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    Multilayer ceramic structure
    71.
    发明授权
    Multilayer ceramic structure 有权

    公开(公告)号：US10410794B2

    公开(公告)日：2019-09-10

    申请号：US15642643

    申请日：2017-07-06

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude

    IPC: H01G4/33 ,  H01G4/012 ,  H01G4/248 ,  H01G4/002 ,  H01G4/008 ,  H01G4/12 ,  H01G4/005 ,  H01G4/30 ,  H01G4/232

    Abstract: An improved multilayer ceramic capacitor is described. The multilayered ceramic capacitor comprises first internal electrodes and second internal electrodes. The first internal electrodes and said second internal electrodes are parallel with dielectric there between. A first external termination is in electrical connection with the first internal electrodes and a second external termination is in electrical contact with the second internal electrodes. A closed void layer, comprising at least one closed void, is between electrodes.

    High Density Multi-Component Packages
    73.
    发明申请
    High Density Multi-Component Packages 审中-公开

    公开(公告)号：US20190080982A1

    公开(公告)日：2019-03-14

    申请号：US15804515

    申请日：2017-11-06

    Applicant: KEMET Electronics Corporation

    Inventor： John Bultitude ,  Galen Miller ,  John E. McConnell

    IPC: H01L23/40 ,  H01L25/065 ,  H01L25/00 ,  H01L23/538

    Abstract: Provided is a high density multi-component package and a method of manufacturing a high density multi-component package. The high density multi-component package comprises at least two electronic components wherein each electronic component of the electronic components comprise a first external termination and a second external termination. At least one interposer is between the adjacent electronic components and attached to the interposer by an interconnect wherein the interposer is selected from an active interposer and a mechanical interposer. Adjacent electronic components are connected serially.

    Higher density multi-component and serial packages
    74.
    发明授权
    Higher density multi-component and serial packages 有权

    公开(公告)号：US10178770B1

    公开(公告)日：2019-01-08

    申请号：US15852799

    申请日：2017-12-22

    Applicant: KEMET Electronics Corporation

    Inventor： James A Burk ,  John Bultitude ,  Galen Miller

    IPC: H05K1/18 ,  H01G4/30 ,  H03H7/01 ,  H05K1/02 ,  H05K3/30 ,  H01G4/228

    Abstract: A high density multi-component package is provided. The package has at least two electronic components wherein each electronic component comprises a first external termination and a second external termination. At least one first adhesive is between adjacent first external terminations of adjacent electronic components. At least one second adhesive is between the adjacent electronic component and at least two adjacent electronic components are connected serially. The first adhesive and second adhesive are independently selected from a high temperature conductive adhesive and a high temperature insulating adhesive.

    Very large ceramic capacitor with mechanical shock resistance
    76.
    发明授权
    Very large ceramic capacitor with mechanical shock resistance 有权
    超大型陶瓷电容器具有机械冲击强度

    公开(公告)号：US09025311B1

    公开(公告)日：2015-05-05

    申请号：US13868660

    申请日：2013-04-23

    Applicant: Kemet Electronics Corporation

    Inventor： John Bultitude ,  John E. McConnell ,  Abhijit Gurav

    IPC: H01G4/38 ,  H01G4/40

    CPC classification number: H01G4/38 ,  H01G2/065 ,  H01G4/228 ,  H01G4/30 ,  H05K1/189 ,  H05K2201/0397 ,  H05K2201/051 ,  H05K2201/055 ,  H05K2201/10015

    Abstract: An improved high capacitance module for multi-layer ceramic capacitors is described. The module contains a flexible substrate comprising at least one first conductive trace and at least one second conductive trace. A first termination trace is in electrical connection with each first trace and a second termination trace is in electrical connection with each second trace. Each capacitor comprises interleaved conductors wherein alternate conductors are terminated to a first external termination and adjacent conductors are terminated to a second external termination. Each capacitor is mounted on the substrate with the first termination in electrical contact with the first trace and the second termination in electrical contact with the second trace. A housing with the substrate is received in the housing. A first lead tab is in electrical contact with the first termination wherein the first lead tab extends from the housing.

    Abstract translation: 描述了一种用于多层陶瓷电容器的改进的高电容模块。 该模块包含柔性基板，该基板包括至少一个第一导电迹线和至少一个第二导电迹线。 第一终止迹线与每个第一迹线电连接，并且第二终止迹线与每个第二迹线电连接。 每个电容器包括交错的导体，其中交替的导体端接到第一外部端子，并且相邻的导体终止于第二外部端接。 每个电容器安装在基板上，其中第一端子与第一迹线电接触，而第二端接件与第二迹线电接触。 具有基板的壳体被容纳在壳体中。 第一引线片与第一端接电接触，其中第一引线片从壳体延伸。

    Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials
    77.
    发明申请
    Sintering of High Temperature Conductive and Resistive Pastes onto Temperature Sensitive and Atmospheric Sensitive Materials 审中-公开
    将高温导电和电阻浆料烧结到温度敏感和大气敏感材料上

    公开(公告)号：US20140139971A1

    公开(公告)日：2014-05-22

    申请号：US14166259

    申请日：2014-01-28

    Applicant: Kemet Electronics Corporation

    Inventor： John E. McConnell ,  John Bultitude ,  Abhijit Gurav

    IPC: H01G4/30 ,  B05D3/06

    CPC classification number: H01G4/30 ,  B05D3/06 ,  H01G4/1227 ,  H01G13/02 ,  H01G13/06 ,  Y10T29/43

    Abstract: An method of forming a metal foil coated ceramic and a metal foil capacitor is provided in a method of making a metal foil coated ceramic comprising providing a metal foil; applying a ceramic precursor to the metal foil wherein the ceramic precursor comprises at least one susceptor and a high dielectric constant oxide and an organic binder, and sintering the ceramic precursor with a high intensity, high pulse frequency light energy to form the metal foil ceramic.

    Abstract translation: 在制造金属箔涂覆的陶瓷的方法中提供形成金属箔涂覆的陶瓷和金属箔电容器的方法，其包括提供金属箔; 将陶瓷前体施加到金属箔上，其中陶瓷前体包括至少一个基体和高介电常数氧化物和有机粘合剂，并且以高强度，高脉冲频率的光能烧结陶瓷前体以形成金属箔陶瓷。

    Asymmetric High Voltage Capacitor
    79.
    发明申请
    Asymmetric High Voltage Capacitor 有权
    非对称高压电容器

    公开(公告)号：US20130250473A1

    公开(公告)日：2013-09-26

    申请号：US13849806

    申请日：2013-03-25

    Applicant: KEMET ELECTRONICS CORPORATION

    Inventor： John Bultitude ,  Lonnie G. Jones ,  James R. Magee ,  Kitae Park

    IPC: H01G4/30

    CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/232 ,  Y10T29/435

    Abstract: An improved multi-layered ceramic capacitor, and method of making the multi-layered ceramic capacitor, is described. The capacitor has an active area comprising first layers and second layers in alternating parallel arrangement with dielectric there between. The first layer comprises a first active electrode and a first floating electrode in a common plane and the second layer comprises a second active electrode and a second floating electrode in a second common plane. At least one shield layer is adjacent to an outermost first layer of the first layers wherein the shield layer has a first projection and the first layers have a second projection wherein the first projection and the second projection are different.

    Abstract translation: 描述了改进的多层陶瓷电容器以及制造多层陶瓷电容器的方法。 电容器具有包括第一层和第二层的有源区域，其间以电介质交替并行布置。 第一层包括公共平面中的第一有源电极和第一浮动电极，第二层包括第二共用平面中的第二有源电极和第二浮动电极。 至少一个屏蔽层与第一层的最外面的第一层相邻，其中屏蔽层具有第一突起，并且第一层具有第二突起，其中第一突起和第二突起不同。

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