公开(公告)号：US20050275247A1

公开(公告)日：2005-12-15

申请号：US11147306

申请日：2005-06-08

申请人： Tetsuya Yamamoto ,  Asako Yoshinami

发明人： Tetsuya Yamamoto ,  Asako Yoshinami

IPC分类号： B62D25/08 ,  B60K37/00 ,  B62D25/14 ,  B62D65/14

CPC分类号： B62D65/14 ,  B62D25/147

摘要： A mounting structure for mounting a cockpit module onto a vehicle body on a side facing a vehicle compartment is provided with a mount member mounting a cockpit module onto a vehicle body, a resilient member disposed between the vehicle body and the cockpit module, and a guide mechanism guiding the cockpit module along a given transfer path when the cockpit module is transferred to a mount position of the vehicle body. The guide mechanism guides the cockpit module in a way to allow the cockpit module to move downward of the vehicle body in an oblique direction through at least a partial segment of the given transfer path such that an own weight of the cockpit module is allowed to apply on the resilient member to press the resilient member between the vehicle body and the cockpit module.

摘要翻译： 一种用于将驾驶舱模块安装在面向车厢的一侧的车身上的安装结构设置有将驾驶舱模块安装在车身上的安装构件，设置在车体和驾驶舱模块之间的弹性构件，以及引导件 当驾驶舱模块被转移到车体的安装位置时，沿着给定的传送路径引导驾驶舱模块的机构。 引导机构引导驾驶舱模块以允许驾驶舱模块通过给定传送路径的至少部分段沿倾斜方向向车身下方移动，使得允许驾驶舱模块的自重应用 在所述弹性构件上，以将所述弹性构件按压在所述车体和驾驶舱模块之间。

公开(公告)号：US20050261709A1

公开(公告)日：2005-11-24

申请号：US11133003

申请日：2005-05-19

申请人： Yuji Sakamoto ,  Satoshi Miyamoto ,  Norio Onishi ,  Tetsuya Yamamoto ,  Keita Suzuki

发明人： Yuji Sakamoto ,  Satoshi Miyamoto ,  Norio Onishi ,  Tetsuya Yamamoto ,  Keita Suzuki

IPC分类号： A61B17/04 ,  A61B17/10 ,  A61B17/12

CPC分类号： A61B17/12013 ,  A61B17/0467 ,  A61B17/0487 ,  A61B2017/0404 ,  A61B2017/045 ,  A61B2017/0458 ,  A61B2017/0464 ,  A61B2017/049 ,  A61B2017/0496

摘要： A medical treatment device includes a ligating member, a stopper and a ligation releasing member. The ligating member has a distal end portion and a proximal end portion, that ligates biological tissue. The stopper is provided to be movable forward or backward with respect to the ligating member, and stoppable by friction on the ligating member to maintain the biological tissue in a ligated state by the ligating member. The ligation releasing member is provided on the ligating member to release the ligation state between the ligating member and the stopper by moving the ligating member to the distal end side with respect to the stopper.

摘要翻译： 医疗处理装置包括结扎构件，止动件和结扎释放构件。 结扎构件具有连接生物组织的远端部分和近端部分。 止动器被设置成能够相对于结扎构件向前或向后移动，并且可以通过结扎构件上的摩擦而停止，以通过结扎构件将生物组织维持在连接状态。 连接释放构件设置在结扎构件上，以通过将结扎构件相对于止动件移动到远端侧来释放结扎构件和止动件之间的连接状态。

公开(公告)号：US06689122B2

公开(公告)日：2004-02-10

申请号：US09859846

申请日：2001-05-17

申请人： Tetsuya Yamamoto

发明人： Tetsuya Yamamoto

IPC分类号： A61B1728

CPC分类号： A61B10/06 ,  A61B2017/00845 ,  A61B2017/2901 ,  A61B2017/2902 ,  A61B2017/292

摘要： An endoscopic instrument of the present invention comprises a flexible insert section capable of being passed through a forceps channel of an endoscope, an operating wire located in a bore of the insert section and movable in the axial direction of the insert section, an operating section connected to the proximal end side of the insert section and used to move the operating wire forward and backward, and a treatment section attached to the distal end of the insert section and adapted to be operated as the operating wire is moved forward and backward. The operating wire is composed of at least one wire member, a resin member is located on or adhered to at least a part of the outer surface of the operating wire, at least the inner surface of the insert section is formed of a metallic coil, and a micro-flat portion is provided at least on that surface portion of an element wire of the coil which faces the operating wire.

摘要翻译： 本发明的内窥镜器具包括能够穿过内窥镜的钳子通道的柔性插入部分，位于插入部分的孔中并可在插入部分的轴向方向上移动的操作线，连接的操作部分 并且用于向前和向后移动操作线，以及附接到插入部分的远端并适于在操作线向前和向后移动时操作的处理部分。 操作线由至少一个线构件构成，树脂构件位于操作线的外表面的至少一部分上或者粘附到至少一部分操作线的外表面上，至少插入部的内表面由金属线圈形成， 并且至少在面向操作线的线圈的元件线的表面部分上设置微平坦部分。

公开(公告)号：US06569548B2

公开(公告)日：2003-05-27

申请号：US09920292

申请日：2001-08-02

申请人： Tetsuya Yamamoto ,  Ken Nakahara

发明人： Tetsuya Yamamoto ,  Ken Nakahara

IPC分类号： B32B900

CPC分类号： H01L31/02963 ,  H01L31/022483 ,  H01L31/1884 ,  Y02E10/50 ,  Y10T428/1059 ,  Y10T428/1064

摘要： An n-type dopant of at least one of elements of Group III such as Ga and the like and a p-type dopant of at least one of elements of Group V such as N and the like are doped to a ZnO crystalline layer as dopants, and the n-type dopant is more than the p-type dopant and doped into the ZnO layer in an impurity concentration of 1×1018 cm−3 or more. Therefore, it is possible to lower the resistivity of the ZnO layer with a degree of the transparency high and to obtain the transparent conductive film of zinc oxide having the electrical resistivity lower than ITO.

公开(公告)号：US06306526B1

公开(公告)日：2001-10-23

申请号：US09394798

申请日：1999-09-10

申请人： Tetsuya Yamamoto ,  Shigeki Kawamura ,  Sanae Taniguchi

发明人： Tetsuya Yamamoto ,  Shigeki Kawamura ,  Sanae Taniguchi

IPC分类号： B32B1501

CPC分类号： C22C11/10 ,  B23K35/268 ,  B32B15/01 ,  C22C11/06 ,  H01L23/04 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/09701 ,  Y10S428/926 ,  Y10T428/12222 ,  Y10T428/12431 ,  Y10T428/12701 ,  Y10T428/12951 ,  H01L2924/00

摘要： A metal lid for use in hermetic sealing of a semiconductor package comprises a lid body comprising a metal plate having a solder layer secured to the entire surface of the metal lid by cladding. The lid is placed in position on a substrate and can seal the resulting package by heating to melt the solder layer. The lid can be readily mass-produced and can seal the package with high seal reliability and without deposition of solder balls on the inner wall of the package.

摘要翻译： 用于半导体封装的气密密封的金属盖包括盖体，其包括金属板，该金属板具有通过包层固定在金属盖的整个表面上的焊料层。 将盖子放置在基板上的适当位置，并且可以通过加热来密封所得到的封装以熔化焊料层。 盖可以容易地批量生产并且可以以高密封可靠性密封包装，并且不会在包装的内壁上沉积焊球。

公开(公告)号：US06284568B1

公开(公告)日：2001-09-04

申请号：US09365230

申请日：1999-07-30

申请人： Tetsuya Yamamoto

发明人： Tetsuya Yamamoto

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L21/4853 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05572 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00014

摘要： A method for producing a semiconductor device, comprises the steps of: introducing a plurality of semiconductor element supporting substrates or semiconductor elements into a conductive-ball attaching system for collectively attaching conductive balls onto the supporting substrates or semiconductor elements; detecting the position of a defective substrate or defective semiconductor element of the introduced semiconductor element supporting substrates or semiconductor elements, or an undesired position, at which it is not necessary to load the conductive balls; vacuum holding a plurality of conductive balls, which are stored in the conductive-ball attaching system, by conductive-ball holding means; and selectively attaching the plurality of conductive balls, which are vacuum-held by the conductive-ball holding means, onto a desired supporting substrate or semiconductor element of the supporting substrates or semiconductor elements introduced into the conductive-ball attaching system, wherein the conductive-ball holding means selectively vacuum holds the conductive balls so that just enough conductive balls are attached onto the peripheral portion of a wafer, on which semiconductor elements are irregularly arranged, and so that the conductive balls are not attached onto the defective supporting substrate or defective semiconductor element. Thus, it is possible to provide a method for producing a semiconductor device, which is able to load conductive balls onto BGA substrates or semiconductor elements capable of selectively holding the conductive balls so that just enough conductive balls are attached onto the peripheral portion of a wafer, on which the semiconductor elements are irregularly arranged, and so that the conductive balls are not attached onto defective BGA substrates or semiconductor elements.

摘要翻译： 一种制造半导体器件的方法，包括以下步骤：将多个半导体元件支撑衬底或半导体元件引入到导电球附着系统中，以将导电球共同地附着在支撑衬底或半导体元件上; 检测引入的半导体元件支撑衬底或半导体元件的缺陷衬底或缺陷半导体元件的位置，或不需要负载导电球的不期望位置; 通过导电球保持装置真空保持存储在导电球附着系统中的多个导电球; 并且将由导电球保持装置真空保持的多个导电球选择性地附接到引导到导电球附着系统中的支撑衬底或半导体元件的期望的支撑衬底或半导体元件上，其中， 球保持装置选择性地真空保持导电球，使得刚好足够的导电球附着到半导体元件不规则排列的晶片的周边部分上，并且导电球不附着到有缺陷的支撑衬底或有缺陷的半导体 元件。 因此，可以提供一种制造半导体器件的方法，该半导体器件能够将导电球加载到能够选择性地保持导电球的BGA基板或半导体元件上，使得足够的导电球附着到晶片的周边部分上 其上半导体元件不规则地布置，并且使得导电球不附着到有缺陷的BGA衬底或半导体元件上。

公开(公告)号：US06224820B1

公开(公告)日：2001-05-01

申请号：US09412523

申请日：1999-10-05

申请人： Yoshitaka Sawa ,  Tetsuya Yamamoto ,  Kanji Takeda ,  Hiroshi Itaya

发明人： Yoshitaka Sawa ,  Tetsuya Yamamoto ,  Kanji Takeda ,  Hiroshi Itaya

IPC分类号： C22B1216

CPC分类号： F27D3/12 ,  C21B13/0006 ,  C21B13/10 ,  C21B2100/44 ,  C21B2100/66 ,  C22B1/216 ,  C22B5/10 ,  F27B9/16 ,  F27B9/36 ,  F27D7/06 ,  F27M2001/18 ,  F27M2002/04 ,  F27M2003/13 ,  F27M2003/165 ,  Y02P10/216

摘要： A traveling hearth for producing reduced metal by charging and stacking a raw material containing a metal-containing material and a solid-reducing material on a horizontally moving hearth, arranged for disposing a solid-reducing material layer on the hearth, forming concave portions at the solid-reducing material surface, stacking the raw material on the surface of the solid-reducing material layer, reducing the raw material by at least once heating and melting the material on the hearth to separate metal and gangue and ash ingredients, and discharging metal from the hearth.

摘要翻译： 一种用于通过在包含含金属的材料和固体还原材料的原料上充填和堆叠在水平移动的炉床上堆放固态还原材料层而在炉床上形成凹陷部分而形成还原金属的行进炉床 固体还原材料表面，将原料堆叠在固体还原材料层的表面上，通过至少一次加热和熔化炉床上的材料来还原原料，以分离金属和ang石和灰份成分，并将金属从 炉膛

公开(公告)号：US06222972B1

公开(公告)日：2001-04-24

申请号：US09101919

申请日：1998-07-20

申请人： Tetsuya Yamamoto ,  Shoshiro Taneichi ,  Hisaaki Kobayashi

发明人： Tetsuya Yamamoto ,  Shoshiro Taneichi ,  Hisaaki Kobayashi

IPC分类号： G02B602

CPC分类号： G02B6/03633 ,  G02B1/048 ,  G02B6/02033

摘要： Disclosed is a plastic-clad optical fiber (PCF) comprising a quartz core and a polymer clad as tightly formed around the core, in which the clad has a multi-layered structure of a plurality of different polymers, and the refractive index of the core (nCO), that of the first clad as tightly formed around the core (nCL1) and that of the second clad as tightly formed over the first clad (nCL2) satisfy both 0.21 ≦(nCO2−nCL12)≦0.35 and nCL2

摘要翻译： 公开了一种塑料包覆光纤（PCF），其包括石英芯和围绕芯紧密形成的聚合物，其中包层具有多个不同聚合物的多层结构，并且芯的折射率 （nCO2）的紧密形成的第一包层（nCL1）和紧密形成在第一包层（nCL2）上的第二包层的第一包层满足0.21 <=（nCO2-nCL12）≤0.35和nCL2 < nCL1。 这是一种宽带PCF，与压接式连接器相比，减少了损耗，减少了弯曲损耗，并且随着温度变化而降低了传输损耗。 因此，该PCF在构建ATM-LAN，高速以太网等方面作为光信息传输材料是有用的

公开(公告)号：US6159546A

公开(公告)日：2000-12-12

申请号：US807756

申请日：1997-02-27

申请人： Tetsuya Yamamoto ,  Akio Naka ,  Yukiko Nishio

发明人： Tetsuya Yamamoto ,  Akio Naka ,  Yukiko Nishio

IPC分类号： B05D1/26 ,  B05D7/04 ,  C08J7/04 ,  C09D179/02 ,  B05D3/02 ,  B05D3/12

CPC分类号： C08J7/047 ,  B05D1/265 ,  B05D7/04 ,  C08J2479/00 ,  C09D179/02

摘要： A process for producing a coated film continuously, comprises the steps of:running a substrate film; andextruding a coating composition having a viscosity of 0.1 to 100 cps at 20.degree. C. through a slit of a die onto a surface of the substrate film to produce a coating layer having a thickness of 0.1 to 20 .mu.m over the substrate film. According to the present invention, it is possible to produce a coated film continuously at high speed, using a coating material having a viscosity as low as water or a coating material with a problem of deterioration due to the exposure to the air, thereby producing a coating layer over the substrate film to a uniform thickness.

摘要翻译： 一种连续生产涂膜的方法，包括以下步骤：运行基底膜; 并在20℃下将粘度为0.1〜100cps的涂料组合物通过模具的狭缝挤出到基材膜的表面上，以在基材膜上产生厚度为0.1-20μm的涂层。 根据本发明，可以使用粘度低于水的涂料或具有由于暴露于空气而劣化的问题的涂料的高速连续地制备涂膜，从而生产 涂层在均匀的厚度上。

公开(公告)号：US6153895A

公开(公告)日：2000-11-28

申请号：US341314

申请日：1999-07-08

申请人： Takayuki Watanabe ,  Tetsuya Yamamoto ,  Hiroshi Yoshida

发明人： Takayuki Watanabe ,  Tetsuya Yamamoto ,  Hiroshi Yoshida

IPC分类号： C30B29/46 ,  H01L31/032 ,  H01L31/0336 ,  H01L31/04 ,  H01L33/28 ,  H01L33/32 ,  H01L33/42 ,  H01L31/072 ,  H01L31/0328 ,  H01L31/109

CPC分类号： H01L31/0749 ,  H01L31/0322 ,  H01L31/0323 ,  Y02E10/541 ,  Y02P70/521

摘要： A p-type semiconductor composed basically of an Ib-IIIb-VIb.sub.2 group compound semiconductor (especially CuInS.sub.2) which is improved in carrier concentration and has advantages in manufacture and performance. In order to obtain the p-type semiconductor mentioned above, p-type CuInS.sub.2 is formed by adding both P (p-type impurity) and Sn (n-type impurity) to CuInS.sub.2. The carrier concentration of the p-type semiconductor is 5.times.10.sup.17 cm.sup.-3 which is larger than the value (5.times.10.sup.16 cm.sup.-3) obtained when P and In are added or another value (3.times.10.sup.15 cm.sup.-3) obtained when only P is added. A thin film solar cell characterized by a glass substrate (2), an Mo electrode (1), a p-type semiconductor layer (3), an n-type semiconductor layer composed of a CdS layer (4), and an ITO electrode (5) is manufactured by using the CuInS.sub.2 layer containing P and Sn as the p-type semiconductor (3). It is confirmed that the conversion efficiency of the solar battery is as high as 12%.

摘要翻译： PCT No.PCT / JP97 / 02829 Sec。 371日期：1999年7月8日 102（e）1999年7月8日PCT PCT 1997年8月14日PCT公布。 出版物WO98 / 33219 日期1998年7月30日一种基本上由Ib-IIIb-VIb2族化合物半导体（特别是CuInS 2）组成的p型半导体，其载流子浓度提高，并且具有制造和性能的优点。 为了获得上述p型半导体，通过向CuInS2添加P（p型杂质）和Sn（n型杂质）来形成p型CuInS2。 p型半导体的载流子浓度为5×10 17 cm -3以上，其比添加P和In时获得的值（5×10 16 cm -3）大，或者仅添加P时获得的另外的值（3×10 15 cm -3）。 一种薄膜太阳能电池，其特征在于，具有玻璃基板（2），Mo电极（1），p型半导体层（3），由CdS层（4）构成的n型半导体层和ITO电极 （5）通过使用含有P和Sn作为p型半导体（3）的CuInS 2层来制造。 确认太阳能电池的转换效率高达12％。