公开(公告)号：US20220149019A1

公开(公告)日：2022-05-12

申请号：US17541798

申请日：2021-12-03

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Michael Brandl ,  Andreas Dobner ,  Matthias Goldbach ,  Sebastian Wittmann ,  Uli Hiller ,  Markus Klein ,  Thomas Schwarz ,  Andreas Waldschik ,  Michael Wittmann ,  Matthias Bruckschloegl ,  Stefan Groetsch ,  Rainer Huber ,  Peter Brick ,  Ludwig Hofbauer

IPC: H01L25/075 ,  H01L33/46 ,  H01L33/62 ,  H01L33/64

Abstract: An optoelectronic device comprises a layer stack, which includes a carrier layer, a cover layer, and a first layer. The first layer is in particular an intermediate layer, arranged between the cover layer and the carrier layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the first layer and at least one layer of the layer stack and preferably all layers of the layer stack are at least partially transparent. The layer stack comprises at least one layer which comprises particles with a high thermal conductivity and/or at least one thermally conductive layer which is arranged between two adjacent layers of the layer stack.

公开(公告)号：US11114411B2

公开(公告)日：2021-09-07

申请号：US16345449

申请日：2017-10-25

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Jürgen Moosburger ,  Frank Singer

IPC: H01L23/00 ,  H01L33/00 ,  H01L21/67 ,  B65G47/90 ,  H01L21/683

Abstract: A method of transferring semiconductor chips includes providing a transfer tool having a plurality of segments, each segment having a liquid receiving area; providing a plurality of semiconductor chips in a regular array on a source carrier; providing a target carrier; selectively arranging liquid drops on the liquid receiving areas of some of the segments; causing the transfer tool to approach the source carrier, each liquid drop contacting and wetting a semiconductor chip; lifting the transfer tool from the source carrier, wherein semiconductor chips wetted by liquid drops are lifted from the source carrier by the transfer tool; causing the target carrier by the transfer tool, to approach the semiconductor chips arranged on the transfer tool contacting the target carrier; and lifting the transfer tool from the target carrier, the semiconductor chips contacting the target carrier remaining on the target carrier

公开(公告)号：US10861837B2

公开(公告)日：2020-12-08

申请号：US16467480

申请日：2017-12-19

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz

IPC: H01L25/16 ,  H01L25/075 ,  H01L33/62 ,  H01L33/64 ,  G09F9/302 ,  G09G3/32

Abstract: A video-wall module is disclosed. In an embodiment a video-wall module includes a printed-circuit board, a plurality of light-emitting diode chips arranged at the printed-circuit board, a circuit chip fixed to the printed-circuit board, wherein the circuit chip is connected with electrical connections of the light-emitting diode chips in order to electrically actuate the light-emitting diode chips and a housing for the circuit chip at least partially formed by the printed circuit board, wherein the light-emitting diode chips are divided into a first area and a first edge area surrounding the first area, and wherein the light-emitting diode chips in the first area comprise a smaller radiation wavelength than the light-emitting diode chips in the first edge area on average at the same temperature.

公开(公告)号：US10535806B2

公开(公告)日：2020-01-14

申请号：US15742106

申请日：2016-07-11

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Christian Leirer ,  Korbinian Perzlmaier ,  Anna Kasprzak-Zablocka ,  Berthold Hahn ,  Thomas Schwarz

IPC: H01L33/62 ,  H01L33/48 ,  H01L33/52 ,  H01L33/00 ,  H01L33/22 ,  H01L33/38 ,  H01L33/44 ,  H01L33/50 ,  H01L33/64

Abstract: A component includes a carrier having a front side facing towards a semiconductor body and a rear side facing away from the semiconductor body, each of which is formed at least in places by a surface of a shaped body, a metal layer contains a first sub-region and a second sub-region, wherein the first sub-region and the second sub-region adjoin the shaped body in a lateral direction, are electrically connectable in a vertical direction on the front side of the carrier, are assigned to different electrical polarities of the component and are thus configured to electrically contact the semiconductor body, and the carrier has a side face running perpendicularly or obliquely to the rear side of the carrier and is configured as a mounting surface of the component, wherein at least one of the sub-regions is electrically connectable via the side face and exhibits singulation traces.

公开(公告)号：US20190237443A1

公开(公告)日：2019-08-01

申请号：US16318279

申请日：2017-07-13

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Alexander Martin ,  Jürgen Moosburger ,  Karl Engl

IPC: H01L25/075

CPC classification number: H01L25/0753 ,  G09F9/00 ,  H01L33/62 ,  H01L2933/0091

Abstract: A module for a video wall includes a plurality of light-emitting components; and a carrier including conduction regions, wherein the light-emitting components each include a top side including a top-side contact and an underside including an underside contact, the light-emitting components are configured to emit electromagnetic radiation via the top side, the underside contacts of the light-emitting components electrically conductively connect to the conduction regions, the top-side contacts electrically contact a conductive layer, the light-emitting components each include at least four light-emitting semiconductor chips, the light-emitting semiconductor chips within a light-emitting component interconnect in parallel with one another, the light-emitting semiconductor chips within a light-emitting component each electrically conductively connect to the top-side contacts and the underside contacts of the light-emitting component, a plurality of adjacent light-emitting components constitute a cluster, and the light-emitting semiconductor chips of the light-emitting components of a cluster includes an identical nominal wavelength.

公开(公告)号：US10355174B2

公开(公告)日：2019-07-16

申请号：US15738427

申请日：2016-07-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Markus Maute ,  Lutz Höppel ,  Jürgen Moosburger ,  Thomas Schwarz ,  Matthias Sabathil ,  Ralph Wirth ,  Alexander Linkov ,  Johannes Baur

IPC: H01L33/20 ,  H01L33/24 ,  H01L33/30 ,  H01L33/38 ,  H01L33/40 ,  H01L33/46 ,  H01L33/60 ,  H01L33/62

Abstract: A component includes a carrier and a semiconductor body arranged on the carrier, wherein the semiconductor body has an active layer arranged between the first and second semiconductor layers and is configured to generate, during operation of the component, an electromagnetic radiation that can be coupled out from the component through a first main surface, the first main surface of the component has an electrical contact layer configured to electrically contact a first semiconductor layer and in a plan view the carrier covers the first main surface in places, and in direct vicinity of the electrical contact layer the component includes a shielding structure configured to prevent electromagnetic radiation generated by the active layer from impinging onto the contact layer.

公开(公告)号：US20190157247A1

公开(公告)日：2019-05-23

申请号：US16098212

申请日：2017-05-09

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Jürgen Moosburger ,  Frank Singer ,  Thomas Schwarz ,  Alexander Martin

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/62 ,  G09F9/302

Abstract: A module for a video wall is disclosed. In an embodiment a module includes a carrier, a plurality of components comprising at least one light-emitting structural element arranged on the carrier and an optical element, wherein the components are arranged at a prespecified lateral distance in relation to one another, wherein a retaining recess is formed between at least two components, wherein the retaining recess comprises at least two component recesses of two components which are arranged next to one another, wherein a retaining pin is fastened in the retaining recess, wherein the retaining pin is connected to the optical element, and wherein the optical element is configured to influence light irradiation onto the components and/or light emission from the components.

公开(公告)号：US20190155564A1

公开(公告)日：2019-05-23

申请号：US16314467

申请日：2017-06-30

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Frank Singer ,  Jürgen Moosburger ,  Karl Engl ,  Alexander Martin

IPC: G06F3/14 ,  G09G3/32

Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.

公开(公告)号：US20180358522A1

公开(公告)日：2018-12-13

申请号：US15771827

申请日：2016-10-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Thomas Schwarz ,  Stefan Listl ,  Björn Hoxhold ,  Frank Singer

IPC: H01L33/62 ,  H01L25/075 ,  H01L33/44 ,  H01L33/48 ,  H01L33/56 ,  H01L33/50 ,  H01L23/00

CPC classification number: H01L33/62 ,  G09F9/3026 ,  G09F9/33 ,  H01L24/48 ,  H01L25/0753 ,  H01L33/44 ,  H01L33/483 ,  H01L33/502 ,  H01L33/54 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2224/48139 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2933/0025 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2933/0091 ,  H01L2924/00014

Abstract: An optoelectronic component includes a carrier, and a housing material arranged above a top side of a carrier, wherein a cavity is configured in the housing material, a top side of a first optoelectronic semiconductor chip is arranged in the cavity, the first optoelectronic semiconductor chip has a first electrical connection pad arranged at the top side of the first optoelectronic semiconductor chip, and electrically conductively connects by a bond wire to a first contact pad arranged at the top side of the carrier, a first section of the bond wire is arranged in the cavity and a second section of the bond wire is embedded the housing material, a covering material is arranged in the cavity and covers at least one part of the top side of the first optoelectronic semiconductor chip, and the first section of the bond wire is embedded in the covering material.

公开(公告)号：US20180287022A1

公开(公告)日：2018-10-04

申请号：US15524413

申请日：2015-11-05

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Wolfgang Moench ,  Frank Singer ,  Thomas Schwarz ,  Jürgen Moosburger ,  Stefan Illek

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/62 ,  H02N1/00

CPC classification number: H01L33/58 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/56 ,  H01L33/62 ,  H01L2933/0058 ,  H02N1/006

Abstract: A method of producing an optoelectronic component includes embedding an optoelectronic component part into a molded body such that an upper side of the optoelectronic component part is at least partially exposed on an upper side of the molded body; arranging and structuring a sacrificial layer above the upper side of the optoelectronic component part and the upper side of the molded body; arranging and structuring a layer of an optical material above the sacrificial layer; and removing the sacrificial layer.