摘要:
Transistor bodies of semiconductor material located at a main surface of a semiconductor substrate between shallow trench isolations are provided with a rounded or curved upper surface. A floating gate electrode is arranged above said upper surface and electrically insulated from the semiconductor material by a tunnel dielectric having essentially the same tiny thickness throughout a primary tunnel area encompassing the area of curvature. The floating gate electrode may bridge the transistor body and is covered with a coupling dielectric provided for a control gate electrode, which forms part of a wordline.
摘要:
The present invention relates to a flash memory cell comprising a silicon substrate having an active region comprising a channel region and source-/drain-regions, the active region comprising a projecting portion, which projecting portion at least comprising said channel region; a tunneling dielectric layer formed on the surface of said active region; a floating gate formed on the surface of said tunneling dielectric layer for storing electric charges; an inter-gates coupling dielectric layer formed on the surface of said floating gate, and a control gate formed on the surface of said inter-gates coupling dielectric layer, wherein said floating gate is formed to have a groove-like shape for at least partly encompassing said projecting portion of said active region. This invention further relates to a flash memory device comprising such flash memory cells, as well as a manufacturing method thereof.
摘要:
A memory layer intended for trapping charge carriers over a source region and a drain region is interrupted over the channel so that a diffusion of the charge carriers, which are trapped over the source region and over the drain region, is prevented. The memory layer is limited to regions over the parts of the source region and of the drain region facing the channel and is embedded all around in oxide.
摘要:
In a memory cell array comprising charge-trapping memory cells, local interconnects along the direction of the wordlines for connecting source/drain regions of adjacent memory cells to bitlines are formed by selective deposition of silicon or polysilicon bridges at sidewalls of the semiconductor material within upper recesses in the dielectric material of shallow trench isolations running across the wordlines.
摘要:
In the method, trenches are etched and, in between, bit lines (8) are in each case arranged on doped source/drain regions (3, 4). Storage layers (5, 6, 7) are applied and gate electrodes (2) are arranged at the trench walls. After the introduction of polysilicon, which is provided for the gate electrodes (2), into the trenches, the top side is ground back in a planarizing manner until the top side of the covering layer (16) is reached, and afterward a polysilicon layer (18), which is provided for the word lines, is applied over the whole area and patterned to form the word lines.
摘要:
An electrically conductive bit line layer is applied and patterned into portions arranged parallel to one another before the trench is etched into the semiconductor material, in which case, after the patterning of the bit line layer (3, 4) and before the etching of the trench, an implantation is introduced for the purpose of defining the position of the junctions, or, after the implantation of the n+-type well (19) for the source/drain regions, the bit line layer (3, 4) is patterned using an etching stop layer (2) arranged on the semiconductor body (1).
摘要翻译:在沟槽被蚀刻到半导体材料之前,将导电位线层施加并图案化成彼此平行布置的部分,在这种情况下,在位线层(3,4)的图案化之后并且在蚀刻 引入注入用于限定结的位置,或者在用于源极/漏极区的n + H +型阱(19)的注入之后,位线层 (3,4)使用布置在半导体本体(1)上的蚀刻停止层(2)进行图案化。
摘要:
An integrated memory circuit of the type of an NROM memory includes recessed bit lines formed of a material having a low ohmic resistance. By recessing the bit lines with respect to the semiconductor substrate surface of a peripheral controlling circuit for an array of memory cells allows to form the word line lithography on a perfect or almost perfect plane so that the word line formation results in a production with higher yield and, therefore, lower costs for the individual integrated memory circuit.
摘要:
Memory cell transistors with back-channel isolation are produced without using an SOI substrate. With the word line stack acting as a mask, the semiconductor material is etched on both sides of the world line, first anisotropically and then isotropically to widen the etch hole and form an undercut beneath the gate electrode and at a distance from the ONO storage layer forming the gate dielectric. The undercut is filled, whereby a buried oxide layer of at least 20 nm maximum thickness is formed underneath the channel region. The latter is p-doped at a density of at least 1017 cm−3.
摘要翻译:在不使用SOI衬底的情况下制造具有背沟道隔离的存储单元晶体管。 利用字线叠层作为掩模,半导体材料在世界线的两侧蚀刻,首先各向异性地,然后各向同性地加宽蚀刻孔,并在栅电极下方并在与ONO存储层一定距离处形成底切 形成栅极电介质。 填充底切,由此在通道区域的下方形成最大厚度为至少20nm的掩埋氧化物层。 后者以至少10 17 cm -3的密度进行p掺杂。
摘要:
A memory layer intended for trapping charge carriers over a source region and a drain region is interrupted over the channel so that a diffusion of the charge carriers, which are trapped over the source region and over the drain region, is prevented. The memory layer is limited to regions over the parts of the source region and of the drain region facing the channel and is embedded all around in oxide.
摘要:
A memory-cell array includes a substrate forming parallel first and second trenches. A transistor's upper source/drain region adjoins two of the first and two of the second trenches, and lies above its lower source/drain region. A conductive structure in a first trench associated with the transistor adjoins the upper source/drain region at its first edge. An insulating structure in the associated first trench insulates the conductive structure from a second edge and from a bottom of the associated first trench. A word line, on which is a further insulating layer, is over the upper/source drain region and parallel to the associated first trench bulges into the second trenches. Insulating spaces adjoin the word line laterally. A contact on the conductive structure and in electrical communication with the upper source/drain region connects with a capacitor.