摘要:
A non-volatile semiconductor memory device has writing part (203, 205, 209) for writing data in a non-volatile memory cell in response to a write pulse, readout part (419) for reading out data stored in the memory cell, and verification part (207, 210; 417) for verifying to ensure that normal writing has been completed by reading data from the memory cell after each writing. The device repeats writings unless a normal writing can be confirmed by the verification part. At this time, the writing part can vary writing time and in a part of a sequence of repeating writing unless a normal writing can be confirmed, it sets writing time longer for the next writing action than that for one writing action. Since this setting is performed according to constant multiplication, constant increment, or constant multiplication of accumulated value, necessary time for obtaining normal data write can be reduced.
摘要:
A non-volatile semiconductor memory device comprises: a plurality of memory cells for electrically rewriting data; a programming and erasing section for executing data writing programs and data erasing operation for the memory cells; a verifying section for discriminating whether a data is written in or erased from one of the memory cells properly whenever data are written to or erased from the memory cells; and an automatic control section for enabling the programming and erasing section to execute the data writing program and erasing operation again whenever the verifying section discriminates that data is not properly written to or erased from one of the memory cells, the data writing program or erasing operation being executed repeatedly by the number of times less than a user-defined maximum program execution or erasing operation number applied externally from the outside of the memory device. Further, the number of data writing and erasing operations can be outputted to the outside of the chip. Therefore, it is possible to optimize the limit of the data writing operation according to the chip samples and to detect the deterioration status of he chip externally from the chip. The reliability of a system using the memory devices can be improved, and further the chip exchange timing can be indicated to the user.
摘要:
In reading data, data is transferred to data registers starting from a data read start address to the last address at a row (page), and data at the next page is transferred to the data registers starting from a start address to the last address at that page. These operations are repeated. In writing data from an intermediate address of a page, predetermined data is written in data registers not having write data. It is possible to read data at consecutive pages from a first predetermined column address to the page last address, and to read data at consecutive pages from a second predetermined column address to the page last address. For the data structure having a first data structure and a second data structure, it is possible to continuously read a set of data having both the first and second data structures and a set of data having only the second data structure, improving the efficiency of a system using a semiconductor memory device.
摘要:
There is disclosed an improved semiconductor memory device having a regular memory cell array and a spare memory cell array. Each spare memory cell constituting the spare memory cell array includes a first transistor selected by a read word line, whose drain is connected to a spare bit line and source is connected via a fuse to a power supply, and a second transistor connected between the interconnection between the first transistor and fuse and a ground. The fuse is selectively blown by flowing a blowing current through the fuse by selecting the second transistor through a write line to thereby disconnect a discharge current path of the spare bit line. The threshold voltage of the second transistor of the spare memory cell which is made conductive upon selection by the write line when the blowing current flows through the fuse is higher than a potential difference between a potential generated at the write line connected with another spare memory cell and a ground potential. Such a high threshold voltage is obtained by including in manufacture of the memory cell the steps of implanting impurity ions of a first conductivity type to the channel area of a region on the surface of a semiconductor substrate where transistors including the second transistor of a second conductivity type different from the first conductivity type are formed; and implanting impurity ions of the one conductivity type to the channel area of the second transistor and to the channel area of transistors of a conductivity type different from the second transistor; whereby the impurity ions are implanted twice to the channel area of the second transistor.
摘要:
A semiconductor memory device includes word lines selectively driven by a signal from a row decoder, memory cells connected to word lines, first and second data lines, a bit line connected to receive data from the memory cell and to supply received data to the first data lines, dummy cells connected to word lines, first and second dummy data lines, a dummy bit lines connected to receive data from the dummy memory cell and to supply received data to the first dummy data line, a data sensing circuit for generating an output signal corresponding to a potential difference between the second data line and second dummy data line, a first MOS transistor connected between the first and second data lines, a first load circuit for charging the second data line, a second MOS transistor connected between the first and second dummy data lines, and a second load circuit for charging the second dummy data lines. The memory device further includes a first equalizer circuit connected between the second data line and dummy data line and equalizing potentials at both ends during a predetermined period of time after the semiconductor memory device is set in the active mode, and a second equalizer circuit connected between the data line and dummy data line and equalizing potential as at both ends during a predetermined period of time after the memory device is set in the active mode.
摘要:
A main memory cell array is divided into a plurality of blocks, and a spare memory cell group is arranged apart from the main memory cell array. The spare memory cell group uses bit lines or word lines different from those of the main memory cell array and includes spare memory cells which are different in structure from the memory cells of the main memory cell array. The number of the memory cells of the spare memory cell group is the same as that of the main memory cells of one row or column in each block of the main memory cell array, and data can be programmed into the spare memory cells after the completion of the manufacturing process. The operation of programming data into the spare memory cells of the spare memory cell array is effected by use of a write-in address buffer and a write-in decoder. When a row or column including a defective memory cell is designated in the main memory cell array, the row or column of the spare memory cells in the spare memory cell group is activated.
摘要:
A semiconductor memory device comprising a first Electrically Erasable Programmable Read Only Memory (EEPROM) cell array, a first row decoder, a first column decoder, two second EEPROM arrays each having a storage area equal in capacity to the specified storage area defined in the first EEPROM array, a second row decoder, a second column decoder, and a majority logic circuit. The first row decoder and the first column decoder access one of the memory cells of the first EEPROM array. The second row decoder and the second column decoder access one of the memory cells of either the second EEPROM array when one of the memory cells of first EEPROM array is accessed. The majority logic circuit carries out a majority logic operation on the data items read from the accessed memory cell of the first EEPROM array and the data items read from the accessed memory cells of the second EEPROM arrays, thereby to determine which data item is to be read out to an external device.
摘要:
A semiconductor integrated circuit including delay means for generating an output signal delayed by a predetermined time with respect to an input signal when a logic level of said input signal changes in a first direction. The delay means receives a control signal and generates an internal control signal which is delayed by a predetermined time with respect to the control signal when a logic level of the control signal changes in a first direction, including a capacitor for delaying the control signal and a resistor having one end and having the other end connected to the capacitor.
摘要:
A semiconductor memory device comprises memory cell transistors each having a double layered gate having a floating gate and a control gate. The memory device comprises a transistor for receiving a predetermined voltage from a source external to the memory device and providing it as a reference voltage in response to a control signal, and a sense amplifier for comparing a voltage dependent on the data read from the memory cell with the reference voltage.
摘要:
A semiconductor integrated circuit includes a MOS transistor, and a transistor circuit in which one end of a current path is connected to a drain of this MOS transistor and which has an avalanche breakdown voltage lower than a breakdown voltage of the MOS transistor.