公开(公告)号：US20070137025A1

公开(公告)日：2007-06-21

申请号：US11359427

申请日：2006-02-23

申请人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

发明人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

IPC分类号： B23K1/06

CPC分类号： H05K3/361 ,  G11B5/4846 ,  H05K3/328 ,  H05K2201/0397 ,  H05K2201/10765 ,  H05K2203/0285 ,  Y10T29/49027 ,  Y10T29/4903

摘要： The method of bonding flying leads is capable of efficiently supersonic-bonding the flying leads to pads of a board and improving bonding reliability therebetween. The method comprises the steps of: positioning the flying leads to correspond to the pads arranged parallel; and applying supersonic vibrations to a bonding tool so as to respectively bond the flying leads to the pads. And widths of the flying leads are wider than those of the pads, and supersonic vibrations are applied to the bonding tool, which is pressing the flying leads onto the pads, so that the flying leads are respectively supersonic-bonded to the pads.

摘要翻译： 接合飞线的方法能够有效地使飞线与板的焊盘超音速粘接，并提高其间的接合可靠性。 该方法包括以下步骤：将飞行引线对准于平行布置的焊盘; 以及将超音速振动施加到接合工具，以将所述飞行引线分别连接到所述焊盘。 并且飞行引线的宽度比焊盘的宽度宽，并且超音速振动被施加到将飞行引线压在焊盘上的焊接工具，使得飞行引线分别超音速粘合到焊盘。

公开(公告)号：US20060012921A1

公开(公告)日：2006-01-19

申请号：US10990139

申请日：2004-11-16

申请人： Takashi Kubota ,  Kenji Kobae

发明人： Takashi Kubota ,  Kenji Kobae

IPC分类号： G11B5/48 ,  G11B21/16 ,  G11B5/55 ,  G11B21/08

CPC分类号： H05K3/361 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0058 ,  H05K3/328 ,  H05K3/386 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/0285

摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.

摘要翻译： 构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题 飞行引线被拔出不会发生接合端子。 柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行 引线被压在接合端子上。 另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动 接合端子。

公开(公告)号：US20110278056A1

公开(公告)日：2011-11-17

申请号：US13083815

申请日：2011-04-11

申请人： Shuichi TAKEUCHI ,  Kenji Kobae ,  Tetsuya Takahashi

发明人： Shuichi TAKEUCHI ,  Kenji Kobae ,  Tetsuya Takahashi

IPC分类号： H05K1/09 ,  H05K3/30 ,  B23K1/20

CPC分类号： H01L23/49816 ,  H01L21/4853 ,  H01L23/562 ,  H01L2224/141 ,  H01L2224/16225 ,  H01L2224/1703 ,  H05K3/3436 ,  Y10T29/4913 ,  Y10T29/53174

摘要： A manufacturing method of a printed circuit board unit is provided. A portion of bumps which is arranged on an electronic component is pressed to lower heights of the portion of bumps as compared to other bumps.

摘要翻译： 提供一种印刷电路板单元的制造方法。 与其他凸块相比，布置在电子部件上的凸块的一部分被按压到凸起部分的较低高度。

公开(公告)号：US20100327043A1

公开(公告)日：2010-12-30

申请号：US12818554

申请日：2010-06-18

申请人： Kimio NAKAMURA ,  Yoshiyuki Satoh ,  Kenji Kobae

发明人： Kimio NAKAMURA ,  Yoshiyuki Satoh ,  Kenji Kobae

IPC分类号： B23K37/00

CPC分类号： H01L24/97 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.

摘要翻译： 压接装置包括支撑台和按压工具。 按压工具包括加压台，弹性件和多个接合头。 弹性部件由压制台保持。 多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

公开(公告)号：US07385788B2

公开(公告)日：2008-06-10

申请号：US10990139

申请日：2004-11-16

申请人： Takashi Kubota ,  Kenji Kobae

发明人： Takashi Kubota ,  Kenji Kobae

IPC分类号： G11B21/21 ,  G11B5/48

CPC分类号： H05K3/361 ,  G11B5/4833 ,  G11B5/484 ,  G11B5/4846 ,  G11B5/486 ,  H05K1/056 ,  H05K3/0058 ,  H05K3/328 ,  H05K3/386 ,  H05K2201/0969 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/0285

摘要： A carriage assembly of a hard disk drive is constructed so that the bonding of flying leads of a long tail suspension circuit board and bonding terminals of a flexible printed circuit board can be carried out uniformly and reliably, and the problem of the flying leads breaking when the flying leads are pulled off the bonding terminals does not occur. The flexible printed circuit board is attached to a reinforced part by an adhesive in which spacers with a substantially equal particle diameter are mixed, and the flying leads and the bonding terminals are bonded together by ultrasonic bonding by applying ultrasonic vibration in a state where the flying leads are pressed onto the bonding terminals. In addition, an insulating film is provided on an opposite surface of the flying leads to the surface bonded to the bonding terminals, and during the ultrasonic bonding, ultrasonic vibration is applied in a state where the flying leads are pressed via the insulating film onto the bonding terminals.

摘要翻译： 构造硬盘驱动器的托架组件，使得长尾悬挂电路板的飞行引线和柔性印刷电路板的接合端子的接合能够均匀可靠地进行，并且飞行的问题导致断开的问题 飞行引线被拔出不会发生接合端子。 柔性印刷电路板通过粘合剂附着到增强部分，其中混合具有基本相同粒径的间隔物，并且飞行引线和接合端子通过超声波接合通过在飞行 引线被压在接合端子上。 另外，在与引导接合端子接合的表面的飞线的相对面上设置绝缘膜，在超声波接合期间，通过绝缘膜将飞行引线按压的状态下，施加超声波振动 接合端子。

公开(公告)号：US07367108B2

公开(公告)日：2008-05-06

申请号：US11391362

申请日：2006-03-29

申请人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

发明人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/32 ,  H05K3/26 ,  H05K3/328 ,  Y10T29/49027 ,  Y10T29/4903

摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which (at least one contact member) a plurality of contact members that contact(s) the flying leads and apply (applies) the ultrasonic vibration thereto are (is) rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the plurality of contact members (at least one contact member) rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the plurality of contact members (at least one contact member) to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.

摘要翻译： 结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。 飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。 使用接合工具进行接合，其中（至少一个接触构件）多个接触飞行引线并且施加（施加）超声波振动的接触构件被可旋转地支撑。 接合工具沿与多个接触构件（至少一个接触构件）平行布置的飞行导线与飞行导线接触的方向移动，并且从多个接触构件 对飞行的接触构件（至少一个接触构件）导致将相应的飞行引线超声波地结合到衬底焊盘。

公开(公告)号：US07134588B2

公开(公告)日：2006-11-14

申请号：US11019623

申请日：2004-12-23

申请人： Kenji Kobae ,  Takashi Kubota

发明人： Kenji Kobae ,  Takashi Kubota

IPC分类号： B23K1/06 ,  B23K5/20 ,  B32B37/00

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K20/106 ,  B23K2101/42 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/0401

摘要： Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.

公开(公告)号：US20060012920A1

公开(公告)日：2006-01-19

申请号：US10997005

申请日：2004-11-24

申请人： Kenji Kobae ,  Takashi Kubota

发明人： Kenji Kobae ,  Takashi Kubota

IPC分类号： G11B5/48

CPC分类号： G11B5/486 ,  G11B5/4833 ,  G11B5/4846 ,  H05K1/056 ,  H05K3/363 ,  H05K2201/0394 ,  H05K2201/0969 ,  H05K2203/0285 ,  Y10T29/49025 ,  Y10T29/49027 ,  Y10T29/4903

摘要： A carriage assembly of a hard disk drive, and a manufacturing apparatus for the same are not susceptible to problems such as flying leads breaking and resin residue being deposited on bonding terminals when the flying leads of a long tail suspension circuit board are pulled off the bonding terminals of a flexible printed circuit board. The flying leads of the long tail suspension circuit board and the bonding terminals of the flexible printed circuit board are ultrasonically bonded together by placing an ultrasonic tool in contact with opposite surfaces of the flying leads to the surfaces that are bonded to the bonding terminals and applying ultrasonic vibration from the ultrasonic tool in a state where the flying leads are pressed onto the bonding terminals. Coating layers composed of a thermally meltable metal that melts at a lower temperature than the material forming the bonding surfaces are respectively formed on the opposite surfaces of the flying leads.

摘要翻译： 硬盘驱动器的托架组件及其制造装置不容易受到长尾悬挂电路板的飞行引线从接合处脱离而导致断线和树脂残留物沉积在接合端子上的问题 柔性印刷电路板的端子。 将长尾悬挂电路板的飞线和柔性印刷电路板的接合端子超声波接合在一起，将超声波工具与飞行引线的相对表面接触到与接合端子接合的表面并施加 超声波振动来自超声波工具，其中飞行引线被压在接合端子上。 由在比形成接合面的材料低的温度下熔化的可热熔融金属组成的涂层分别形成在飞线的相对表面上。

公开(公告)号：US08517277B2

公开(公告)日：2013-08-27

申请号：US12503112

申请日：2009-07-15

申请人： Kenji Kobae

发明人： Kenji Kobae

IPC分类号： G06K7/00

CPC分类号： H01Q1/2225 ,  G06K19/07749 ,  G06K19/0775

摘要： A radio frequency identification tag includes a substrate, and an antenna pattern disposed on an outer peripheral side surface of the substrate. An electronic device is electrically connected to the antenna pattern, and is mounted on the outer peripheral side surface of the substrate.

摘要翻译： 射频识别标签包括衬底和布置在衬底的外周侧表面上的天线图案。 电子设备电连接到天线图案，并且安装在基板的外周侧表面上。

公开(公告)号：US08395904B2

公开(公告)日：2013-03-12

申请号：US12821938

申请日：2010-06-23

申请人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

发明人： Takayoshi Matsumura ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC分类号： H05K7/00

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

摘要翻译： 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。