸腾。

公开(公告)号：US20130077247A1

公开(公告)日：2013-03-28

申请号：US13676313

申请日：2012-11-14

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: H05K7/20818 ,  G06F1/20 ,  G06F2200/201 ,  H05K7/2029 ,  H05K7/20309 ,  H05K7/20318 ,  H05K7/20809

Abstract: A cooling apparatus and method are provided for cooling one or more electronic components of an electronic subsystem of an electronics rack. The cooling apparatus includes a heat sink, which is configured to couple to an electronic component, and which includes a coolant-carrying channel for coolant to flow therethrough. The coolant provides two-phase cooling to the electronic component, and is discharged from the heat sink as coolant exhaust which comprises coolant vapor to be condensed. The cooling apparatus further includes a node-level condensation module, associated with the electronic subsystem, and coupled in fluid communication with the heat sink to receive the coolant exhaust from the heat sink. The condensation module is liquid-cooled, and facilitates condensing of the coolant vapor in the coolant exhaust. A controller automatically controls the liquid-cooling of the heat sink and/or the liquid-cooling of the node-level condensation module.

公开(公告)号：US20130077246A1

公开(公告)日：2013-03-28

申请号：US13676242

申请日：2012-11-14

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H05K7/20

CPC classification number: B23P15/26 ,  F28D15/0266 ,  F28F3/00 ,  F28F3/12 ,  F28F13/00 ,  G06F1/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/2029 ,  H05K7/20772 ,  Y10T29/4935

Abstract: A heat sink, and cooled electronic structure and cooled electronics apparatus utilizing the heat sink are provided. The heat sink is fabricated of a thermally conductive structure which includes one or more coolant-carrying channels coupled to facilitate the flow of coolant through the coolant-carrying channel(s). The heat sink further includes a membrane associated with the coolant-carrying channel(s). The membrane includes at least one vapor-permeable region, which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s), and at least one orifice coupled to inject coolant onto at least one surface of the coolant-carrying channel(s) intermediate opposite ends of the channel(s).

公开(公告)号：US20130070420A1

公开(公告)日：2013-03-21

申请号：US13676227

申请日：2012-11-14

Applicant: International Business Machines Corporation

Inventor： Levi A. CAMPBELL ,  Richard C. CHU ,  Milnes P. DAVID ,  Michael J. ELLSWORTH, JR. ,  Madhusudan K. IYENGAR ,  Robert E. SIMONS

IPC: H02K7/20

CPC classification number: H05K7/20809 ,  H05K7/20309 ,  H05K7/20318 ,  Y10T29/4935 ,  Y10T29/49377 ,  Y10T29/49378

Abstract: A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

Abstract translation: 提供了一种用于促进从发热电子部件提取热量的方法。 该方法包括提供散热器，散热器包括具有一个或多个冷却剂传送通道和一个或多个蒸汽冷凝通道的导热结构。 一个薄膜设置在冷却剂输送通道和蒸汽冷凝通道之间。 膜包括至少一个透气区域，其至少一部分覆盖着一部分冷却剂输送通道，并且有助于将蒸气从冷却剂输送通道移除到蒸汽冷凝通道（ s）。 散热器还包括一个或多个冷却剂入口，所述冷却剂入口联接以向所述冷却剂输送通道提供第一液体冷却剂流，以及第二液体冷却剂流以冷凝所述蒸气冷凝通道内的蒸汽。

公开(公告)号：US20210120704A1

公开(公告)日：2021-04-22

申请号：US16654298

申请日：2019-10-16

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Dustin W. DEMETRIOU ,  Michael J. ELLSWORTH, JR. ,  Milnes P. DAVID ,  Prabjit SINGH

IPC: H05K7/20

Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.