MULTI-RACK ASSEMBLY METHOD WITH SHARED COOLING UNIT
    72.
    发明申请
    MULTI-RACK ASSEMBLY METHOD WITH SHARED COOLING UNIT 有权
    具有共享冷却单元的多机架组装方法

    公开(公告)号:US20130104383A1

    公开(公告)日:2013-05-02

    申请号:US13684753

    申请日:2012-11-26

    Abstract: A multi-rack assembly is provided which includes first and second electronics racks. The first electronics rack includes one or more cooling units disposed within the first electronics rack, which are coupled in fluid communication with a primary coolant loop of the first electronics rack to, at least in part, provide cooled coolant to the primary coolant loop and facilitate cooling one or more first rack electronic components. The second electronics rack includes a secondary coolant loop coupled in fluid communication with the cooling unit(s) disposed within the first electronics rack. The multi-rack assembly further includes a controller to automatically provide cooled coolant to the secondary coolant loop, and wherein the controller controls flow of cooled coolant from the cooling unit(s) to the secondary coolant loop depending, at least in part, on cooling requirements of the first electronics rack.

    Abstract translation: 提供了包括第一和第二电子机架的多机架组件。 第一电子机架包括设置在第一电子机架内的一个或多个冷却单元,其联接成与第一电子机架的主冷却剂回路流体连通,至少部分地将冷却的冷却剂提供给主冷却剂回路,并且促进 冷却一个或多个第一机架电子部件。 第二电子机架包括与布置在第一电子机架内的冷却单元流体连通的二次冷却剂回路。 多机架组件还包括控制器,用于将冷却的冷却剂自动地提供给二次冷却剂回路,并且其中控制器控制冷却的冷却剂从冷却单元到第二冷却剂回路的流动,这至少部分地取决于冷却 第一电子机架的要求。

    DRY-COOLING UNIT WITH GRAVITY-ASSISTED COOLANT FLOW
    73.
    发明申请
    DRY-COOLING UNIT WITH GRAVITY-ASSISTED COOLANT FLOW 有权
    干燥冷却单元,具有辅助冷却剂流

    公开(公告)号:US20130097862A1

    公开(公告)日:2013-04-25

    申请号:US13692235

    申请日:2012-12-03

    CPC classification number: F28F9/00 F25B1/00 H05K7/20772 H05K7/2079 Y10T29/4935

    Abstract: A method of fabricating a cooling unit is provided to facilitate cooling coolant passing through a coolant loop. The cooling unit includes one or more heat rejection units and an elevated coolant tank. The heat rejection unit(s) rejects heat from coolant passing through the coolant loop to air passing across the heat rejection unit. The heat rejection unit(s) includes one or more heat exchange assemblies coupled to the coolant loop for at least a portion of coolant to pass through the one or more heat exchange assemblies. The elevated coolant tank, which is elevated above at least a portion of the coolant loop, is coupled in fluid communication with the one or more heat exchange assemblies of the heat rejection unit(s), and facilitates return of coolant to the coolant loop at a substantially constant pressure.

    Abstract translation: 提供了一种制造冷却单元的方法,以便冷却通过冷却剂回路的冷却剂。 冷却单元包括一个或多个散热单元和升高的冷却剂箱。 散热单元将通过冷却剂回路的冷却剂的热量排除通过散热单元的空气。 散热单元包括联接到冷却剂回路的一个或多个热交换组件,用于至少一部分冷却剂通过一个或多个热交换组件。 在冷却剂回路的至少一部分上方升高的升高的冷却剂箱与散热单元的一个或多个热交换组件流体连通地联接,并且便于冷却剂返回到冷却剂回路 基本恒定的压力。

    COMBINED POWER AND COOLING RACK SUPPORTING AN ELECTRONICS RACK(S)
    74.
    发明申请
    COMBINED POWER AND COOLING RACK SUPPORTING AN ELECTRONICS RACK(S) 有权
    组合电源和冷却架支持电子机架

    公开(公告)号:US20130091706A1

    公开(公告)日:2013-04-18

    申请号:US13692177

    申请日:2012-12-03

    CPC classification number: H05K7/20627 H05K7/20772 H05K7/20836

    Abstract: A method is provided for facilitating powering and cooling of one or more electronics racks. The method includes: providing a frame; associating at least one bulk power assembly with the frame, the at least one bulk power assembly being configured to provide power to the electronics rack(s), wherein the frame with the associated one or more bulk power assemblies is distinct from the electronics rack(s); and associating one or more heat exchange assemblies with the frame, the heat exchange assembly(ies) being configured to cool system coolant provided to the electronics rack(s). In operation, heat is transferred by the heat exchange assembly(ies) from the system coolant to a facility coolant, and the frame with the associated bulk power assembly(ies) and associated heat exchange assembly(ies) provides both power and cooling to the electronics rack(s).

    Abstract translation: 提供了一种用于促进一个或多个电子机架的供电和冷却的方法。 该方法包括:提供帧; 将至少一个体积动力组件与所述框架相关联,所述至少一个体积动力组件被配置为向所述电子机架提供动力,其中具有相关联的一个或多个体积动力组件的所述框架不同于所述电子机架 s); 以及将一个或多个热交换组件与所述框架相关联,所述热交换组件被配置为冷却提供给所述电子机架的系统冷却剂。 在操作中,热量由热交换器组件从系统冷却剂传送到设备冷却剂,并且具有相关联的主体动力组件和相关联的热交换组件的框架提供功率和冷却​​功能 电子机架。

    FLOW BOILING HEAT SINK WITH VAPOR VENTING AND CONDENSING
    79.
    发明申请
    FLOW BOILING HEAT SINK WITH VAPOR VENTING AND CONDENSING 有权
    流动锅炉加热蒸汽透气和冷凝

    公开(公告)号:US20130070420A1

    公开(公告)日:2013-03-21

    申请号:US13676227

    申请日:2012-11-14

    Abstract: A method is provided for facilitating extraction of heat from a heat-generating electronic component. The method includes providing a heat sink, the heat sink including a thermally conductive structure which has one or more coolant-carrying channels and one or more vapor-condensing channels. A membrane is disposed between the coolant-carrying channel(s) and the vapor-condensing channel(s). The membrane includes at least one vapor-permeable region, at least a portion of which overlies a portion of the coolant-carrying channel(s) and facilitates removal of vapor from the coolant-carrying channel(s) to the vapor-condensing channel(s). The heat sink further includes one or more coolant inlets coupled to provide a first liquid coolant flow to the coolant-carrying channel(s), and a second liquid coolant flow to condense vapor within the vapor-condensing channel(s).

    Abstract translation: 提供了一种用于促进从发热电子部件提取热量的方法。 该方法包括提供散热器,散热器包括具有一个或多个冷却剂传送通道和一个或多个蒸汽冷凝通道的导热结构。 一个薄膜设置在冷却剂输送通道和蒸汽冷凝通道之间。 膜包括至少一个透气区域,其至少一部分覆盖着一部分冷却剂输送通道,并且有助于将蒸气从冷却剂输送通道移除到蒸汽冷凝通道( s)。 散热器还包括一个或多个冷却剂入口,所述冷却剂入口联接以向所述冷却剂输送通道提供第一液体冷却剂流,以及第二液体冷却剂流以冷凝所述蒸气冷凝通道内的蒸汽。

    MULTI-COOLANT HEAT EXCHANGER FOR AN ELECTRONICS RACK

    公开(公告)号:US20210120704A1

    公开(公告)日:2021-04-22

    申请号:US16654298

    申请日:2019-10-16

    Abstract: An air-to-coolant heat exchanger for an electronics rack is provided, which includes first and second tube segments, one or more connector segments, and a plurality of thermally conductive fins attached to the tube segments. The first tube segment includes a first inner tube positioned within a first outer tube, defining a first inner coolant-carrying channel and first outer coolant-carrying channel, and the second tube segment has a second inner tube positioned within a second outer tube, defining a second inner coolant-carrying channel and second outer coolant-carrying channel. The connector segment(s) couples in fluid communication at least one of the first and second inner coolant-carrying channels, or the first and second outer coolant-carrying channels. The heat exchanger is coupled to separately receive a first coolant and a second coolant, with the first coolant passing through the inner channels, and the second coolant through the outer channels.

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