Process for forming electrically programmable read-only memory cell with
a merged select/control gate
    71.
    发明授权
    Process for forming electrically programmable read-only memory cell with a merged select/control gate 失效
    用于形成具有合并的选择/控制门的电可编程只读存储器单元的处理

    公开(公告)号:US5429969A

    公开(公告)日:1995-07-04

    申请号:US251162

    申请日:1994-05-31

    申请人: Kuo-Tung Chang

    发明人: Kuo-Tung Chang

    摘要: Flash EEPROM cells having merged select/control gates may be formed, so that the portions of the channel regions that correspond to select transistors are formed after spacers are formed but prior to patterning a merged select/control gate layer. Because the portions of the channel regions that correspond to the select transistors are not determined by the patterning of the merged select/control gate layer, misalignment of the mask used to pattern the merged select/control gate layer does not affect the size of the select transistor portion of the channel region. The spacers may be left on over the substrate in the finished devices thereby saving at least one processing step. The memory structure may also be used in other EPROM-type memory cells, such as individually erasable EEPROMs and EPROMs that are not electrically erasable.

    摘要翻译: 可以形成具有合并的选择/控制栅极的闪速EEPROM单元,使得对应于选择晶体管的沟道区域的部分在形成间隔物之后但在构图合并的选择/控制栅极层之前形成。 由于与选择晶体管相对应的沟道区域的部分不是通过合并选择/控制栅极层的构图来确定的,所以用于对合并的选择/控制栅极层进行图案化的掩模的未对准不会影响选择 晶体管部分。 间隔物可以留在成品装置中的衬底上,从而节省至少一个处理步骤。 存储器结构也可以用于其它EPROM型存储单元,例如不可电擦除的单独可擦除EEPROM和EPROM。

    EEPROM memory device having a sidewall spacer floating gate electrode
and process
    72.
    发明授权
    EEPROM memory device having a sidewall spacer floating gate electrode and process 失效
    具有侧壁间隔物浮栅电极和工艺的EEPROM存储器件

    公开(公告)号:US5422504A

    公开(公告)日:1995-06-06

    申请号:US235994

    申请日:1994-05-02

    摘要: An EEPROM memory array includes a plurality of memory cells having a floating gate electrode (22) formed as a sidewall spacer adjacent to a control gate electrode (20). Source and drain regions (12, 14) reside in a semiconductor substrate (10) and define a segmented channel region (16) therebetween. A select gate electrode (18) overlies a first channel region (24) and separates the floating gate electrode (22) from the source region (12). The control gate electrode (20) overlies a third channel region (28) and separates the floating gate electrode (22) from the drain region (14). The floating gate electrode (22) overlies a second channel region (26) and is separated therefrom by a thin tunnel oxide layer (42). The EEPROM device of the invention can be programmed by either source side injection, or by Fowler-Nordheim tunneling. Additionally, a process is provided for the fabrication of an EEPROM array utilizing adjacent select gate electrodes (18, 18') as a doping mask.

    摘要翻译: EEPROM存储器阵列包括具有形成为与控制栅极(20)相邻的侧壁间隔的浮栅电极(22)的多个存储单元。 源极和漏极区域(12,14)驻留在半导体衬底(10)中并且在它们之间限定分割的沟道区域(16)。 选择栅极(18)覆盖在第一沟道区(24)上,并将浮栅电极(22)与源极区(12)分离。 控制栅电极(20)覆盖第三沟道区(28),并将浮栅电极(22)与漏区(14)分离。 浮栅电极(22)覆盖第二沟道区(26),并由薄隧道氧化物层(42)分离。 本发明的EEPROM装置可以通过源侧注入或通过Fowler-Nordheim隧道进行编程。 此外,提供了一种制造使用相邻的选择栅电极(18,18')作为掺杂掩模的EEPROM阵列的工艺。

    Self-aligned dual-bit split gate (DSG) flash EEPROM cell
    73.
    发明授权
    Self-aligned dual-bit split gate (DSG) flash EEPROM cell 失效
    自对准双位分闸(DSG)闪存EEPROM单元

    公开(公告)号:US5278439A

    公开(公告)日:1994-01-11

    申请号:US751499

    申请日:1991-08-29

    摘要: An EEPROM cell structure includes two floating gate transistors separated by a select gate transistor with the select transistor being shared by the two floating gate transistors in programming, reading, and erasing a floating gate transistor. The floating gates of the two transistors are formed from a first polysilicon layer, the control gates of the two transistors are formed from a second polysilicon layer, and the select gate is formed from a third doped polysilicon layer. The channel length of the select gate transistor is fully self-aligned to the floating gate transistors. A word line is formed over the control gates and forms the select gate. The word line runs generally perpendicular to bit lines which contact the drain regions of the two floating gate transistors. Accordingly, a virtual ground flash EEPROM memory array can be fabricated using the EEPROM cell structure.

    摘要翻译: EEPROM单元结构包括由选择栅极晶体管隔开的两个浮栅晶体管,在编程,读取和擦除浮栅晶体管时,选择晶体管由两个浮栅晶体管共享。 两个晶体管的浮置栅极由第一多晶硅层形成,两个晶体管的控制栅极由第二多晶硅层形成,并且选择栅极由第三掺杂多晶硅层形成。 选择栅极晶体管的沟道长度与浮置栅极晶体管完全自对准。 在控制门上形成一条字线,形成选择门。 字线通常垂直于与两个浮栅晶体管的漏极区接触的位线。 因此,可以使用EEPROM单元结构来制造虚拟地闪存EEPROM存储器阵列。

    Memory system with Fin FET technology
    75.
    发明授权
    Memory system with Fin FET technology 有权
    具有Fin FET技术的存储系统

    公开(公告)号:US08785268B2

    公开(公告)日:2014-07-22

    申请号:US11614815

    申请日:2006-12-21

    IPC分类号: H01L21/8238

    摘要: A method for manufacturing a memory system is provided including forming a charge-storage layer on a first insulator layer including insulating the charge-storage layer from a vertical fin, forming a second insulator layer from the charge-storage layer, and forming a gate over the second insulator includes forming a fin field effect transistor.

    摘要翻译: 提供了一种用于制造存储器系统的方法,包括在第一绝缘体层上形成电荷存储层,该第一绝缘体层包括从垂直鳍状物绝缘电荷存储层,从电荷存储层形成第二绝缘体层,并形成栅极 第二绝缘体包括形成鳍状场效应晶体管。